Footprints

1,939 footprints matching “leaded”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

1,939 footprints · page 2 of 81

Matched by name and keywords. Search by meaning instead

DIP-28_W15.24mm_Socket

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket

Pads
28
THT
18.3×36.2
Boards
133

DIP-6_W7.62mm

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads
6
THT
9.7×8.1
Boards
119

TO-92_HandSolder

FP3D

Package_TO_SOT_THT

TO-92 leads molded, narrow, drill 0.75mm, handsoldering variant with enlarged pads (see NXP sot054_po.pdf)

Pads
3
THT
5.5×5.1
Boards
117

TSSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)

Pads
8
SMD
5.9×3.6
Boards
111

LQFP-144_20x20mm_P0.5mm

FP3D

Package_QFP

LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)

Pads
144
SMD
23.3×23.3
Boards
104

DIP-20_W7.62mm_Socket_LongPads

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads
20
THT
10.7×26.0
Boards
100

TO-92L_Inline_Wide

FP3D

Package_TO_SOT_THT

TO-92L leads in-line (large body variant of TO-92), also known as TO-226, wide, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf)

Pads
3
THT
7.1×4.6
Boards
100

DIP-18_W7.62mm

FP3D

Package_DIP

18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads
18
THT
9.7×23.4
Boards
99

DIP-40_W15.24mm_Socket_LongPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads
40
THT
18.3×51.4
Boards
99

PLCC-44_THT-Socket

FP—

Package_LCC

PLCC, 44 pins, through hole

Pads
44
THT
24.5×24.5
Boards
96

SW_Tactile_SPST_NO_Straight_CK_PTS636Sx25SMTRLFS

FP3D

Button_Switch_SMD

Tactile switch, SPST, 6.0x3.5 mm, H2.5 mm, straight, NO, gull wing leads: https://www.ckswitches.com/media/2779/pts636.pdf

Pads
2
SMD
9.5×4.2
Boards
90

WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads
9
SMD
3.2×2.5
Boards
87

TO-92L_HandSolder

FP3D

Package_TO_SOT_THT

TO-92L leads in-line (large body variant of TO-92), also known as TO-226, wide, drill 0.75mm, hand-soldering variant with enlarged pads (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf)

Pads
3
THT
5.5×5.1
Boards
85

DIP-20_W7.62mm_LongPads

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads
20
THT
10.5×25.9
Boards
84

DIP-32_W15.24mm

FP3D

Package_DIP

32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads
32
THT
17.3×41.2
Boards
82

DIP-24_W15.24mm

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads
24
THT
17.3×31.0
Boards
80

DIP-28_W7.62mm_Socket

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads
28
THT
10.7×36.2
Boards
75

DIP-32_W15.24mm_Socket

FP3D

Package_DIP

32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket

Pads
32
THT
18.3×41.3
Boards
75

InvenSense_QFN-24_3x3mm_P0.4mm

FP—

Sensor_Motion

24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads
24
SMD
4.1×4.1
Boards
74

TO-92_Wide

FP3D

Package_TO_SOT_THT

TO-92 leads molded, wide, drill 0.75mm (see NXP sot054_po.pdf)

Pads
3
THT
7.1×5.6
Boards
66

DIP-24_W15.24mm_Socket

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket

Pads
24
THT
18.3×31.1
Boards
63

DIP-28_W15.24mm_Socket_LongPads

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads
28
THT
18.3×36.2
Boards
59

DIP-24_W7.62mm

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads
24
THT
9.7×31.0
Boards
57

SMDIP-4_W9.53mm

FP3D

Package_DIP

4-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads
4
SMD
12.0×5.6
Boards
57