Footprints
7,757 footprints matching “pins”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WDFN-8-1EP_8x6mm_P1.27mm_EP6x4.8mm_ThermalVias
Package_DFN_QFN
WDFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_6x8mm_MN_C04172A.pdf)
- Pads
- 9
- SMD
- 9.2×6.5
- Boards
- —
WFDFPN-8-1EP_3x2mm_P0.5mm_EP1.25x1.35mm
Package_DFN_QFN
WFDFPN, 8 Pin (https://www.st.com/resource/en/datasheet/m95512-r.pdf#page=34)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- —
WQFN-14-1EP_2.5x2.5mm_P0.5mm_EP1.45x1.45mm_ThermalVias
Package_DFN_QFN
WQFN, 14 Pin (https://www.onsemi.com/pub/Collateral/FUSB302B-D.PDF#page=32)
- Pads
- 15
- SMD
- 3.7×3.7
- Boards
- —
WQFN-16-1EP_3x3mm_P0.5mm_EP1.75x1.75mm_ThermalVias
Package_DFN_QFN
WQFN, 16 Pin (https://www.onsemi.com/pub/Collateral/FUSB307B-D.PDF#page=56)
- Pads
- 17
- SMD
- 4.2×4.2
- Boards
- —
WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- —
WQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm_ThermalVias
Package_DFN_QFN
WQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/ts3a27518e.pdf#page=33)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- —
WQFN-28-1EP_4x4mm_P0.4mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
WQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation WGGE and exposed pad from Maxim / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf)
- Pads
- 29
- SMD
- 5.3×5.3
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP2.7x4.7mm
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP2.7x4.7mm_ThermalVias
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm_ThermalVias
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.65x5.65mm
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD-1, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.65x5.65mm_ThermalVias
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD-1, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-42-1EP_3.5x9mm_P0.5mm_EP2.05x7.55mm_ThermalVias
Package_DFN_QFN
WQFN, 42 Pin (http://www.ti.com/lit/ds/symlink/ts3l501e.pdf#page=23, https://www.diodes.com/assets/Package-Files/PD-2035J_ZH42.pdf)
- Pads
- 43
- SMD
- 4.8×10.3
- Boards
- —
DIP-8-N6_W7.62mm
Package_DIP
8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 6
- Pads
- 7
- THT
- 9.8×10.7
- Boards
- —
IXYS_Flatpak-8_6.3x9.7mm_P2.54mm
Package_DIP
IXYS Flatpak, 8 Pin (https://www.littelfuse.com/media?resourcetype=datasheets&itemid=996c6e8f-cc1b-44f6-811e-251c6e004c56&filename=littelfuse-integrated-circuits-loc112-datasheet)
- Pads
- 8
- SMD
- 10.8×10.2
- Boards
- —
IXYS_SMD-8_6.3x9.7mm_P2.54mm
Package_DIP
IXYS Flatpak, 8 Pin (https://www.littelfuse.com/media?resourcetype=datasheets&itemid=996c6e8f-cc1b-44f6-811e-251c6e004c56&filename=littelfuse-integrated-circuits-loc112-datasheet)
- Pads
- 8
- SMD
- 11.1×10.2
- Boards
- —
Toshiba_11-7A9
Package_DIP
Toshiba 11-7A9 package, like 6-lead dip package with missing pin 5, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S)
- Pads
- 5
- THT
- 9.8×8.2
- Boards
- —
MO047AD_PLCC-52_19.1x19.1mm_P1.27mm
Package_LCC
MO047AD PLCC, 52 Pin (JEDEC MO-047 variation AD, https://www.jedec.org/document_search?search_api_views_fulltext=MO-047, https://archive.org/details/bitsavers_signeticsdcsMicroprocessor_53987793/page/n775/mode/1up?view=theater)
- Pads
- 52
- SMD
- 20.7×20.7
- Boards
- —
PLCC-20_9.0x9.0mm_P1.27mm
Package_LCC
PLCC, 20 Pin (http://www.nxp.com/docs/en/package-information/SOT380-1.pdf)
- Pads
- 20
- SMD
- 10.6×10.6
- Boards
- —
PLCC-68_24.2x24.2mm_P1.27mm
Package_LCC
PLCC, 68 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095)
- Pads
- 68
- SMD
- 25.8×25.8
- Boards
- —
PLCC-84_29.3x29.3mm_P1.27mm
Package_LCC
PLCC, 84 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095)
- Pads
- 84
- SMD
- 30.9×30.9
- Boards
- —
PLCC-84_SMD-Socket
Package_LCC
PLCC, 84 pins, surface mount
- Pads
- 84
- SMD
- 37.0×37.0
- Boards
- —
LGA-16_4x4mm_P0.65mm_LayoutBorder4x4y
Package_LGA
LGA, 16 Pin (http://www.st.com/resource/en/datasheet/l3gd20.pdf)
- Pads
- 16
- SMD
- 4.5×4.5
- Boards
- —