Footprints
81 footprints matching “WSON”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WSON-14-1EP_4.0x4.0mm_P0.5mm_EP2.6x2.6mm
Package_SON
14-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf
- Pads
- 15
- SMD
- 4.9×4.5
- Boards
- 2
WSON-8-1EP_3x2.5mm_P0.5mm_EP1.2x1.5mm_PullBack_ThermalVias
Package_SON
WSON, 8 Pin (http://www.ti.com/lit/ml/mpds400/mpds400.pdf)
- Pads
- 9
- SMD
- 3.5×3.0
- Boards
- 2
WSON-8-1EP_4x4mm_P0.8mm_EP2.6x3mm
Package_SON
WSON, 8 Pin (https://www.ti.com/lit/ds/symlink/lp2951-n.pdf#page=43)
- Pads
- 9
- SMD
- 5.3×4.5
- Boards
- 2
Texas_DSC0010J_ThermalVias
Package_SON
3x3mm Body, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 1
Texas_S-PWSON-N10
Package_SON
3x3mm Body, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf
- Pads
- 11
- SMD
- 4.3×4.1
- Boards
- 1
WSON-12-1EP_3x3mm_P0.5mm_EP1.5x2.5mm_ThermalVias
Package_SON
WSON, 12 Pin (https://www.ti.com/lit/ds/symlink/tps63710.pdf#page=33)
- Pads
- 13
- SMD
- 4.3×3.5
- Boards
- 1
WSON-12-1EP_4x4mm_P0.5mm_EP2.6x3mm_ThermalVias
Package_SON
WSON, 12 Pin (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=62)
- Pads
- 13
- SMD
- 5.3×4.5
- Boards
- 1
WSON-8-1EP_3x2.5mm_P0.5mm_EP1.2x1.5mm_PullBack
Package_SON
WSON, 8 Pin (http://www.ti.com/lit/ml/mpds400/mpds400.pdf)
- Pads
- 9
- SMD
- 3.5×3.0
- Boards
- 1
WSON-8-1EP_4x4mm_P0.8mm_EP1.98x3mm
Package_SON
WSON, 8 Pin (https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=34)
- Pads
- 9
- SMD
- 5.3×4.5
- Boards
- 1
WSON-10-EP-TI-2x3
agg-agg
- Pads
- 11
- SMD
- 2.9×3.5
- Boards
- —
WSON-8-EP-6x5
agg-agg
- Pads
- 9
- SMD
- 7.7×5.5
- Boards
- —
WSON-8-EP-TI
agg-agg
- Pads
- 9
- SMD
- 2.9×2.5
- Boards
- —
TI WSON-8 DSG0008A
celestial-altium-Leadless_DFN
DFN, 8-Leads, Body 2.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.90x1.60mm, IPC Medium Density
- Pads
- 9
- SMD
- 2.8×2.4
- Boards
- —
TI WSON-8 NGT
celestial-altium-Leadless_DFN
DFN, 8-Leads, Body 4.00x4.00mm, Pitch 0.80mm, Thermal Pad 3.00X2.6mm, IPC Medium Density
- Pads
- 9
- SMD
- 5.0×4.5
- Boards
- —
MICROCHIP WSON-8 6x5mm
celestial-altium-Leadless_SON
SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density
- Pads
- 9
- SMD
- 7.2×5.6
- Boards
- —
SPANSION WSON-8 6x5MM
celestial-altium-Leadless_SON
SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.00x3.40mm, IPC Medium Density
- Pads
- 9
- SMD
- 7.2×5.6
- Boards
- —
SPANSION WSON-8 6x8MM
celestial-altium-Leadless_SON
SON, 8-Leads, Body 6.00x8.00mm, Pitch 1.27mm, Thermal Pad 4.80x5.80mm, IPC Medium Density
- Pads
- 9
- SMD
- 9.2×6.6
- Boards
- —
TI PWSON-10 DPR
celestial-altium-Leadless_SON
SON, 10-Leads, Body 4.0x4.00mm, Pitch 0.80mm, Thermal Pad 3.00x2.6mm, IPC Medium Density
- Pads
- 11
- SMD
- 5.2×4.4
- Boards
- —
TI PWSON-10 DSQ
celestial-altium-Leadless_SON
DFN, 10-Leads, Body 2.00x2.00mm, Pitch 0.40mm, Thermal Pad 0.70x1.20mm, IPC Medium Density
- Pads
- 11
- SMD
- 3.2×3.2
- Boards
- —
TI WSON-10 DQC
celestial-altium-Leadless_SON
WSON, 10-Leads, Body 2.00x3.00mm, Pitch 0.50mm, Thermal Pad 0.84x2.40mm, IPC Medium Density
- Pads
- 11
- SMD
- 3.2×4.2
- Boards
- —
TI WSON-10 DSC
celestial-altium-Leadless_SON
SON, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.65x2.40mm, IPC Medium Density
- Pads
- 11
- SMD
- 3.8×3.8
- Boards
- —
TI WSON-10 SD
celestial-altium-Leadless_SON
DFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.20x2.00mm, IPC Medium Density
- Pads
- 11
- SMD
- 4.2×4.2
- Boards
- —
TI WSON-12 DNT
celestial-altium-Leadless_SON
WSON, 12-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.60x3.00mm, IPC Medium Density
- Pads
- 13
- SMD
- 5.2×5.2
- Boards
- —
TI WSON-12 DRR0012G
celestial-altium-Leadless_SON
WSON, 12-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.30x2.50mm
- Pads
- 13
- SMD
- 4.0×3.6
- Boards
- —
