Footprints
3,487 footprints matching “4mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
D_DO-34_SOD68_P2.54mm_Vertical_AnodeUp
Diode_THT
Diode, DO-34_SOD68 series, Axial, Vertical, pin pitch=2.54mm, length*diameter=3.04*1.6mm^2, https://www.nxp.com/docs/en/data-sheet/KTY83_SER.pdf
- Pads
- 2
- THT
- 4.6×2.1
- Boards
- 9
L_Axial_L11.0mm_D4.5mm_P15.24mm_Horizontal_Fastron_MECC
Inductor_THT
Inductor, Axial series, Axial, Horizontal, pin pitch=15.24mm, length*diameter=11*4.5mm^2, Fastron, MECC, http://www.fastrongroup.com/image-show/21/MECC.pdf?type=Complete-DataSheet&productType=series
- Pads
- 2
- THT
- 17.8×5.0
- Boards
- 9
L_Axial_L9.5mm_D4.0mm_P15.24mm_Horizontal_Fastron_SMCC
Inductor_THT
Inductor, Axial series, Axial, Horizontal, pin pitch=15.24mm, length*diameter=9.5*4mm^2, Fastron, SMCC, http://cdn-reichelt.de/documents/datenblatt/B400/DS_SMCC_NEU.pdf, http://cdn-reichelt.de/documents/datenblatt/B400/LEADEDINDUCTORS.pdf
- Pads
- 2
- THT
- 17.8×4.5
- Boards
- 9
BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD
Package_BGA
121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)
- Pads
- 121
- SMD
- 11.0×11.0
- Boards
- 9
WLCSP-12_1.56x1.56mm_P0.4mm
Package_CSP
WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf
- Pads
- 12
- SMD
- 2.1×2.1
- Boards
- 9
Linear_DE14MA
Package_DFN_QFN
14-Lead Plastic DFN, 4mm x 3mm (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081731_C_DE14MA.pdf)
- Pads
- 14
- SMD
- 4.0×4.5
- Boards
- 9
QFN-28-1EP_4x4mm_P0.45mm_EP2.4x2.4mm
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=16)
- Pads
- 29
- SMD
- 5.2×5.2
- Boards
- 9
QFN-28-1EP_4x4mm_P0.4mm_EP2.3x2.3mm
Package_DFN_QFN
QFN, 28 Pin (http://www.issi.com/WW/pdf/31FL3731.pdf#page=21)
- Pads
- 29
- SMD
- 5.2×5.2
- Boards
- 9
QFN-32-1EP_4x4mm_P0.4mm_EP2.65x2.65mm
Package_DFN_QFN
QFN, 32 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/l32.4x4a.pdf)
- Pads
- 33
- SMD
- 5.2×5.2
- Boards
- 9
Texas_RGV0016A_VQFN-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm
Package_DFN_QFN
Texas RGV0016A VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/ina3221.pdf#page=44)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 9
Texas_RTW_WQFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
Texas RTW WQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq25601.pdf#page=54)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 9
WQFN-16-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias
Package_DFN_QFN
WQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=59)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 9
DIP-10_W7.62mm
Package_DIP
10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 10
- THT
- 9.7×13.2
- Boards
- 9
DIP-4_W10.16mm
Package_DIP
4-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)
- Pads
- 4
- THT
- 12.3×5.6
- Boards
- 9
Infineon_PG-TSNP-6-10_0.7x1.1mm_0.7x1.1mm_P0.4mm
Package_LGA
6 lead, 1.1x0.7mm body, 0.37mm height, TSNP (https://www.infineon.com/cms/en/product/packages/PG-TSNP/PG-TSNP-6-10/)
- Pads
- 6
- SMD
- 1.2×1.6
- Boards
- 9
LQFP-128_14x14mm_P0.4mm
Package_QFP
LQFP, 128 Pin (JEDEC MS-026 variation BEE, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=423)
- Pads
- 128
- SMD
- 17.3×17.3
- Boards
- 9
HVSON-8-1EP_3x3mm_P0.65mm_EP1.6x2.4mm
Package_SON
HVSON, 8 Pin (https://www.nxp.com/docs/en/data-sheet/TJA1051.pdf#page=16)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 9
WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm
Package_SON
WSON, 10 Pin (https://www.ti.com/lit/ds/symlink/tps62177.pdf)
- Pads
- 11
- SMD
- 3.3×3.5
- Boards
- 9
SW_DIP_SPSTx03_Slide_9.78x9.8mm_W8.61mm_P2.54mm
Button_Switch_SMD
SMD 3x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 9.78x9.8mm (see e.g. https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD
- Pads
- 6
- SMD
- 11.6×10.4
- Boards
- 8
IDC-Header_2x05_P2.54mm_Latch_Vertical
Connector_IDC
Through hole IDC header, 2x05, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0
- Pads
- 10
- THT
- 9.8×33.1
- Boards
- 8
Molex_SL_171971-0004_1x04_P2.54mm_Vertical
Connector_Molex
Molex Stackable Linear Connector, 171971-0004 (compatible alternatives: 171971-0104, 171971-0204), 4 Pins per row (https://www.molex.com/pdm_docs/sd/1719710002_sd.pdf)
- Pads
- 4
- THT
- 13.6×7.6
- Boards
- 8
PinHeader_1x11_P2.54mm_Horizontal
Connector_PinHeader_2.54mm
Through hole angled pin header, 1x11, 2.54mm pitch, 6mm pin length, single row
- Pads
- 11
- THT
- 12.3×28.9
- Boards
- 8
PinHeader_2x01_P2.54mm_Vertical_SMD
Connector_PinHeader_2.54mm
surface-mounted straight pin header, 2x01, 2.54mm pitch, double rows
- Pads
- 2
- SMD
- 11.7×3.5
- Boards
- 8
PinSocket_1x01_P2.54mm_Horizontal
Connector_PinSocket_2.54mm
Through hole angled socket strip, 1x01, 2.54mm pitch, 8.51mm socket length, single row (from Kicad 4.0.7), script generated
- Pads
- 1
- THT
- 12.3×3.5
- Boards
- 8