Footprints

3,487 footprints matching “4mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

3,487 footprints · page 26 of 146

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Heatsink_Stonecold_HS-132_32x14mm_2xFixation1.5mm

FP3D

Heatsink

Heatsink, StoneCold HS

Pads: 1
THT: 32.0×14.0
Boards: 5

L_Axial_L9.5mm_D4.0mm_P5.08mm_Vertical_Fastron_SMCC

FP3D

Inductor_THT

Inductor, Axial series, Axial, Vertical, pin pitch=5.08mm, length*diameter=9.5*4mm^2, Fastron, SMCC, http://cdn-reichelt.de/documents/datenblatt/B400/DS_SMCC_NEU.pdf, http://cdn-reichelt.de/documents/datenblatt/B400/LEADEDINDUCTORS.pdf

Pads: 2
THT: 8.6×4.5
Boards: 5

L_Toroid_Vertical_L25.4mm_W14.7mm_P12.20mm_Vishay_TJ5_BigPads

FP—

Inductor_THT

L_Toroid, Vertical series, Radial, pin pitch=12.20mm, length*width=25.4*14.7mm^2, Vishay, TJ5, http://www.vishay.com/docs/34079/tj.pdf

Pads: 2
THT: 25.9×15.7
Boards: 5

MountingHole_6.4mm_M6_DIN965_Pad

FP—

MountingHole

Mounting Hole 6.4mm, M6, generated by kicad-footprint-generator mountinghole.py

Pads: 1
THT: 11.5×11.5
Boards: 5

BGA-256_17.0x17.0mm_Layout16x16_P1.0mm_Ball0.5mm_Pad0.4mm_NSMD

FP3D

Package_BGA

BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf

Pads: 256
SMD: 19.0×19.0
Boards: 5

LFCSP-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias

FP—

Package_CSP

LFCSP, 24 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_24_7.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 5

DFN-12-1EP_3x4mm_P0.5mm_EP1.7x3.3mm

FP3D

Package_DFN_QFN

DE/UE Package; 12-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf)

Pads: 13
SMD: 4.1×4.6
Boards: 5

HVQFN-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm

FP—

Package_DFN_QFN

HVQFN, 24 Pin (https://www.nxp.com/docs/en/package-information/SOT616-3.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 5

HVQFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm

FP—

Package_DFN_QFN

HVQFN, 24 Pin (https://www.nxp.com/docs/en/package-information/SOT616-3.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 5

QFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 16 Pin (https://www.allegromicro.com/~/media/Files/Datasheets/A4403-Datasheet.ashx)

Pads: 17
SMD: 5.3×5.3
Boards: 5

QFN-56-1EP_7x7mm_P0.4mm_EP4x4mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://www.espressif.com/sites/default/files/documentation/esp32-s2_datasheet_en.pdf#page=41)

Pads: 57
SMD: 8.2×8.2
Boards: 5

QFN-60-1EP_7x7mm_P0.4mm_EP3.4x3.4mm

FP—

Package_DFN_QFN

QFN, 60 Pin (https://datasheets.raspberrypi.com/rp2350/rp2350-datasheet.pdf)

Pads: 61
SMD: 8.2×8.2
Boards: 5

QFN-68-1EP_8x8mm_P0.4mm_EP5.2x5.2mm

FP3D

Package_DFN_QFN

QFN, 68 Pin (https://cdn.microsemi.com/documents/1bf6886f-5919-4508-a50b-b1dbf3fdf0f4/download/#page=98)

Pads: 69
SMD: 9.2×9.2
Boards: 5

TDFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm

FP—

Package_DFN_QFN

TDFN, 14 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0137.PDF (T1433-2C))

Pads: 15
SMD: 4.3×3.5
Boards: 5

Texas_RSA_VQFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm

FP3D

Package_DFN_QFN

Texas RSA VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/msp430g2001.pdf#page=44)

Pads: 17
SMD: 5.3×5.3
Boards: 5

Texas_RSA_VQFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm_ThermalVias

FP3D

Package_DFN_QFN

Texas RSA VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/msp430g2001.pdf#page=44)

Pads: 17
SMD: 5.3×5.3
Boards: 5

UQFN-20-1EP_3x3mm_P0.4mm_EP1.85x1.85mm

FP3D

Package_DFN_QFN

UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=332)

Pads: 21
SMD: 4.2×4.2
Boards: 5

DIP-14_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 14
SMD: 10.7×18.4
Boards: 5

DIP-16_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 16
SMD: 12.5×20.9
Boards: 5

DIP-64_W22.86mm

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils)

Pads: 64
THT: 25.0×81.8
Boards: 5

PQFP-132_24x24mm_P0.635mm_i386

FP3D

Package_QFP

PQFP, 132 pins, 24mm sq body, 0.635mm pitch, Intel 386EX (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf)

Pads: 132
SMD: 28.9×28.9
Boards: 5