Footprints
112 footprints matching “flat”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
LED_D2.0mm_W4.0mm_H2.8mm_FlatTop
LED_THT
LED, Round, Flat Top, Rectangular, size 4.0x2.8mm, diameter 2.0mm, 2 pins, https://www.kingbright.com/attachments/file/psearch/000/00/00/L-1034IDT(Ver.14A).pdf, generated by kicad-footprint-generator
- Pads
- 2
- THT
- 4.8×3.4
- Boards
- 7
ST_UFQFPN-20_3x3mm_P0.5mm
Package_DFN_QFN
UFQFPN 20-lead, 3 x 3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf)
- Pads
- 20
- SMD
- 3.5×3.5
- Boards
- 6
Valve_ECC-83-2
Valve
Valve ECC-83-2 flat pins
- Pads
- 9
- THT
- 21.0×21.0
- Boards
- 6
L_Wuerth_HCI-5040
Inductor_SMD
Inductor, Wuerth, HCI-5040, 5.5x5.3x4.0mm, (https://www.we-online.com/components/products/datasheet/744316022.pdf)
- Pads
- 2
- SMD
- 6.5×5.8
- Boards
- 5
TDFN-8-1EP_3x2mm_P0.5mm_EP1.80x1.65mm
Package_DFN_QFN
8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 5
L_Wuerth_HCI-1350
Inductor_SMD
Inductor, Wuerth, HCI-1350, 12.8x12.8x4.7mm, (https://www.we-online.com/components/products/datasheet/744355019.pdf)
- Pads
- 2
- SMD
- 15.5×13.3
- Boards
- 4
Pin_D1.3mm_L11.3mm_W2.8mm_Flat
Connector_Pin
solder Pin_ with flat with hole, hole diameter 1.3mm, length 11.3mm, width 2.8mm
- Pads
- 1
- THT
- 3.8×3.6
- Boards
- 3
Diode_Bridge_Vishay_DFSFlat
Diode_SMD
SMD diode bridge Low Profile DFS "Flat", see http://www.vishay.com/docs/88874/dfl15005.pdf
- Pads
- 4
- SMD
- 11.2×8.9
- Boards
- 3
DFN-12-1EP_3x3mm_P0.5mm_EP2.05x2.86mm
Package_DFN_QFN
10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 13
- SMD
- 4.3×3.6
- Boards
- 3
DFN-S-8-1EP_6x5mm_P1.27mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 7.2×5.7
- Boards
- 3
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- 3
TO-92_Inline_W4.0mm_Horizontal_FlatSideDown
Package_TO_SOT_THT
TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)
- Pads
- 3
- THT
- 5.1×10.1
- Boards
- 3
Pin_D1.2mm_L11.3mm_W3.0mm_Flat
Connector_Pin
solder Pin_ with flat with hole, hole diameter 1.2mm, length 11.3mm, width 3.0mm
- Pads
- 1
- THT
- 4.0×3.4
- Boards
- 2
Pin_D1.3mm_L10.0mm_W3.5mm_Flat
Connector_Pin
solder Pin_ with flat with hole, hole diameter 1.3mm, length 10.0mm, width 3.5mm, e.g. Ettinger 13.13.865, https://katalog.ettinger.de/#p=434
- Pads
- 1
- THT
- 4.5×3.6
- Boards
- 2
L_Wuerth_HCI-7030
Inductor_SMD
Inductor, Wuerth, HCI-7030, 6.9x6.9x3.0mm, (https://www.we-online.com/components/products/datasheet/744310013.pdf)
- Pads
- 2
- SMD
- 8.3×7.4
- Boards
- 2
L_Wuerth_HCI-7040
Inductor_SMD
Inductor, Wuerth, HCI-7040, 6.9x6.9x3.8mm, (https://www.we-online.com/components/products/datasheet/744311022.pdf)
- Pads
- 2
- SMD
- 8.3×7.4
- Boards
- 2
DFN-14-1EP_3x4.5mm_P0.65mm_EP1.65x4.25mm
Package_DFN_QFN
14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf)
- Pads
- 15
- SMD
- 4.4×5.0
- Boards
- 2
Microsemi_QFN-40-32-2EP_6x8mm_P0.5mm
Package_DFN_QFN
40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package - 6x8x0.9mm Body (https://www.microsemi.com/document-portal/doc_download/131677-pd70224-data-sheet)
- Pads
- 34
- SMD
- 6.9×8.9
- Boards
- 2
QFN-64-1EP_9x9mm_P0.5mm_EP7.35x7.35mm
Package_DFN_QFN
64-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 65
- SMD
- 10.3×10.3
- Boards
- 2
UQFN-16-1EP_3x3mm_P0.5mm_EP1.75x1.75mm
Package_DFN_QFN
16-Lead Ultra Thin Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 2
WSON-14-1EP_4.0x4.0mm_P0.5mm_EP2.6x2.6mm
Package_SON
14-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf
- Pads
- 15
- SMD
- 4.9×4.5
- Boards
- 2
Pin_D1.1mm_L10.2mm_W3.5mm_Flat
Connector_Pin
solder Pin_ with flat with hole, hole diameter 1.1mm, length 10.2mm, width 3.5mm
- Pads
- 1
- THT
- 4.5×3.2
- Boards
- 1
Pin_D1.2mm_L10.2mm_W2.9mm_FlatFork
Connector_Pin
solder Pin_ with flat with fork, hole diameter 1.2mm, length 11.3mm, width 3.0mm
- Pads
- 1
- THT
- 3.9×3.4
- Boards
- 1
L_Wuerth_HCI-1030
Inductor_SMD
Inductor, Wuerth, HCI-1030, 10.6x10.6x2.8mm, (https://www.we-online.com/components/products/datasheet/744323020.pdf)
- Pads
- 2
- SMD
- 12.0×11.1
- Boards
- 1