Footprints

81 footprints matching “0.35”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

81 footprints · page 3 of 4

Matched by name and keywords. Search by meaning instead

TFBGA-78_9x11mm_Layout9x13_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 78 balls (JEDEC MO-210Q), 11.0x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads: 78
SMD: 11.0×13.0
Boards: —

TFBGA-80_9x16mm_Layout9x15_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 80 balls (JEDEC MO-210Q), 16.0x9.0mm, 80 Ball, 9x15 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads: 80
SMD: 11.0×18.0
Boards: —

TFBGA-84_10x12.5mm_Layout9x15_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 84 balls (JEDEC MO-210Q), 12.5x10.0mm, 84 Ball, 9x15 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads: 84
SMD: 12.0×14.5
Boards: —

TFBGA-84_10x16.5mm_Layout9x15_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 84 balls (JEDEC MO-210Q), 16.5x10.0mm, 84 Ball, 9x15 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads: 84
SMD: 12.0×18.5
Boards: —

TFBGA-84_11.5x14mm_Layout9x15_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 84 balls (JEDEC MO-210Q), 14.0x11.5mm, 84 Ball, 9x15 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads: 84
SMD: 13.5×16.0
Boards: —

TFBGA-84_8x12.5mm_Layout9x15_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 84 balls (JEDEC MO-210Q), 12.5x8.0mm, 84 Ball, 9x15 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads: 84
SMD: 10.0×14.5
Boards: —

TFBGA-84_8x14mm_Layout9x15_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 84 balls (JEDEC MO-210Q), 14.0x8.0mm, 84 Ball, 9x15 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads: 84
SMD: 10.0×16.0
Boards: —

TFBGA-90_11x13mm_Layout9x15_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 90 balls (JEDEC MO-210Q), 13.0x11.0mm, 90 Ball, 9x15 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads: 90
SMD: 13.0×15.0
Boards: —

TFBGA-90_8x13mm_Layout9x15_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 90 balls (JEDEC MO-210Q), 13.0x8.0mm, 90 Ball, 9x15 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads: 90
SMD: 10.0×15.0
Boards: —

TFBGA-96_9x14mm_Layout9x16_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 96 balls (JEDEC MO-210Q), 14.0x9.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads: 96
SMD: 11.0×16.0
Boards: —

QFN-128-1EP_12.3x12.3mm_P0.35mm_EP7x7mm

FP—

muratovas-MAS_Package_std

QFN-128 12.3x12.3

Pads: 129
SMD: 13.2×13.2
Boards: —

Infineon_LFBGA-292_17x17mm_Layout20x20_P0.8mm

FP—

Package_BGA

Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-LFBGA/PG-LFBGA-292-11/

Pads: 292
SMD: 19.0×19.0
Boards: —

Texas_DSBGA-6_0.704x1.054mm_Layout2x3_P0.35mm

FP—

Package_BGA

Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA0006-C01 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ds/symlink/tps62800.pdf

Pads: 6
SMD: 2.7×3.1
Boards: —

Texas_DSBGA-6_0.757x1.01mm_Layout2x3_P0.35mm

FP3D

Package_BGA

Texas Instruments, DSBGA-6, 0.757x1.01mm, SMD, YKA0006 pad definition, 0.757x1.01mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ds/symlink/tps62843.pdf

Pads: 6
SMD: 2.8×3.0
Boards: —

WLP-4_0.728x0.728mm_Layout2x2_P0.35mm

FP—

Package_BGA

WLP-4, 0.728x0.728mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf

Pads: 4
SMD: 2.7×2.7
Boards: —

ST_WLCSP-101_3.86x3.79mm_Layout11x19_P0.35mm_Stagger

FP—

Package_CSP

ST WLCSP-101, ST Die ID 485, 3.86x3.79mm, 101 Ball, Y-staggered 11x19 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7r3v8.pdf

Pads: 101
SMD: 5.9×5.8
Boards: —

ST_WLCSP-115_3.73x4.15mm_Layout11x21_P0.35mm_Stagger

FP—

Package_CSP

ST WLCSP-115, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf

Pads: 115
SMD: 5.7×6.2
Boards: —

ST_WLCSP-12_1.7x1.42mm_Layout4x6_P0.35mm_Stagger

FP—

Package_CSP

ST WLCSP-12, ST Die ID 443, 1.7x1.42mm, 12 Ball, Y-staggered 4x6 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32c011d6.pdf

Pads: 12
SMD: 3.7×3.4
Boards: —

ST_WLCSP-132_4.57x4.37mm_Layout12x11_P0.35mm

FP—

Package_CSP

ST WLCSP-132, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf

Pads: 132
SMD: 6.6×6.4
Boards: —

ST_WLCSP-156_4.96x4.64mm_Layout13x12_P0.35mm

FP—

Package_CSP

ST WLCSP-156, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf

Pads: 156
SMD: 7.0×6.6
Boards: —

ST_WLCSP-19_1.643x2.492mm_Layout4x11_P0.35mm_Stagger

FP3D

Package_CSP

ST WLCSP-19, ST Die ID 493, 1.643x2.492mm, 19 Ball, Y-staggered 4x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32c071kb.pdf#page=101

Pads: 19
SMD: 3.7×4.5
Boards: —