Footprints
719 footprints matching “Thermal”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
VQFN-32-1EP_4x4mm_P0.4mm_EP2.8x2.8mm_ThermalVias
Package_DFN_QFN
VQFN, 32 Pin (https://www.ti.com/lit/ds/symlink/tps25750.pdf#page=78)
- Pads
- 33
- SMD
- 5.3×5.3
- Boards
- —
VQFN-40-1EP_5x5mm_P0.4mm_EP3.3x3.3mm_ThermalVias
Package_DFN_QFN
VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://tridentiot.com/wp-content/uploads/2024/11/DS-ZW-0001-01-T32CZ20-Datasheet.pdf#page=36)
- Pads
- 41
- SMD
- 6.3×6.3
- Boards
- —
VQFN-40-1EP_5x5mm_P0.4mm_EP3.5x3.5mm_ThermalVias
Package_DFN_QFN
VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP6536/document_id/3761/)
- Pads
- 41
- SMD
- 6.3×6.3
- Boards
- —
VQFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm_ThermalVias
Package_DFN_QFN
VQFN, 40 Pin (JEDEC MO-220-K.01, variation VHHE-1, https://www.jedec.org/system/files/docs/MO-220K01.pdf)
- Pads
- 41
- SMD
- 6.3×6.3
- Boards
- —
VQFN-40-1EP_5x5mm_P0.4mm_EP3.7x3.7mm_ThermalVias
Package_DFN_QFN
VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://www.silabs.com/documents/public/data-sheets/efm32pg23-datasheet.pdf#page=89, https://www.jedec.org/system/files/docs/MO-220K01.pdf)
- Pads
- 41
- SMD
- 6.3×6.3
- Boards
- —
VQFN-46-1EP_5x6mm_P0.4mm_EP2.8x3.8mm_ThermalVias
Package_DFN_QFN
VQFN, 46 Pin (http://www.ti.com/lit/ds/symlink/lp5036.pdf#page=59)
- Pads
- 47
- SMD
- 6.3×7.3
- Boards
- —
VQFN-48-1EP_6x6mm_P0.4mm_EP4.1x4.1mm_ThermalVias
Package_DFN_QFN
VQFN, 48 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/48L_VQFN_6x6mm_6LX_C04-00494a.pdf)
- Pads
- 49
- SMD
- 7.2×7.2
- Boards
- —
VQFN-48-1EP_7x7mm_P0.5mm_EP2.6x2.6mm_ThermalVias
Package_DFN_QFN
VQFN, 48 Pin (Based on JEDEC MO-220 variation VKKD-2 (using Figure 1), custom Exposed Pad from STMicroeletronics, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, https://www.st.com/resource/en/datasheet/stspin32f0a.pdf#page=37)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- —
VQFN-48-1EP_7x7mm_P0.5mm_EP4.2x4.2mm_ThermalVias
Package_DFN_QFN
VQFN, 48 Pin (Based on JEDEC MO-220 variation VKKD-2 (using Figure 1), custom Exposed Pad from NXP, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, https://www.nxp.com/docs/en/package-information/SOT619-28.pdf)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- —
VQFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm_ThermalVias
Package_DFN_QFN
VQFN, 48 Pin (http://www.ti.com/lit/ds/symlink/cc1312r.pdf#page=48)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- —
VQFN-56-1EP_8x8mm_P0.5mm_EP5.1x4.96mm_ThermalVias
Package_DFN_QFN
VQFN, 56 Pin (https://www.nxp.com/docs/en/package-information/SOT684-21.pdf)
- Pads
- 57
- SMD
- 9.2×9.2
- Boards
- —
VQFN-56-1EP_8x8mm_P0.5mm_EP5.5x5.06mm_ThermalVias
Package_DFN_QFN
VQFN, 56 Pin (https://www.nxp.com/docs/en/package-information/SOT684-21_DD_SC.pdf)
- Pads
- 57
- SMD
- 9.2×9.2
- Boards
- —
VQFN-64-1EP_9x9mm_P0.5mm_EP5.4x5.4mm_ThermalVias
Package_DFN_QFN
VQFN, 64 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/PIC16LF19195-6-7-Data-Sheet-40001873D.pdf#page=718)
- Pads
- 65
- SMD
- 10.2×10.2
- Boards
- —
VQFN-64-1EP_9x9mm_P0.5mm_EP7.15x7.15mm_ThermalVias
Package_DFN_QFN
VQFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_QFN_9x9_MR_C04-00149e.pdf)
- Pads
- 65
- SMD
- 10.2×10.2
- Boards
- —
WDFN-10-1EP_3x3mm_P0.5mm_EP1.8x2.5mm_ThermalVias
Package_DFN_QFN
WDFN, 10 Pin (https://www.onsemi.com/pdf/datasheet/nis5420-d.pdf)
- Pads
- 11
- SMD
- 4.2×3.5
- Boards
- —
WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm_ThermalVias
Package_DFN_QFN
WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF)
- Pads
- 9
- SMD
- 5.2×3.5
- Boards
- —
WDFN-8-1EP_8x6mm_P1.27mm_EP6x4.8mm_ThermalVias
Package_DFN_QFN
WDFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_6x8mm_MN_C04172A.pdf)
- Pads
- 9
- SMD
- 9.2×6.5
- Boards
- —
WQFN-14-1EP_2.5x2.5mm_P0.5mm_EP1.45x1.45mm_ThermalVias
Package_DFN_QFN
WQFN, 14 Pin (https://www.onsemi.com/pub/Collateral/FUSB302B-D.PDF#page=32)
- Pads
- 15
- SMD
- 3.7×3.7
- Boards
- —
WQFN-16-1EP_3x3mm_P0.5mm_EP1.75x1.75mm_ThermalVias
Package_DFN_QFN
WQFN, 16 Pin (https://www.onsemi.com/pub/Collateral/FUSB307B-D.PDF#page=56)
- Pads
- 17
- SMD
- 4.2×4.2
- Boards
- —
WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- —
WQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm_ThermalVias
Package_DFN_QFN
WQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/ts3a27518e.pdf#page=33)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- —
WQFN-28-1EP_4x4mm_P0.4mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
WQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation WGGE and exposed pad from Maxim / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf)
- Pads
- 29
- SMD
- 5.3×5.3
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP2.7x4.7mm_ThermalVias
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm_ThermalVias
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —