Footprints
514 footprints matching “vias”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
ST_PowerSSO-36_SlugDown_ThermalVias
Package_SO
ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 37
- SMD
- 12.1×10.8
- Boards
- —
Texas_DGN0008B_VSSOP-8-1EP_3x3mm_P0.65mm_EP2x3mm_Mask1.88x1.98mm_ThermalVias
Package_SO
Texas DGN0008B VSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tps7a4101.pdf)
- Pads
- 9
- SMD
- 6.4×3.5
- Boards
- —
Texas_DGN0008D_VSSOP-8-1EP_3x3mm_P0.65mm_EP2x2.94mm_Mask1.57x1.89mm_ThermalVias
Package_SO
Texas DGN0008D VSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa711.pdf)
- Pads
- 9
- SMD
- 6.4×3.5
- Boards
- —
Texas_DGN0008G_VSSOP-8-1EP_3x3mm_P0.65mm_EP2x2.94mm_Mask1.846x2.15mm_ThermalVias
Package_SO
Texas DGN0008G VSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa711.pdf)
- Pads
- 9
- SMD
- 6.4×3.5
- Boards
- —
Texas_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.155x3.255mm_ThermalVias
Package_SO
Texas HTSSOP, 14 Pin (Texas Instruments PWP0014A, based on JEDEC MO-153 variation ABT-1, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd287a/pptd287a.pdf, https://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 15
- SMD
- 7.8×5.5
- Boards
- —
Texas_PWP0028V_TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.7mm_Mask2.94x5.62mm_ThermalVias
Package_SO
Texas PWP0028V TSSOP, 28 Pin (https://www.ti.com/lit/ds/symlink/lm5176.pdf?ts=1728516913971&ref_url=https%253A%252F%252Fwww.ti.com%252Fproduct%252FLM5176)
- Pads
- 29
- SMD
- 7.8×10.2
- Boards
- —
TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.74x4.75mm_ThermalVias
Package_SO
TSSOP, 28 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3762.pdf)
- Pads
- 29
- SMD
- 7.7×10.2
- Boards
- —
TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.05x7.56mm_ThermalVias
Package_SO
TSSOP, 28 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/38921fc.pdf)
- Pads
- 29
- SMD
- 7.7×10.2
- Boards
- —
Microchip_USON-10-1EP_3x3mm_P0.5mm_EP1.8x2.5mm_ThermalVias
Package_SON
Microchip USON, 10 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20002281C.pdf#page=14)
- Pads
- 11
- SMD
- 4.2×3.5
- Boards
- —
Texas_DSG0008A_WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias
Package_SON
Texas DSG0008A WSON, 8 Pin (https://www.ti.com/lit/ds/symlink/mspm0c1104.pdf)
- Pads
- 9
- SMD
- 3.0×2.5
- Boards
- —
Texas_S-PWSON-N8_EP1.2x2mm_ThermalVias
Package_SON
WSON, 8 Pin (http://www.ti.com/lit/ds/symlink/lp2951.pdf#page=27)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —
Texas_X2SON-4-1EP_1.1x1.4mm_P0.5mm_EP0.8x0.6mm_ThermalVias
Package_SON
Texas X2SON, 4 Pin (http://www.ti.com/lit/ds/symlink/drv5032.pdf#page=28)
- Pads
- 5
- SMD
- 1.6×2.6
- Boards
- —
VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm_ThermalVias
Package_SON
VSON, 10 Pin (http://rohmfs.rohm.com/en/products/databook/datasheet/ic/power/switching_regulator/bd8314nuv-e.pdf (Page 20))
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- —
VSON-8-1EP_3x3mm_P0.65mm_EP1.65x2.4mm_ThermalVias
Package_SON
VSON, 8 Pin (https://www.ti.com/lit/ds/symlink/tlv767-q1.pdf#page=31)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —
WSON-10-1EP_4x4mm_P0.8mm_EP2.6x3mm_ThermalVias
Package_SON
WSON, 10 Pin (https://www.ti.com/lit/ml/qfnd434a/qfnd434a.pdf)
- Pads
- 11
- SMD
- 5.3×4.5
- Boards
- —
WSON-8-1EP_3x3mm_P0.5mm_EP1.2x2mm_ThermalVias
Package_SON
WSON, 8 Pin (http://www.ti.com/lit/ds/symlink/lp2951.pdf#page=27)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —
WSON-8-1EP_3x3mm_P0.5mm_EP1.45x2.4mm_ThermalVias
Package_SON
WSON, 8 Pin (https://www.ti.com/lit/ds/symlink/ina333.pdf#page=30)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —
WSON-8-1EP_4x4mm_P0.8mm_EP1.98x3mm_ThermalVias
Package_SON
WSON, 8 Pin (https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=34)
- Pads
- 9
- SMD
- 5.3×4.5
- Boards
- —
WSON-8-1EP_4x4mm_P0.8mm_EP2.2x3mm_ThermalVias
Package_SON
WSON, 8 Pin (https://www.ti.com/lit/ds/symlink/lp2987.pdf#page=26)
- Pads
- 9
- SMD
- 4.5×4.5
- Boards
- —
WSON-8-1EP_4x4mm_P0.8mm_EP2.6x3mm_ThermalVias
Package_SON
WSON, 8 Pin (https://www.ti.com/lit/ds/symlink/lp2951-n.pdf#page=43)
- Pads
- 9
- SMD
- 5.3×4.5
- Boards
- —
Infineon_PG-HSOF-8-2_ThermalVias
Package_TO_SOT_SMD
HSOF-8-2 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-2/)
- Pads
- 4
- SMD
- 13.8×10.6
- Boards
- —
Infineon_PG-HSOF-8-2_ThermalVias2
Package_TO_SOT_SMD
HSOF-8-2 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-2/, https://www.infineon.com/dgdl/Infineon-ApplicationNote_600V_CoolMOS_C7_Gold_TOLL-AN-v01_00-EN.pdf?fileId=5546d4625b10283a015b144a1af70df6)
- Pads
- 4
- SMD
- 13.8×10.6
- Boards
- —
Infineon_PG-HSOF-8-3_ThermalVias
Package_TO_SOT_SMD
HSOF-8-3 power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-3/)
- Pads
- 4
- SMD
- 13.3×10.5
- Boards
- —
Mini-Circuits_BK377_LandPatternPL-005
RF_Mini-Circuits
Footprint for Mini-Circuits case BK377 (https://ww2.minicircuits.com/case_style/BK276.pdf) according to land-pattern PL-005, including GND vias (https://ww2.minicircuits.com/pcb/98-pl005.pdf)
- Pads
- 14
- SMD
- 17.3×21.3
- Boards
- —