Footprints

5,977 footprints matching “8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

5,977 footprints · page 27 of 250

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R_Axial_DIN0614_L14.3mm_D5.7mm_P5.08mm_Vertical

FP3D

Resistor_THT

Resistor, Axial_DIN0614 series, Axial, Vertical, pin pitch=5.08mm, 1.5W, length*diameter=14.3*5.7mm^2

Pads
2
THT
9.8×6.2
Boards
8

SIMCom_SIM800C

FP—

RF_GSM

Quad-Band GSM/GPRS module, 17.6x15.7x2.3mm, http://simcom.ee/documents/SIM800C/SIM800C_Hardware_Design_V1.05.pdf

Pads
42
SMD
18.2×20.1
Boards
8

CE-Logo_11.2x8mm_SilkScreen

FP—

Symbol

CE marking

Pads
—
Mount
exclude_from_pos_files
Boards
8

TerminalBlock_Phoenix_MKDS-1,5-8_1x08_P5.00mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix MKDS-1,5-8, 8 pins, pitch 5mm, size 40x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf

Pads
8
THT
41.0×10.8
Boards
8

TerminalBlock_Phoenix_PT-1,5-8-3.5-H_1x08_P3.50mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix PT-1,5-8-3.5-H, 8 pins, pitch 3.5mm, size 28x7.6mm, drill diameter 1.2mm, pad diameter 2.4mm,

Pads
8
THT
29.0×8.6
Boards
8

TerminalBlock_TE_282834-7_1x07_P2.54mm_Horizontal

FP—

TerminalBlock_TE-Connectivity

Terminal Block TE 282834-7, 7 pins, pitch 2.54mm, size 18.2x6.5mm, drill diameter 1.1mm, pad diameter 2.1mm, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F282834%7FC1%7Fpdf%7FEnglish%7FENG_CD_282834_C1.pdf

Pads
7
THT
19.3×7.5
Boards
8

BatteryHolder_Keystone_2998_1x6.8mm

FP—

Battery

www.keyelco.com/product-pdf.cfm?p=763

Pads
2
SMD
11.8×9.9
Boards
7

SW_DIP_SPSTx04_Slide_Omron_A6S-410x_W8.9mm_P2.54mm

FP3D

Button_Switch_SMD

SMD 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 8.9 mm (350 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf)

Pads
8
SMD
10.9×11.7
Boards
7

SW_DIP_SPSTx02_Piano_10.8x6.64mm_W7.62mm_P2.54mm

FP3D

Button_Switch_THT

2x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size 10.8x6.64mm

Pads
4
THT
13.1×7.3
Boards
7

SW_DIP_SPSTx04_Piano_10.8x11.72mm_W7.62mm_P2.54mm

FP3D

Button_Switch_THT

4x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size 10.8x11.72mm

Pads
8
THT
13.1×12.3
Boards
7

SW_Push_1P2T_Vertical_E-Switch_800UDP8P1A1M6

FP—

Button_Switch_THT

right angle SPDT push button https://www.e-switch.com/system/asset/product_line/data_sheet/210/800U.pdf

Pads
3
THT
12.3×7.5
Boards
7

CP_EIA-7132-28_AVX-C

FP—

Capacitor_Tantalum_SMD

Tantalum Capacitor SMD AVX-C (7132-28 Metric), IPC-7352 nominal, (Body size from: http://datasheets.avx.com/F72-F75.pdf)

Pads
2
SMD
8.6×4.1
Boards
7

C_Disc_D8.0mm_W5.0mm_P7.50mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=7.50mm, diameter*width=8*5.0mm^2, Capacitor, http://www.vishay.com/docs/28535/vy2series.pdf

Pads
2
THT
10.0×5.5
Boards
7

TE_0-1734839-8_1x08-1MP_P0.5mm_Horizontal

FP—

Connector_FFC-FPC

TE FPC connector, 08 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0

Pads
9
SMD
10.4×6.7
Boards
7

JST_GH_BM08B-GHS-TBT_1x08-1MP_P1.25mm_Vertical

FP3D

Connector_JST

JST GH series connector, BM08B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf)

Pads
9
SMD
14.5×6.6
Boards
7

Molex_Micro-Fit_3.0_43045-0800_2x04_P3.00mm_Horizontal

FP—

Connector_Molex

Molex Micro-Fit 3.0 Connector System, 43045-0800 (alternative finishes: 43045-080x), 4 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf)

Pads
8
THT
17.2×13.7
Boards
7

Molex_PicoBlade_53048-0610_1x06_P1.25mm_Horizontal

FP—

Connector_Molex

Molex PicoBlade Connector System, 53048-0610, 6 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf)

Pads
6
THT
10.3×6.5
Boards
7

PhoenixContact_MC_1,5_5-G-3.81_1x05_P3.81mm_Horizontal

FP3D

Connector_Phoenix_MC

Generic Phoenix Contact connector footprint for: MC_1,5/5-G-3.81; number of pins: 05; pin pitch: 3.81mm; Angled || order number: 1803303 8A 160V

Pads
5
THT
21.6×10.8
Boards
7

PinHeader_1x38_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 1x38, 2.54mm pitch, single row

Pads
38
THT
3.5×97.5
Boards
7

RJ45_Amphenol_RJHSE538X-02

FP—

Connector_RJ

Shielded, 2 LED, 2 Ports, http://www.amphenolinfocom.eu/NavData/Drawings/RJHSE-538X-02-REVC.pdf

Pads
25
THT
35.3×16.8
Boards
7

RJ45_UDE_RB1-125B8G1A

FP—

Connector_RJ

1 Port RJ45 Connector Through Hole 10/100/1000 Base-T, https://datasheet.lcsc.com/szlcsc/1901091107_UDE-Corp-RB1-125B8G1A_C363353.pdf#page=3

Pads
15
THT
19.1×22.8
Boards
7

SolderWire-0.5sqmm_1x02_P4.8mm_D0.9mm_OD2.3mm

FP—

Connector_Wire

Soldered wire connection, for 2 times 0.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
2
THT
8.6×3.3
Boards
7

Converter_DCDC_Murata_OKI-78SR_Horizontal

FP3D

Converter_DCDC

https://power.murata.com/data/power/oki-78sr.pdf

Pads
3
THT
10.9×17.0
Boards
7

Crystal_SMD_SeikoEpson_MC306-4Pin_8.0x3.2mm_HandSoldering

FP—

Crystal

Seiko Epson MC-306, Crystal, 8.0x3.2mm package, SMD, hand-soldering, https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-306_en.pdf

Pads
4
SMD
9.0×7.5
Boards
7