Footprints

83 footprints matching “tag”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

83 footprints · page 2 of 4

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ST_WLCSP-115_4.63x4.15mm_Layout21x11_P0.4mm_Stagger

FP—

Package_CSP

ST WLCSP-115, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf

Pads: 115
SMD: 6.6×6.2
Boards: —

ST_WLCSP-12_1.7x1.42mm_Layout4x6_P0.35mm_Stagger

FP—

Package_CSP

ST WLCSP-12, ST Die ID 443, 1.7x1.42mm, 12 Ball, Y-staggered 4x6 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32c011d6.pdf

Pads: 12
SMD: 3.7×3.4
Boards: —

ST_WLCSP-150_5.38x5.47mm_Layout13x23_P0.4mm_Stagger

FP—

Package_CSP

ST WLCSP-150, ST die ID 481, 5.38x5.47mm, 150 Ball, Y-staggered 13x23 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u595zj.pdf

Pads: 150
SMD: 7.4×7.5
Boards: —

ST_WLCSP-18_1.86x2.14mm_Layout7x5_P0.4mm_Stagger

FP—

Package_CSP

ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf

Pads: 18
SMD: 3.9×4.2
Boards: —

ST_WLCSP-19_1.643x2.492mm_Layout4x11_P0.35mm_Stagger

FP3D

Package_CSP

ST WLCSP-19, ST Die ID 493, 1.643x2.492mm, 19 Ball, Y-staggered 4x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32c071kb.pdf#page=101

Pads: 19
SMD: 3.7×4.5
Boards: —

ST_WLCSP-208_5.38x5.47mm_Layout26x16_P0.35mm_Stagger

FP—

Package_CSP

ST WLCSP-208, ST die ID 481, 5.38x5.47mm, 208 Ball, X-staggered 26x16 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32u5a5aj.pdf

Pads: 208
SMD: 7.4×7.5
Boards: —

ST_WLCSP-208_5.8x5.6mm_Layout26x16_P0.35mm_Stagger

FP—

Package_CSP

ST WLCSP-208, ST die ID 476, 5.8x5.6mm, 208 Ball, X-staggered 26x16 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32u5f9bj.pdf

Pads: 208
SMD: 7.8×7.6
Boards: —

ST_WLCSP-27_2.34x2.55mm_Layout9x6_P0.4mm_Stagger

FP3D

Package_CSP

ST WLCSP-27, ST Die ID 459, 2.34x2.55mm, 27 Ball, X-staggered 9x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u031g6.pdf#page=105

Pads: 27
SMD: 4.3×4.6
Boards: —

ST_WLCSP-36_2.652x2.592mm_Layout7x12_P0.4mm_Stagger_Offcenter

FP—

Package_CSP

ST WLCSP-36, ST Die ID 028, 2.652x2.592mm, 36 Ball, Y-staggered 7x12 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb05tz.pdf#page=55

Pads: 36
SMD: 4.7×4.6
Boards: —

ST_WLCSP-36_2.83x2.99mm_Layout7x13_P0.4mm_Stagger_Offcenter

FP—

Package_CSP

ST WLCSP-36, ST Die ID 032, 2.83x2.99mm, 36 Ball, Y-staggered 7x13 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb09te.pdf#page=59

Pads: 36
SMD: 4.8×5.0
Boards: —

ST_WLCSP-39_2.76x2.78mm_Layout11x7_P0.4mm_Stagger

FP3D

Package_CSP

ST WLCSP-39, ST Die ID 478, 2.76x2.78mm, 39 Ball, X-staggered 11x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32h523he.pdf#page=197

Pads: 39
SMD: 4.8×4.8
Boards: —

ST_WLCSP-41_2.98x2.76mm_Layout13x7_P0.4mm_Stagger

FP—

Package_CSP

ST WLCSP-41, 2.98x2.76mm, 41 Ball, X-staggered 13x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wba55hg.pdf#page=140

Pads: 41
SMD: 5.0×4.8
Boards: —

ST_WLCSP-42_2.93x2.82mm_Layout12x7_P0.4mm_Stagger

FP—

Package_CSP

ST WLCSP-42, ST Die ID 489, 2.93x2.82mm, 42 Ball, X-staggered 12x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u073rc.pdf

Pads: 42
SMD: 4.9×4.8
Boards: —

ST_WLCSP-52_3.09x3.15mm_Layout13x8_P0.4mm_Stagger

FP—

Package_CSP

ST WLCSP-52, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136

Pads: 52
SMD: 5.1×5.2
Boards: —

ST_WLCSP-56_3.38x3.38mm_Layout14x8_P0.4mm_Stagger

FP—

Package_CSP

ST WLCSP-56, ST die ID 455, 3.38x3.38mm, 56 Ball, X-staggered 14x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u535je.pdf

Pads: 56
SMD: 5.4×5.4
Boards: —

ST_WLCSP-72_3.38x3.38mm_Layout16x9_P0.35mm_Stagger

FP—

Package_CSP

ST WLCSP-72, ST die ID 455, 3.38x3.38mm, 72 Ball, X-staggered 16x9 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32u535je.pdf

Pads: 72
SMD: 5.4×5.4
Boards: —

ST_WLCSP-80_3.5x3.27mm_Layout10x16_P0.35mm_Stagger_Offcenter

FP—

Package_CSP

ST WLCSP-80, ST die ID 484, 3.5x3.27mm, 80 Ball, Y-staggered 10x16 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h563mi.pdf

Pads: 80
SMD: 5.5×5.3
Boards: —

ST_WLCSP-90_4.2x3.95mm_Layout18x10_P0.4mm_Stagger

FP—

Package_CSP

ST WLCSP-90, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306

Pads: 90
SMD: 6.2×6.0
Boards: —

WLCSP-12_1.403x1.555mm_Layout6x4_P0.4mm_Stagger

FP—

Package_CSP

WLCSP-12, staggered array, 1.403x1.555mm, 12 Ball, X-staggered 6x4 Layout, 0.4mm Pitch, http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208

Pads: 12
SMD: 3.4×3.6
Boards: —