Footprints

5,346 footprints matching “IC”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

5,346 footprints · page 213 of 223

Matched by name and keywords. Search by meaning instead

WDFN-8-1EP_8x6mm_P1.27mm_EP6x4.8mm_ThermalVias

FP—

Package_DFN_QFN

WDFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_6x8mm_MN_C04172A.pdf)

Pads
9
SMD
9.2×6.5
Boards
—

CERDIP-14_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
14
THT
10.7×19.7
Boards
—

CERDIP-16_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
16
THT
10.7×20.9
Boards
—

CERDIP-18_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
18
THT
10.5×23.4
Boards
—

CERDIP-18_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
18
THT
10.7×23.5
Boards
—

CERDIP-18_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

18-lead through-hole mounted CERDIP, JEDEC MS-015-AD package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
18
THT
10.7×23.5
Boards
—

CERDIP-20_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

20-lead through-hole mounted CERDIP, JEDEC MS-015-AE package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
20
THT
10.7×26.0
Boards
—

CERDIP-22_W7.62mm_SideBrazed

FP—

Package_DIP

22-lead through-hole mounted CERDIP, JEDEC MS-015-AF package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
22
THT
9.7×28.4
Boards
—

CERDIP-22_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

22-lead through-hole mounted CERDIP, JEDEC MS-015-AF package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
22
THT
10.5×28.4
Boards
—

CERDIP-22_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

22-lead through-hole mounted CERDIP, JEDEC MS-015-AF package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
22
THT
10.7×28.6
Boards
—

CERDIP-22_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

22-lead through-hole mounted CERDIP, JEDEC MS-015-AF package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
22
THT
10.7×28.6
Boards
—

CERDIP-24_W7.62mm_SideBrazed

FP—

Package_DIP

24-lead through-hole mounted CERDIP, JEDEC MS-015-AG package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
24
THT
9.7×31.0
Boards
—

CERDIP-24_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

24-lead through-hole mounted CERDIP, JEDEC MS-015-AG package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
24
THT
10.5×31.0
Boards
—

CERDIP-24_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

24-lead through-hole mounted CERDIP, JEDEC MS-015-AG package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
24
THT
10.7×31.1
Boards
—

CERDIP-24_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

24-lead through-hole mounted CERDIP, JEDEC MS-015-AG package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
24
THT
10.7×31.1
Boards
—

CERDIP-28_W7.62mm_SideBrazed

FP—

Package_DIP

28-lead through-hole mounted CERDIP, JEDEC MS-015-AH package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
28
THT
9.7×36.1
Boards
—

CERDIP-28_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

28-lead through-hole mounted CERDIP, JEDEC MS-015-AH package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
28
THT
10.5×36.1
Boards
—

CERDIP-28_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

28-lead through-hole mounted CERDIP, JEDEC MS-015-AH package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads
28
THT
10.7×36.2
Boards
—

Nordic_nRF9151-LAxx_LGA-80-33EP_12.1x11.1mm_P0.5mm

FP—

Package_LGA

nRF9151 (https://docs.nordicsemi.com/bundle/ps_nrf9151/page/mec_spec.html)

Pads
113
SMD
12.6×11.6
Boards
—

Nordic_nRF9160-SIxx_LGA-102-59EP_16.0x10.5mm_P0.5mm

FP—

Package_LGA

nRF9160 (https://docs.nordicsemi.com/bundle/ps_nrf9160/page/mec_spec.html)

Pads
127
SMD
16.9×11.4
Boards
—

Texas_SIL0008C_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm

FP—

Package_LGA

Texas SIL0008C MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82085.pdf#page=20)

Pads
9
SMD
3.4×3.5
Boards
—

Texas_SIL0008C_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias

FP—

Package_LGA

Texas SIL0008C MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82085.pdf#page=20)

Pads
9
SMD
3.4×3.5
Boards
—

Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm

FP—

Package_LGA

Texas SIL0008D MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19)

Pads
9
SMD
3.3×3.5
Boards
—

Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm

FP3D

Package_LGA

Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf)

Pads
11
SMD
4.4×3.5
Boards
—