Footprints
1,939 footprints matching “leaded”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
DIP-28_W15.24mm_Socket
Package_DIP
28-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket
- Pads
- 28
- THT
- 18.3×36.2
- Boards
- 133
DIP-6_W7.62mm
Package_DIP
6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 6
- THT
- 9.7×8.1
- Boards
- 119
TO-92_HandSolder
Package_TO_SOT_THT
TO-92 leads molded, narrow, drill 0.75mm, handsoldering variant with enlarged pads (see NXP sot054_po.pdf)
- Pads
- 3
- THT
- 5.5×5.1
- Boards
- 117
TSSOP-8_3x3mm_P0.65mm
Package_SO
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)
- Pads
- 8
- SMD
- 5.9×3.6
- Boards
- 111
LQFP-144_20x20mm_P0.5mm
Package_QFP
LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)
- Pads
- 144
- SMD
- 23.3×23.3
- Boards
- 104
DIP-20_W7.62mm_Socket_LongPads
Package_DIP
20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 20
- THT
- 10.7×26.0
- Boards
- 100
TO-92L_Inline_Wide
Package_TO_SOT_THT
TO-92L leads in-line (large body variant of TO-92), also known as TO-226, wide, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf)
- Pads
- 3
- THT
- 7.1×4.6
- Boards
- 100
DIP-18_W7.62mm
Package_DIP
18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 18
- THT
- 9.7×23.4
- Boards
- 99
DIP-40_W15.24mm_Socket_LongPads
Package_DIP
40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads
- Pads
- 40
- THT
- 18.3×51.4
- Boards
- 99
PLCC-44_THT-Socket
Package_LCC
PLCC, 44 pins, through hole
- Pads
- 44
- THT
- 24.5×24.5
- Boards
- 96
SW_Tactile_SPST_NO_Straight_CK_PTS636Sx25SMTRLFS
Button_Switch_SMD
Tactile switch, SPST, 6.0x3.5 mm, H2.5 mm, straight, NO, gull wing leads: https://www.ckswitches.com/media/2779/pts636.pdf
- Pads
- 2
- SMD
- 9.5×4.2
- Boards
- 90
WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 87
TO-92L_HandSolder
Package_TO_SOT_THT
TO-92L leads in-line (large body variant of TO-92), also known as TO-226, wide, drill 0.75mm, hand-soldering variant with enlarged pads (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf)
- Pads
- 3
- THT
- 5.5×5.1
- Boards
- 85
DIP-20_W7.62mm_LongPads
Package_DIP
20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 20
- THT
- 10.5×25.9
- Boards
- 84
DIP-32_W15.24mm
Package_DIP
32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)
- Pads
- 32
- THT
- 17.3×41.2
- Boards
- 82
DIP-24_W15.24mm
Package_DIP
24-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)
- Pads
- 24
- THT
- 17.3×31.0
- Boards
- 80
DIP-28_W7.62mm_Socket
Package_DIP
28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 28
- THT
- 10.7×36.2
- Boards
- 75
DIP-32_W15.24mm_Socket
Package_DIP
32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket
- Pads
- 32
- THT
- 18.3×41.3
- Boards
- 75
InvenSense_QFN-24_3x3mm_P0.4mm
Sensor_Motion
24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)
- Pads
- 24
- SMD
- 4.1×4.1
- Boards
- 74
TO-92_Wide
Package_TO_SOT_THT
TO-92 leads molded, wide, drill 0.75mm (see NXP sot054_po.pdf)
- Pads
- 3
- THT
- 7.1×5.6
- Boards
- 66
DIP-24_W15.24mm_Socket
Package_DIP
24-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket
- Pads
- 24
- THT
- 18.3×31.1
- Boards
- 63
DIP-28_W15.24mm_Socket_LongPads
Package_DIP
28-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads
- Pads
- 28
- THT
- 18.3×36.2
- Boards
- 59
DIP-24_W7.62mm
Package_DIP
24-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 24
- THT
- 9.7×31.0
- Boards
- 57
SMDIP-4_W9.53mm
Package_DIP
4-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)
- Pads
- 4
- SMD
- 12.0×5.6
- Boards
- 57
