Footprints
1,347 footprints matching “0.5”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
HIROSE DF12 3.0-14DP-0.5V 86
celestial-altium-Connector_Hirose
14 Position Connector Header, 0.50mm Pitch,5.7x3.8mm Body
- Pads
- 15
- SMD
- 7.9×5.8
- Boards
- —
HIROSE DF12A 3.0-14DS-0.5V 81
celestial-altium-Connector_Hirose
14 Position Connector Receptacle, 0.50mm Pitch,5.60x3.60mm Body
- Pads
- 14
- SMD
- 6.4×5.8
- Boards
- —
CUI UJ31-CH-31-SMT-TR
celestial-altium-Connector_USB
USB-C Receptacle Connector, 24 Postions, Body 8.96x10.85mm, SMD Pitch 0.5mm, TH Pitch 0.4mm
- Pads
- 25
- Mount
- 10.1×11.3
- Boards
- —
FUSE 0402_1005 0.51MM
celestial-altium-Fuse
Chip Fuse 1A AC 24V DC, 2 Leads, Body 1.00x0.51mm
- Pads
- 2
- SMD
- 2.0×1.1
- Boards
- —
FUSE 0603_1608 0.5MM
celestial-altium-Fuse
Chip Fuse 1.5A AC 5V DC, 2-Leads, Body 1.54x0.85mm
- Pads
- 2
- SMD
- 2.3×1.4
- Boards
- —
TI TQFP-64 PAG0064A
celestial-altium-Leaded_LQFP
TQFP-64 Package , 64-Leades, 10.00 x 10.00 mm Body , 0.5 mm Pitch
- Pads
- 64
- SMD
- 13.4×13.4
- Boards
- —
ANALOG MSOP-10
celestial-altium-Leaded_SOP
MSOP-10 Package, 0.5mm Pitch, 3.00x3.00 mm Body
- Pads
- 11
- SMD
- 5.8×3.4
- Boards
- —
Analog MSOP-16EP
celestial-altium-Leaded_SOP
MSOP-16EP Package, 0.5mm Pitch, 4.03x3.00mm Body
- Pads
- 16
- SMD
- 4.5×5.7
- Boards
- —
TI MSOP-10 DGQ
celestial-altium-Leaded_SOP
TSSOP, 10-Leads, Body 3x3mm, Pitch 0.5mm, Thermal Pad 1.88x1.57mm, IPC Medium Density
- Pads
- 11
- SMD
- 6.3×3.6
- Boards
- —
TI SOT-563 DRL
celestial-altium-Leaded_SOT
SOT DRL, 6-Leads, Body 1.10x1.60mm, Pitch 0.5mm, IPC Medium Density
- Pads
- 6
- SMD
- 2.6×2.0
- Boards
- —
TI SOT-583 DRL
celestial-altium-Leaded_SOT
SOT DRL, 8-Leads, Body 1.10x1.60mm, Pitch 0.5mm
- Pads
- 8
- SMD
- 2.6×2.5
- Boards
- —
ST WLCSP-25 2.6x2.6x0.5
celestial-altium-Leadless_BGA
WLCSP, 25-Leads, Body 2.59x2.59mmx0.54mm, Pitch 0.40mm
- Pads
- 25
- SMD
- 3.1×3.1
- Boards
- —
ANALOG DFN-8 3x2MM
celestial-altium-Leadless_DFN
8-WFDFN Exposed Pad Package, 0.5mm Pitch, 3.00x2.00 mm Body
- Pads
- 9
- SMD
- 3.2×3.6
- Boards
- —
STM DFN-8 2x2MM
celestial-altium-Leadless_DFN
DFN-8, 8-Leads, Body 2x2mm, Pitch 0.5mm, STM LMX358IQ2T
- Pads
- 9
- SMD
- 2.4×3.4
- Boards
- —
ST LQFP-100 14x14MM
celestial-altium-Leadless_LQFP
Thin QFP, 100-Leads, Body 14x14mm, Pitch 0.5mm, ST Recommended
- Pads
- 100
- SMD
- 16.9×16.9
- Boards
- —
Analog QFN-16 3x3MM
celestial-altium-Leadless_QFN
16-QFN (3x3) Package, 0.5mm Pitch, 3.00x3.00mm Body
- Pads
- 17
- SMD
- 4.0×4.0
- Boards
- —
PSEMI QFN-12 3x3x0.5
celestial-altium-Leadless_QFN
QFN, 12-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.90x1.90mm
- Pads
- 13
- SMD
- 4.2×4.2
- Boards
- —
ST QFN20 3x3
celestial-altium-Leadless_QFN
QFN, 20-Leads, Body 3.00x3.00mm, Pitch 0.5mm, IPC Medium Density
- Pads
- 20
- SMD
- 3.5×3.6
- Boards
- —
TI VQFN-16 RGT
celestial-altium-Leadless_QFN
QFN, 16-Leads, Body 3.1x3.1mm (max), Pitch 0.5mm, IPC Medium Density
- Pads
- 17
- SMD
- 3.8×3.8
- Boards
- —
TOSHIBA P-WQFN48-0707-0.50-003
celestial-altium-Leadless_QFN
WQFN, 48-Leads, Body 7.00x7.00mm, Pitch 0.50mm, Thermal Pad 5.50x5.50mm, IPC Medium Density
- Pads
- 49
- SMD
- 8.2×8.2
- Boards
- —
TI SON-8 DRG
celestial-altium-Leadless_SON
SON, 8-Leads, Body 3.0x3.0mm, Pitch 0.5mm, Thermal Pad 1.20x2.0mm, IPC Medium Density
- Pads
- 9
- SMD
- 4.2×3.4
- Boards
- —
TI VSON-10 DLA
celestial-altium-Leadless_SON
Buck-Boost Switching Regulator IC Positive Adjustable 1.8V 1 Output 2A, 0.5mm Pitch, 3.00x2.00 mm Body, VFDFN-10 Package
- Pads
- 10
- SMD
- 3.0×3.4
- Boards
- —
TI VSON-14 DSJ
celestial-altium-Leadless_SON
VSON-14 Package, 0.5mm Pitch, 4.00x3.00 mm Body
- Pads
- 15
- SMD
- 4.0×5.0
- Boards
- —
GAPTEC LCB78_0.5
celestial-altium-Power_Module
Wide Input Non-Isolated & Regulated, Single Output
- Pads
- 3
- THT
- 12.0×6.5
- Boards
- —