Footprints

284 footprints matching “chip”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

284 footprints · page 2 of 12

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Analog_LCC-8_5x5mm_P1.27mm

FP3D

Package_LCC

LCC, ceramic leaded chip carrier, 8 pins, surface mount, Analog Devices LS8, 5x5mm, height 1.45mm, https://www.analog.com/media/en/technical-documentation/data-sheets/ltc6655-6655ln.pdf

Pads: 8
SMD: 6.3×6.4
Boards: 4

TQFP-80_12x12mm_P0.5mm

FP3D

Package_QFP

TQFP, 80 Pin (JEDEC MS-026 variation ADD, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/aemDocuments/documents/package-outline-drawings/c04-00092c.pdf)

Pads: 80
SMD: 15.3×15.3
Boards: 4

R_Array_Concave_2x0603

FP3D

Resistor_SMD

Thick Film Chip Resistor Array, Wave soldering, Vishay CRA06P (see cra06p.pdf)

Pads: 4
SMD: 3.1×2.1
Boards: 4

R_Array_Convex_5x0603

FP3D

Resistor_SMD

Chip Resistor Network, ROHM MNR15 (see mnr_g.pdf)

Pads: 10
SMD: 3.1×3.9
Boards: 4

Microchip_RN4871

FP—

RF_Module

Microchip RN4871 footprint

Pads: 16
SMD: 10.7×12.7
Boards: 4

LFCSP-32-1EP_5x5mm_P0.5mm_EP3.25x3.25mm

FP—

Package_CSP

32-Lead Frame Chip Scale Package LFCSP (5mm x 5mm); (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-32/CP_32_27.pdf

Pads: 33
SMD: 6.0×6.0
Boards: 3

TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads: 45
SMD: 13.3×13.3
Boards: 3

R_Array_Convex_5x1206

FP3D

Resistor_SMD

Chip Resistor Network, ROHM MNR35 (see mnr_g.pdf)

Pads: 10
SMD: 4.4×6.9
Boards: 3

Quectel_L96

FP—

RF_GPS

Quectel L96 GPS GLONASS Galileo BeiDou Module, internal chip antenna, https://static6.arrow.com/aropdfconversion/50213b4bc5cb920911b62909a5ca765b1c5ab3d1/quectel_l96_hardware_design_v1.2.pdf

Pads: 31
SMD: 13.8×17.1
Boards: 3

L_CommonModeChoke_Murata_DLW5BTMxxxSQ2x_5x5mm

FP—

Inductor_SMD

Wire Wound Chip Common Mode Choke Coil SMD, Murata DLW5BTxxxSQ2x, https://www.murata.com/products/productdata/8796762701854/EFLC0020.pdf, manual footprint

Pads: 4
SMD: 5.5×6.0
Boards: 1