Footprints
5,346 footprints matching “IC”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WDFN-8-1EP_8x6mm_P1.27mm_EP6x4.8mm_ThermalVias
Package_DFN_QFN
WDFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_6x8mm_MN_C04172A.pdf)
- Pads
- 9
- SMD
- 9.2×6.5
- Boards
- —
CERDIP-14_W7.62mm_SideBrazed_Socket
Package_DIP
14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 14
- THT
- 10.7×19.7
- Boards
- —
CERDIP-16_W7.62mm_SideBrazed_LongPads_Socket
Package_DIP
16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 16
- THT
- 10.7×20.9
- Boards
- —
CERDIP-18_W7.62mm_SideBrazed_LongPads
Package_DIP
18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 18
- THT
- 10.5×23.4
- Boards
- —
CERDIP-18_W7.62mm_SideBrazed_LongPads_Socket
Package_DIP
18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 18
- THT
- 10.7×23.5
- Boards
- —
CERDIP-18_W7.62mm_SideBrazed_Socket
Package_DIP
18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 18
- THT
- 10.7×23.5
- Boards
- —
CERDIP-20_W7.62mm_SideBrazed_LongPads_Socket
Package_DIP
20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 20
- THT
- 10.7×26.0
- Boards
- —
CERDIP-22_W7.62mm_SideBrazed
Package_DIP
22-lead through-hole mounted CERDIP, JEDEC MS-015-AF package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 22
- THT
- 9.7×28.4
- Boards
- —
CERDIP-22_W7.62mm_SideBrazed_LongPads
Package_DIP
22-lead through-hole mounted CERDIP, JEDEC MS-015-AF package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 22
- THT
- 10.5×28.4
- Boards
- —
CERDIP-22_W7.62mm_SideBrazed_LongPads_Socket
Package_DIP
22-lead through-hole mounted CERDIP, JEDEC MS-015-AF package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 22
- THT
- 10.7×28.6
- Boards
- —
CERDIP-22_W7.62mm_SideBrazed_Socket
Package_DIP
22-lead through-hole mounted CERDIP, JEDEC MS-015-AF package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 22
- THT
- 10.7×28.6
- Boards
- —
CERDIP-24_W7.62mm_SideBrazed
Package_DIP
24-lead through-hole mounted CERDIP, JEDEC MS-015-AG package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 24
- THT
- 9.7×31.0
- Boards
- —
CERDIP-24_W7.62mm_SideBrazed_LongPads
Package_DIP
24-lead through-hole mounted CERDIP, JEDEC MS-015-AG package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 24
- THT
- 10.5×31.0
- Boards
- —
CERDIP-24_W7.62mm_SideBrazed_LongPads_Socket
Package_DIP
24-lead through-hole mounted CERDIP, JEDEC MS-015-AG package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 24
- THT
- 10.7×31.1
- Boards
- —
CERDIP-24_W7.62mm_SideBrazed_Socket
Package_DIP
24-lead through-hole mounted CERDIP, JEDEC MS-015-AG package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 24
- THT
- 10.7×31.1
- Boards
- —
CERDIP-28_W7.62mm_SideBrazed
Package_DIP
28-lead through-hole mounted CERDIP, JEDEC MS-015-AH package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 28
- THT
- 9.7×36.1
- Boards
- —
CERDIP-28_W7.62mm_SideBrazed_LongPads
Package_DIP
28-lead through-hole mounted CERDIP, JEDEC MS-015-AH package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 28
- THT
- 10.5×36.1
- Boards
- —
CERDIP-28_W7.62mm_SideBrazed_Socket
Package_DIP
28-lead through-hole mounted CERDIP, JEDEC MS-015-AH package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 28
- THT
- 10.7×36.2
- Boards
- —
Nordic_nRF9151-LAxx_LGA-80-33EP_12.1x11.1mm_P0.5mm
Package_LGA
nRF9151 (https://docs.nordicsemi.com/bundle/ps_nrf9151/page/mec_spec.html)
- Pads
- 113
- SMD
- 12.6×11.6
- Boards
- —
Nordic_nRF9160-SIxx_LGA-102-59EP_16.0x10.5mm_P0.5mm
Package_LGA
nRF9160 (https://docs.nordicsemi.com/bundle/ps_nrf9160/page/mec_spec.html)
- Pads
- 127
- SMD
- 16.9×11.4
- Boards
- —
Texas_SIL0008C_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm
Package_LGA
Texas SIL0008C MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82085.pdf#page=20)
- Pads
- 9
- SMD
- 3.4×3.5
- Boards
- —
Texas_SIL0008C_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias
Package_LGA
Texas SIL0008C MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82085.pdf#page=20)
- Pads
- 9
- SMD
- 3.4×3.5
- Boards
- —
Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm
Package_LGA
Texas SIL0008D MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19)
- Pads
- 9
- SMD
- 3.3×3.5
- Boards
- —
Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm
Package_LGA
Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf)
- Pads
- 11
- SMD
- 4.4×3.5
- Boards
- —
