Footprints

665 footprints matching “wire”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

665 footprints · page 2 of 28

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SolderWire-1.5sqmm_1x02_P6mm_D1.7mm_OD3mm

FP—

Connector_Wire

Soldered wire connection, for 2 times 1.5 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3mm, size source Multi-Contact FLEXI-E 1.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
2
THT
10.5×4.2
Boards
13

Raytac_MDBT50Q

FP3D

RF_Module

Multiprotocol radio SoC module https://www.raytac.com/download/index.php?index_id=43

Pads
61
SMD
11.5×16.5
Boards
13

TestPoint_Loop_D2.60mm_Drill1.4mm_Beaded

FP3D

TestPoint

wire loop with bead as test point, loop diameter2.6mm, hole diameter 1.4mm

Pads
1
THT
4.0×4.0
Boards
13

SolderWire-0.5sqmm_1x01_D0.9mm_OD2.3mm

FP—

Connector_Wire

Soldered wire connection, for a single 0.5 mm² wire, reinforced insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
1
THT
3.8×3.3
Boards
12

SolderWire-0.75sqmm_1x01_D1.25mm_OD3.5mm

FP—

Connector_Wire

Soldered wire connection, for a single 0.75 mm² wire, reinforced insulation, conductor diameter 1.25mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-xV 0.75 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
1
THT
5.0×4.5
Boards
12

SolderWire-2.5sqmm_1x01_D2.4mm_OD4.4mm

FP—

Connector_Wire

Soldered wire connection, for a single 2.5 mm² wire, reinforced insulation, conductor diameter 2.4mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
1
THT
5.9×5.4
Boards
12

SolderWire-2.5sqmm_1x02_P7.2mm_D2.4mm_OD3.6mm

FP—

Connector_Wire

Soldered wire connection, for 2 times 2.5 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
2
THT
12.3×5.0
Boards
12

L_Changjiang_FNR4020S

FP3D

Inductor_SMD

Inductor, Changjiang, FNR4020S, 4.0x4.0x2.0mm, (https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf)

Pads
2
SMD
4.6×4.5
Boards
10

SolderWire-0.25sqmm_1x01_D0.65mm_OD1.7mm

FP—

Connector_Wire

Soldered wire connection, for a single 0.25 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E_0.25 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
1
THT
3.2×2.8
Boards
9

SolderWire-2sqmm_1x02_P7.8mm_D2mm_OD3.9mm

FP—

Connector_Wire

Soldered wire connection, for 2 times 2 mm² wires, reinforced insulation, conductor diameter 2mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.0 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
2
THT
13.2×4.9
Boards
9

L_Wuerth_HCI-1040

FP3D

Inductor_SMD

Inductor, Wuerth, HCI-1040, 10.2x10.2x4.0mm, (https://www.we-online.com/components/products/datasheet/744355215.pdf)

Pads
2
SMD
12.0×10.7
Boards
9

TestPoint_Loop_D2.50mm_Drill1.0mm_LowProfile

FP3D

TestPoint

low profile wire loop as test point, loop diameter 2.5mm, hole diameter 1.0mm

Pads
1
THT
3.6×3.6
Boards
9

SolderWire-0.25sqmm_1x02_P4.2mm_D0.65mm_OD1.7mm

FP—

Connector_Wire

Soldered wire connection, for 2 times 0.25 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E_0.25 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
2
THT
7.4×2.8
Boards
8

SolderWire-1.5sqmm_1x02_P7.8mm_D1.7mm_OD3.9mm

FP—

Connector_Wire

Soldered wire connection, for 2 times 1.5 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 1.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
2
THT
13.2×4.9
Boards
8

SolderWire-2.5sqmm_1x02_P8.8mm_D2.4mm_OD4.4mm

FP—

Connector_Wire

Soldered wire connection, for 2 times 2.5 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
2
THT
14.7×5.4
Boards
8

L_Changjiang_FNR3015S

FP3D

Inductor_SMD

Inductor, Changjiang, FNR3015S, 3.0x3.0x1.5mm, (https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf)

Pads
2
SMD
3.6×3.5
Boards
8

L_Changjiang_FNR5045S

FP3D

Inductor_SMD

Inductor, Changjiang, FNR5045S, 5.0x5.0x4.5mm, (https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf)

Pads
2
SMD
5.6×5.5
Boards
8

L_Wuerth_HCI-1365

FP3D

Inductor_SMD

Inductor, Wuerth, HCI-1365, 12.8x12.8x6.2mm, (https://www.we-online.com/components/products/datasheet/744355122.pdf)

Pads
2
SMD
15.5×13.3
Boards
8

MonoWireless_TWE-L-WX

FP3D

RF_Module

https://www.mono-wireless.com/jp/products/TWE-LITE/MW-PDS-TWELITE-JP.pdf

Pads
32
SMD
15.4×15.4
Boards
8

SolderWire-0.1sqmm_1x02_P3.6mm_D0.4mm_OD1mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for 2 times 0.1 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.10 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
2
THT
6.2×8.6
Boards
7

SolderWire-0.5sqmm_1x02_P4.6mm_D0.9mm_OD2.1mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for 2 times 0.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads
2
THT
8.2×16.0
Boards
7

SolderWire-0.5sqmm_1x02_P4.8mm_D0.9mm_OD2.3mm

FP—

Connector_Wire

Soldered wire connection, for 2 times 0.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
2
THT
8.6×3.3
Boards
7

SolderWire-0.75sqmm_1x02_P7mm_D1.25mm_OD3.5mm

FP—

Connector_Wire

Soldered wire connection, for 2 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-xV 0.75 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
2
THT
12.0×4.5
Boards
7

L_Changjiang_FNR5020S

FP3D

Inductor_SMD

Inductor, Changjiang, FNR5020S, 5.0x5.0x2.0mm, (https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf)

Pads
2
SMD
5.6×5.5
Boards
7