Footprints

941 footprints matching “27mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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941 footprints · page 3 of 40

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PinSocket_1x04_P1.27mm_Vertical

FP3D

Connector_PinSocket_1.27mm

Through hole straight socket strip, 1x04, 1.27mm pitch, single row (from Kicad 4.0.7), script generated

Pads: 4
THT: 3.5×6.1
Boards: 25

HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm

FP3D

Package_SO

HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 25

SOP-24_7.5x15.4mm_P1.27mm

FP—

Package_SO

SOP, 24 Pin (http://www.issi.com/WW/pdf/31FL3218.pdf#page=14)

Pads: 24
SMD: 11.8×15.9
Boards: 25

PinHeader_1x10_P1.27mm_Vertical

FP3D

Connector_PinHeader_1.27mm

Through hole straight pin header, 1x10, 1.27mm pitch, single row

Pads: 10
THT: 3.1×13.7
Boards: 23

PinHeader_2x03_P1.27mm_Vertical_SMD

FP3D

Connector_PinHeader_1.27mm

surface-mounted straight pin header, 2x03, 1.27mm pitch, double rows

Pads: 6
SMD: 8.6×4.8
Boards: 23

PinSocket_1x02_P1.27mm_Vertical

FP3D

Connector_PinSocket_1.27mm

Through hole straight socket strip, 1x02, 1.27mm pitch, single row (from Kicad 4.0.7), script generated

Pads: 2
THT: 3.5×3.5
Boards: 23

PinSocket_1x03_P1.27mm_Vertical

FP3D

Connector_PinSocket_1.27mm

Through hole straight socket strip, 1x03, 1.27mm pitch, single row (from Kicad 4.0.7), script generated

Pads: 3
THT: 3.5×4.8
Boards: 23

Tag-Connect_TC2050-IDC-FP_2x05_P1.27mm_Vertical

FP—

Connector

Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2050-IDC-430%20Datasheet.pdf

Pads: 10
Mount: 10.3×8.5
Boards: 22

SSOP-8_3.95x5.21x3.27mm_P1.27mm

FP3D

Package_SO

SSOP-8 3.95x5.21x3.27mm Pitch 1.27mm

Pads: 8
SMD: 7.2×5.7
Boards: 22

PinHeader_2x08_P1.27mm_Vertical

FP3D

Connector_PinHeader_1.27mm

Through hole straight pin header, 2x08, 1.27mm pitch, double rows

Pads: 16
THT: 4.4×11.2
Boards: 20

HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm

FP3D

Package_SO

HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 20

WSON-8-1EP_8x6mm_P1.27mm_EP3.4x4.3mm

FP—

Package_SON

WSON, 8 Pin (https://datasheet.lcsc.com/lcsc/2204011730_GigaDevice-Semicon-Beijing-GD5F1GQ4UFYIGR_C2986324.pdf (page 44))

Pads: 9
SMD: 8.7×6.5
Boards: 20

PinHeader_2x07_P1.27mm_Vertical

FP3D

Connector_PinHeader_1.27mm

Through hole straight pin header, 2x07, 1.27mm pitch, double rows

Pads: 14
THT: 4.4×9.9
Boards: 19

SO-24_5.3x15mm_P1.27mm

FP—

Package_SO

SO, 24 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf)

Pads: 24
SMD: 9.4×15.5
Boards: 19

PinSocket_1x05_P1.27mm_Vertical

FP3D

Connector_PinSocket_1.27mm

Through hole straight socket strip, 1x05, 1.27mm pitch, single row (from Kicad 4.0.7), script generated

Pads: 5
THT: 3.5×7.3
Boards: 18

SO-16_5.3x10.2mm_P1.27mm

FP—

Package_SO

SO, 16 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf)

Pads: 16
SMD: 9.4×10.7
Boards: 17

SOIC-8_7.5x5.85mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf)

Pads: 8
SMD: 13.0×6.4
Boards: 17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.514x3.2mm

FP—

Package_SO

SOIC, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13)

Pads: 9
SMD: 7.4×5.4
Boards: 17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Pads: 9
SMD: 7.4×5.4
Boards: 16

SOIC-4_4.55x2.6mm_P1.27mm

FP—

Package_SO

SOIC, 4 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=12884&prodName=TLP291)

Pads: 4
SMD: 8.6×3.1
Boards: 15

SW_DIP_SPSTx04_Slide_Copal_CHS-04B_W7.62mm_P1.27mm

FP3D

Button_Switch_SMD

SMD 4x-dip-switch SPST Copal_CHS-04B, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD

Pads: 8
SMD: 9.7×7.0
Boards: 14