Footprints

745 footprints matching “35”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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745 footprints · page 3 of 32

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D_2512_6332Metric_Pad1.52x3.35mm_HandSolder

FP—

Diode_SMD

Diode SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads: 2
SMD: 8.0×3.9
Boards: 9

Fuse_2512_6332Metric_Pad1.52x3.35mm_HandSolder

FP—

Fuse

Fuse SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads: 2
SMD: 8.0×3.9
Boards: 9

Heatsink_Fischer_SK104-STC-STIC_35x13mm_2xDrill2.5mm

FP—

Heatsink

Heatsink, 35mm x 13mm, 2x Fixation 2,5mm Drill, Soldering, Fischer SK104-STC-STIC,

Pads: 1
THT: 35.5×13.5
Boards: 9

Heatsink_Fischer_SK104-STCB_35x13mm__2xDrill3.5mm_ScrewM3

FP—

Heatsink

Heatsink, 35mm x 13mm, 2x Fixation 2,5mm Drill, Soldering, Fischer SK104-STC-STIC,

Pads: 1
THT: 35.5×13.5
Boards: 9

BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD

FP3D

Package_BGA

121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)

Pads: 121
SMD: 11.0×11.0
Boards: 9

CP_EIA-3528-21_Kemet-B_HandSolder

FP3D

Capacitor_Tantalum_SMD

Tantalum Capacitor SMD Kemet-B (3528-21 Metric), IPC-7352 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf)

Pads: 2
SMD: 5.3×3.3
Boards: 8

DFN-6-1EP_3x2mm_P0.5mm_EP1.65x1.35mm

FP—

Package_DFN_QFN

DFN, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/(DCB6)%20DFN%2005-08-1715%20Rev%20A.pdf)

Pads: 7
SMD: 4.2×2.5
Boards: 8

QFN-20-1EP_5x5mm_P0.65mm_EP3.35x3.35mm

FP3D

Package_DFN_QFN

QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=276)

Pads: 21
SMD: 6.2×6.2
Boards: 8

SSOP-48_7.5x15.9mm_P0.635mm

FP3D

Package_SO

SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf)

Pads: 48
SMD: 11.1×16.5
Boards: 8

SW_DIP_SPSTx04_Slide_Omron_A6S-410x_W8.9mm_P2.54mm

FP3D

Button_Switch_SMD

SMD 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 8.9 mm (350 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf)

Pads: 8
SMD: 10.9×11.7
Boards: 7

Jack_6.35mm_Neutrik_NMJ4HCD2_Horizontal

FP—

Connector_Audio

M Series, 6.35mm (1/4in) mono jack, switched, with chrome ferrule and straight PCB pins, https://www.neutrik.com/en/product/nmj4hcd2

Pads: 4
THT: 27.5×20.2
Boards: 7

LED_Kingbright_AAA3528ESGCT

FP—

LED_SMD

Kingbright, dual LED, 3.5 x 2.8 mm Surface Mount LED Lamp (http://www.kingbrightusa.com/images/catalog/SPEC/AAA3528ESGCT.pdf)

Pads: 4
SMD: 4.5×3.3
Boards: 7

LGA-14_2x2mm_P0.35mm_LayoutBorder3x4y

FP3D

Package_LGA

LGA, 14 Pin (https://www.st.com/resource/en/datasheet/lis2dh12.pdf)

Pads: 14
SMD: 2.2×2.2
Boards: 7

X2SON-8_1.4x1mm_P0.35mm

FP3D

Package_SON

X2SON-8 1.4x1mm Pitch0.35mm http://www.ti.com/lit/ds/symlink/pca9306.pdf

Pads: 8
SMD: 1.7×1.9
Boards: 7

DIP-8_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 8
SMD: 12.5×10.8
Boards: 6

Mini-Circuits_CD636_LandPatternPL-035

FP—

RF_Mini-Circuits

Footprint for Mini-Circuits case CD636 (https://ww2.minicircuits.com/case_style/CD636.pdf) following land pattern PL-035, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl035.pdf)

Pads: 6
SMD: 8.1×8.4
Boards: 6

TerminalBlock_MetzConnect_Type701_RT11L02HGLU_1x02_P6.35mm_Horizontal

FP—

TerminalBlock_MetzConnect

terminal block Metz Connect Type701_RT11L02HGLU, 2 pins, pitch 6.35mm, size 12.7x12.5mm, drill diameter 1.3mm, pad diameter 2.5mm, https://www.metz-connect.com/externalfiles/317011/863830.PDF

Pads: 2
THT: 13.7×13.5
Boards: 6

DSUB-15-HD_Socket_Horizontal_P2.29x2.54mm_EdgePinOffset8.35mm_Housed_MountingHolesOffset10.89mm

FP3D

Connector_Dsub

15-pin D-Sub connector, horizontal/angled (90 deg), THT-mount, socket (female), pitch 2.29x2.54mm, pin-PCB-offset 8.35mm, distance of mounting holes 25mm, distance of mounting holes to PCB edge 10.89mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf

Pads: 16
THT: 31.9×22.6
Boards: 5

TE_MATE-N-LOK_350211-1_1x04_P5.08mm_Vertical

FP—

Connector_TE-Connectivity

https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F350211%7FU5%7Fpdf%7FEnglish%7FENG_CD_350211_U5.pdf%7F350211-1

Pads: 4
THT: 25.9×10.2
Boards: 5

D_DO-35_SOD27_P5.08mm_Vertical_AnodeUp

FP3D

Diode_THT

Diode, DO-35_SOD27 series, Axial, Vertical, pin pitch=5.08mm, length*diameter=4*2mm^2, http://www.diodes.com/_files/packages/DO-35.pdf

Pads: 2
THT: 7.4×2.5
Boards: 5

L_2512_6332Metric_Pad1.52x3.35mm_HandSolder

FP3D

Inductor_SMD

Inductor SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads: 2
SMD: 8.0×3.9
Boards: 5