Footprints

70 footprints matching “exposed”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

70 footprints · page 2 of 3

Matched by name and keywords. Search by meaning instead

AD MSOP-12 4x3MM MSE

FP—

celestial-altium-Leaded_MSOP

MSE Package 12-Lead Plastic MSOP, Exposed Die Pad

Pads: 13
SMD: 5.8×4.6
Boards: —

LTC MSOP-16 MSE16

FP—

celestial-altium-Leaded_SOP

16-Lead Plastic MSOP, Exposed Die Pad

Pads: 17
SMD: 6.0×4.4
Boards: —

SILICON LABS DFN-6 3x3MM

FP—

celestial-altium-Leadless_DFN

Temperature Sensor Digital - Local -40°C ~ 125°C, 6 Leads, Body 3x3mm, Package 6-VFDFN Exposed Pad

Pads: 7
SMD: 4.2×3.4
Boards: —

ESP32-C6-DevKitC-1

FP—

espressif-Espressif

ESP32-C6 general-purpose development board, based on ESP32-2-WROOM-1,It has all the ESP32-C6 pins exposed and is easy to connect and use.

Pads: 32
THT: 25.4×51.3
Boards: —

ESP32-C6-DevKitM-1

FP—

espressif-Espressif

ESP32-C6 general-purpose development board, based on ESP32-2-WROOM-1,It has all the ESP32-C6 pins exposed and is easy to connect and use.

Pads: 30
THT: 25.1×47.9
Boards: —

ESP32-S2-DevKitC-1

FP—

espressif-Espressif

ESP32-S2 general-purpose development board, based on ESP32-S2-SOLO or ESP32-S2-SOLO-U,It has all the ESP32-S2 pins exposed and is easy to connect and use.

Pads: 44
THT: 25.4×63.4
Boards: —

ESP32-S3-DevKitC

FP—

espressif-Espressif

ESP32-S3 general-purpose development board, based on ESP32-S3-WROOM-1 or ESP32-S3-WROOM-1U,It has all the ESP32-S3 pins exposed and is easy to connect and use.

Pads: 44
THT: 25.4×63.4
Boards: —

Analog_LFCSP-8-1EP_3x3mm_P0.5mm_EP1.53x1.85mm

FP—

Package_CSP

LFCSP, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf)

Pads: 5
SMD: 4.0×3.5
Boards: —

LFCSP-VQ-24-1EP_4x4mm_P0.5mm_EP2.642x2.642mm

FP—

Package_CSP

LFCSP VQ, 24 pin, exposed pad, 4x4mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf)

Pads: 25
SMD: 5.1×5.1
Boards: —

LFCSP-VQ-48-1EP_7x7mm_P0.5mm

FP—

Package_CSP

LFCSP VQ, 48 pin, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html)

Pads: 49
SMD: 8.1×8.1
Boards: —

MLPQ-16-1EP_4x4mm_P0.65mm_EP2.8x2.8mm

FP—

Package_DFN_QFN

Micro Leadframe Package, 16 pin with exposed pad

Pads: 17
SMD: 5.3×5.3
Boards: —

UDC-QFN-20-4EP_3x4mm_P0.5mm_EP0.41x0.25mm

FP—

Package_DFN_QFN

UDC QFN, 20 Pin, Exposed Pad Variation AB (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081536_B_UDC20(AB).pdf), modifed from generated QFN-20-1EP_3x4mm_P0.5

Pads: 24
SMD: 4.3×5.3
Boards: —

VQFN-28-1EP_5x5mm_P0.5mm_EP3.7x3.7mm

FP—

Package_DFN_QFN

VQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation VHHD-3 and exposed pad nominal size from ADI Trinamic / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/technical-documentation/data-sheets/TMC2209_datasheet_rev1.09.pdf#page=83)

Pads: 29
SMD: 6.2×6.2
Boards: —

VQFN-28-1EP_5x5mm_P0.5mm_EP3.7x3.7mm_ThermalVias

FP—

Package_DFN_QFN

Pads: 29
SMD: 6.2×6.2
Boards: —

VQFN-48-1EP_7x7mm_P0.5mm_EP2.6x2.6mm

FP—

Package_DFN_QFN

VQFN, 48 Pin (Based on JEDEC MO-220 variation VKKD-2 (using Figure 1), custom Exposed Pad from STMicroeletronics, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, https://www.st.com/resource/en/datasheet/stspin32f0a.pdf#page=37)

Pads: 49
SMD: 8.3×8.3
Boards: —

VQFN-48-1EP_7x7mm_P0.5mm_EP2.6x2.6mm_ThermalVias

FP—

Package_DFN_QFN

Pads: 49
SMD: 8.3×8.3
Boards: —

VQFN-48-1EP_7x7mm_P0.5mm_EP4.2x4.2mm

FP—

Package_DFN_QFN

VQFN, 48 Pin (Based on JEDEC MO-220 variation VKKD-2 (using Figure 1), custom Exposed Pad from NXP, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, https://www.nxp.com/docs/en/package-information/SOT619-28.pdf)

Pads: 49
SMD: 8.3×8.3
Boards: —

VQFN-48-1EP_7x7mm_P0.5mm_EP4.2x4.2mm_ThermalVias

FP—

Package_DFN_QFN

Pads: 49
SMD: 8.3×8.3
Boards: —

WDFN-6-2EP_4.0x2.6mm_P0.65mm

FP—

Package_DFN_QFN

WDFN, 6 pin, 4.0x2.6, 0.65P; Two exposed pads, (https://www.onsemi.com/pub/Collateral/511BZ.PDF)

Pads: 8
SMD: 4.7×3.1
Boards: —

WDFN-8_2x2mm_P0.5mm

FP—

Package_DFN_QFN

DFN8 2x2, 0.5P; No exposed pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF)

Pads: 8
SMD: 2.8×2.5
Boards: —

WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias

FP3D

Package_DFN_QFN

WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)

Pads: 21
SMD: 5.3×5.3
Boards: —

WQFN-28-1EP_4x4mm_P0.4mm_EP2.7x2.7mm_ThermalVias

FP—

Package_DFN_QFN

WQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation WGGE and exposed pad from Maxim / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf)

Pads: 29
SMD: 5.3×5.3
Boards: —

WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm

FP3D

Package_DFN_QFN

WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)

Pads: 39
SMD: 6.2×8.2
Boards: —

WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm_ThermalVias

FP3D

Package_DFN_QFN

Pads: 39
SMD: 6.2×8.2
Boards: —