Footprints
257 footprints matching “2.4”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
LED_SK6805_PLCC4_2.4x2.7mm_P1.3mm
LED_SMD
https://cdn-shop.adafruit.com/product-files/3484/3484_Datasheet.pdf
- Pads
- 4
- SMD
- 3.5×2.9
- Boards
- 10
TerminalBlock_Philmore_TB132_1x02_P5.00mm_Horizontal
TerminalBlock_Philmore
Terminal Block Philmore , 2 pins, pitch 5mm, size 10x10.2mm, drill diameter 1.2mm, pad diameter 2.4mm, http://www.philmore-datak.com/mc/Page%20197.pdf
- Pads
- 2
- THT
- 11.0×11.2
- Boards
- 10
QFN-28-1EP_4x4mm_P0.45mm_EP2.4x2.4mm
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=16)
- Pads
- 29
- SMD
- 5.2×5.2
- Boards
- 9
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm
Package_SO
HTSSOP, 16 Pin (Texas Instruments PWP0016C, based on JEDEC MO-153 variation ABT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd023ac/pptd023ac.pdf, https://www.ti.com/lit/ds/symlink/drv8833.pdf#page=27, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- 9
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm_ThermalVias
Package_SO
HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- 9
Texas_R-PDSO-G8_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias
Package_SO
HSOIC, 8 Pin (http://www.ti.com/lit/ds/symlink/lmr14030.pdf#page=28, http://www.ti.com/lit/ml/msoi002j/msoi002j.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 9
HVSON-8-1EP_3x3mm_P0.65mm_EP1.6x2.4mm
Package_SON
HVSON, 8 Pin (https://www.nxp.com/docs/en/data-sheet/TJA1051.pdf#page=16)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 9
WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm
Package_SON
WSON, 10 Pin (https://www.ti.com/lit/ds/symlink/tps62177.pdf)
- Pads
- 11
- SMD
- 3.3×3.5
- Boards
- 9
SolderWire-2.5sqmm_1x02_P8.8mm_D2.4mm_OD4.4mm
Connector_Wire
Soldered wire connection, for 2 times 2.5 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter
- Pads
- 2
- THT
- 14.7×5.4
- Boards
- 8
WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm
Package_DFN_QFN
WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF)
- Pads
- 9
- SMD
- 5.2×3.5
- Boards
- 8
TerminalBlock_Phoenix_PT-1,5-8-3.5-H_1x08_P3.50mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix PT-1,5-8-3.5-H, 8 pins, pitch 3.5mm, size 28x7.6mm, drill diameter 1.2mm, pad diameter 2.4mm,
- Pads
- 8
- THT
- 29.0×8.6
- Boards
- 8
WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm_ThermalVias
Package_SON
WSON, 10 Pin (https://www.ti.com/lit/ds/symlink/tps62177.pdf)
- Pads
- 11
- SMD
- 3.3×3.5
- Boards
- 7
R_Axial_Power_L20.0mm_W6.4mm_P22.40mm
Resistor_THT
Resistor, Axial_Power series, Box, pin pitch=22.4mm, 4W, length*width*height=20*6.4*6.4mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf
- Pads
- 2
- THT
- 25.3×6.9
- Boards
- 6
TerminalBlock_4Ucon_1x06_P3.50mm_Horizontal
TerminalBlock_4Ucon
Terminal Block 4Ucon ItemNo. 19964, 6 pins, pitch 3.5mm, size 21.7x7mm, drill diameter 1.2mm, pad diameter 2.4mm, http://www.4uconnector.com/online/object/4udrawing/19964.pdf
- Pads
- 6
- THT
- 22.7×8.0
- Boards
- 5
Fuseholder_Clip-5x20mm_Keystone_3512P_Inline_P23.62x7.27mm_D1.02x2.41x1.02x1.57mm_Horizontal
Fuse
Fuseholder Clips, 5x20mm Cylinder Fuse, Pins Inline, Horizontal, Keystone 3512P, http://www.keyelco.com/product-pdf.cfm?p=1386
- Pads
- 2
- THT
- 26.1×6.9
- Boards
- 4
DFN-16-1EP_4x5mm_P0.5mm_EP2.44x4.34mm
Package_DFN_QFN
DHD Package; 16-Lead Plastic DFN (5mm x 4mm) (see Linear Technology 05081707_A_DHD16.pdf)
- Pads
- 17
- SMD
- 5.0×5.6
- Boards
- 4
QFN-28-1EP_4x4mm_P0.4mm_EP2.4x2.4mm
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=280)
- Pads
- 29
- SMD
- 5.2×5.2
- Boards
- 4
TSOP-I-32_12.4x8mm_P0.5mm
Package_SO
TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BA)
- Pads
- 32
- SMD
- 15.5×8.5
- Boards
- 4
TerminalBlock_4Ucon_1x05_P3.50mm_Horizontal
TerminalBlock_4Ucon
Terminal Block 4Ucon ItemNo. 20223, 5 pins, pitch 3.5mm, size 18.2x7mm, drill diameter 1.2mm, pad diameter 2.4mm, http://www.4uconnector.com/online/object/4udrawing/20223.pdf
- Pads
- 5
- THT
- 19.2×8.0
- Boards
- 4
L_Taiyo-Yuden_NR-24xx
Inductor_SMD
Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-24xx, 2.4mmx2.4mm
- Pads
- 2
- SMD
- 3.0×3.0
- Boards
- 3
L_Toroid_Vertical_L22.4mm_W10.2mm_P7.90mm_Vishay_TJ4
Inductor_THT
L_Toroid, Vertical series, Radial, pin pitch=7.90mm, length*width=22.4*10.2mm^2, Vishay, TJ4, http://www.vishay.com/docs/34079/tj.pdf
- Pads
- 2
- THT
- 22.9×11.4
- Boards
- 3
LED_Kingbright_KPBD-3224
LED_SMD
Kingbright, dual LED, red-green, dome lens, 3.2 x 2.4 mm Surface Mount LED Lamp (https://docs.rs-online.com/b881/0900766b81396b45.pdf)
- Pads
- 4
- SMD
- 2.9×5.3
- Boards
- 3
WLCSP-20_1.934x2.434mm_Layout4x5_P0.4mm
Package_CSP
WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf
- Pads
- 20
- SMD
- 3.9×4.4
- Boards
- 3
QFN-28-1EP_4x4mm_P0.45mm_EP2.4x2.4mm_ThermalVias
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=16)
- Pads
- 29
- SMD
- 5.2×5.2
- Boards
- 3