Footprints
1,343 footprints matching “0.5”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
QFN-32-1EP_5x5mm_P0.5mm_EP3.6x3.6mm
Package_DFN_QFN
QFN, 32 Pin (http://infocenter.nordicsemi.com/pdf/nRF52810_PS_v1.1.pdf#page=468)
- Pads
- 33
- SMD
- 6.2×6.2
- Boards
- 39
WQFN-14-1EP_2.5x2.5mm_P0.5mm_EP1.45x1.45mm
Package_DFN_QFN
WQFN, 14 Pin (https://www.onsemi.com/pub/Collateral/FUSB302B-D.PDF#page=32)
- Pads
- 15
- SMD
- 3.7×3.7
- Boards
- 39
Winbond_USON-8-1EP_3x2mm_P0.5mm_EP0.2x1.6mm
Package_SON
Winbond USON, 8 Pin (https://www.lcsc.com/datasheet/lcsc_datasheet_2205122030_Winbond-Elec-W25Q16JVUXIQ_C2843335.pdf#page=66f)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 39
TQFN-16-1EP_3x3mm_P0.5mm_EP1.23x1.23mm
Package_DFN_QFN
TQFN, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0136.PDF (T1633-5), https://pdfserv.maximintegrated.com/land_patterns/90-0032.PDF)
- Pads
- 17
- SMD
- 4.2×4.2
- Boards
- 38
TerminalBlock_Phoenix_PT-1,5-3-3.5-H_1x03_P3.50mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix PT-1,5-3-3.5-H, 3 pins, pitch 3.5mm, size 10.5x7.6mm, drill diameter 1.2mm, pad diameter 2.4mm,
- Pads
- 3
- THT
- 11.5×8.6
- Boards
- 38
Hirose_FH12-24S-0.5SH_1x24-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-24S-0.5SH, 24 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 25
- SMD
- 18.1×7.9
- Boards
- 36
TSSOP-48_6.1x12.5mm_P0.5mm
Package_SO
TSSOP, 48 Pin (JEDEC MO-153 Var ED https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 48
- SMD
- 9.4×13.0
- Boards
- 36
TSOP-I-48_18.4x12mm_P0.5mm
Package_SO
TSOP-I, 48 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation DD)
- Pads
- 48
- SMD
- 21.5×12.5
- Boards
- 35
WSON-6_1.5x1.5mm_P0.5mm
Package_SON
WSON6, http://www.ti.com/lit/ds/symlink/tlv702.pdf
- Pads
- 6
- SMD
- 2.4×2.0
- Boards
- 34
VQFN-16-1EP_3x3mm_P0.5mm_EP1.68x1.68mm_ThermalVias
Package_DFN_QFN
VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/tlv62095.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 33
TI_SO-PowerPAD-8
Package_SO
8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf)
- Pads
- 9
- SMD
- 8.0×5.4
- Boards
- 33
Hirose_FH12-6S-0.5SH_1x06-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-6S-0.5SH, 6 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 7
- SMD
- 9.1×7.9
- Boards
- 31
QFN-28_4x4mm_P0.5mm
Package_DFN_QFN
QFN, 28 Pin (http://www.st.com/resource/en/datasheet/stm32f031k6.pdf#page=90)
- Pads
- 28
- SMD
- 5.3×5.3
- Boards
- 30
Hirose_FH12-40S-0.5SH_1x40-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-40S-0.5SH, 40 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 41
- SMD
- 26.1×7.9
- Boards
- 29
SolderWire-0.5sqmm_1x01_D0.9mm_OD2.1mm
Connector_Wire
Soldered wire connection, for a single 0.5 mm² wire, basic insulation, conductor diameter 0.9mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 1
- THT
- 3.6×3.2
- Boards
- 29
MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm
Package_SO
MSOP, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3805fg.pdf#page=18)
- Pads
- 11
- SMD
- 6.3×3.5
- Boards
- 28
LGA-16_3x3mm_P0.5mm
Package_LGA
http://www.memsic.com/userfiles/files/DataSheets/Magnetic-Sensors-Datasheets/MMC5883MA-RevC.pdf
- Pads
- 16
- SMD
- 3.5×3.5
- Boards
- 26
Hirose_FH12-10S-0.5SH_1x10-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-10S-0.5SH, 10 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 11
- SMD
- 11.1×7.9
- Boards
- 25
Hirose_FH12-22S-0.5SH_1x22-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-22S-0.5SH, 22 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 23
- SMD
- 17.1×7.9
- Boards
- 25
QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias
Package_DFN_QFN
QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)
- Pads
- 25
- SMD
- 5.2×5.2
- Boards
- 24
DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm
Package_DFN_QFN
DD Package; 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1698.pdf)
- Pads
- 9
- SMD
- 4.0×3.6
- Boards
- 23
QFN-32-1EP_5x5mm_P0.5mm_EP3.7x3.7mm
Package_DFN_QFN
QFN, 32 Pin (https://www.espressif.com/sites/default/files/documentation/0a-esp8285_datasheet_en.pdf)
- Pads
- 33
- SMD
- 6.2×6.2
- Boards
- 23
TerminalBlock_Phoenix_MKDS-1,5-6-5.08_1x06_P5.08mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix MKDS-1,5-6-5.08, 6 pins, pitch 5.08mm, size 30.5x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf
- Pads
- 6
- THT
- 31.5×10.8
- Boards
- 23
VQFN-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias
Package_DFN_QFN
VQFN, 24 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/product-documents/package-drawings/24L-VQFN%E2%80%934x4x0.9mm-MJ-C04-00143b.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 22