Footprints

147 footprints matching “45mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

147 footprints · page 3 of 7

Matched by name and keywords. Search by meaning instead

VQFN-16-1EP_3x3mm_P0.5mm_EP1.45x1.45mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 16 Pin (http://www.ti.com/lit/ds/sbos354a/sbos354a.pdf, JEDEC MO-220 variant VEED-6)

Pads
17
SMD
4.3×4.3
Boards
1

VQFN-28-1EP_4x4mm_P0.45mm_EP2.4x2.4mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 28 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-9505-AT42-QTouch-BSW-AT42QT1060_Datasheet.pdf#page=28)

Pads
29
SMD
5.2×5.2
Boards
1

Analog_MSOP-12-16-1EP_3x4.039mm_P0.5mm_EP1.651x2.845mm

FP3D

Package_SO

Analog MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081871_d_mse16(12).pdf https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf)

Pads
13
SMD
5.6×4.5
Boards
1

Analog_MSOP-12-16-1EP_3x4.039mm_P0.5mm_EP1.651x2.845mm_ThermalVias

FP3D

Package_SO

Analog MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081871_d_mse16(12).pdf https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf)

Pads
13
SMD
5.6×4.5
Boards
1

MSOP-12-1EP_3x4.039mm_P0.65mm_EP1.651x2.845mm

FP3D

Package_SO

MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081666_g_mse12.pdf)

Pads
13
SMD
6.3×4.5
Boards
1

SOP-8-1EP_4.57x4.57mm_P1.27mm_EP4.57x4.45mm_ThermalVias

FP—

Package_SO

SOP, 8 Pin (https://ww2.minicircuits.com/case_style/XX112.pdf)

Pads
9
SMD
11.7×5.1
Boards
1

VSON-14-1EP_3x4.45mm_P0.65mm_EP1.6x4.2mm

FP—

Package_SON

VSON, 14 Pin (https://www.ti.com/lit/ds/symlink/lp8868x-q1.pdf#page=45)

Pads
15
SMD
4.3×5.0
Boards
1

TO-264-3_Vertical

FP3D

Package_TO_SOT_THT

TO-264-3, Vertical, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf

Pads
3
THT
20.5×5.8
Boards
1

TO-3P-3_Horizontal_TabUp

FP—

Package_TO_SOT_THT

TO-3P-3, Horizontal, RM 5.45mm, see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html

Pads
3
THT
16.0×25.8
Boards
1

R_1225_3264Metric_Pad1.47x6.45mm_HandSolder

FP—

Resistor_SMD

Resistor SMD 1225 (3264 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: https://www.koaspeer.com/pdfs/WK73S.pdf)

Pads
2
SMD
4.8×7.0
Boards
1

C_3640_9110Metric_Pad2.10x10.45mm_HandSolder

FP3D

Capacitor_SMD

Capacitor SMD 3640 (9110 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf)

Pads
2
SMD
11.0×11.0
Boards
—

CP_Axial_L42.0mm_D23.0mm_P45.00mm_Horizontal

FP3D

Capacitor_THT

CP, Axial series, Axial, Horizontal, pin pitch=45mm, length*diameter=42*23.0mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/42037/53d.pdf

Pads
2
THT
47.9×23.5
Boards
—

CP_Axial_L42.0mm_D29.0mm_P45.00mm_Horizontal

FP3D

Capacitor_THT

CP, Axial series, Axial, Horizontal, pin pitch=45mm, length*diameter=42*29.0mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/42037/53d.pdf

Pads
2
THT
47.9×29.5
Boards
—

CP_Axial_L42.0mm_D32.0mm_P45.00mm_Horizontal

FP3D

Capacitor_THT

CP, Axial series, Axial, Horizontal, pin pitch=45mm, length*diameter=42*32.0mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/42037/53d.pdf

Pads
2
THT
47.9×32.5
Boards
—

CP_Axial_L42.0mm_D35.0mm_P45.00mm_Horizontal

FP3D

Capacitor_THT

CP, Axial series, Axial, Horizontal, pin pitch=45mm, length*diameter=42*35.0mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/42037/53d.pdf

Pads
2
THT
47.9×35.5
Boards
—

CP_Radial_D25.0mm_P10.00mm_3pin_SnapIn

FP3D

Capacitor_THT

CP, Radial series, Radial, pin pitch=10.00mm, diameter=25mm, height=45mm, Electrolytic Capacitor, http://www.vishay.com/docs/28342/058059pll-si.pdf

Pads
2
THT
25.5×25.5
Boards
—

CP_Radial_D26.0mm_P10.00mm_3pin_SnapIn

FP3D

Capacitor_THT

CP, Radial series, Radial, pin pitch=10.00mm, diameter=26mm, height=45mm, Electrolytic Capacitor, http://www.vishay.com/docs/28342/058059pll-si.pdf

Pads
2
THT
26.5×26.5
Boards
—

CP_Radial_D30.0mm_P10.00mm_3pin_SnapIn

FP3D

Capacitor_THT

CP, Radial series, Radial, pin pitch=10.00mm, diameter=30mm, height=45mm, Electrolytic Capacitor, http://www.vishay.com/docs/28342/058059pll-si.pdf

Pads
2
THT
30.5×30.5
Boards
—

NXP XSON6 - 1X1.45mm SOT886

FP—

celestial-altium-Leadless_SON

XSON, 6-Leads, Body 1.45x1.00mm, Pitch 0.50mm

Pads
6
SMD
1.4×1.8
Boards
—

TFBGA-126_10.5x13.5mm_Layout12x16_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 126 balls (JEDEC MO-210Q), 13.5x10.5mm, 126 Ball, 12x16 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads
126
SMD
12.5×15.5
Boards
—

TFBGA-128_11x13mm_Layout12x12_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 128 balls (JEDEC MO-210Q), 13.0x11.0mm, 128 Ball, 12x12 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads
128
SMD
13.0×15.0
Boards
—

TFBGA-136_10x14mm_Layout12x17_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 136 balls (JEDEC MO-210Q), 14.0x10.0mm, 136 Ball, 12x17 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads
136
SMD
12.0×16.0
Boards
—

TFBGA-144_10.5x14mm_Layout11x17_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 144 balls (JEDEC MO-210Q), 14.0x10.5mm, 144 Ball, 11x17 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads
144
SMD
12.5×16.0
Boards
—

TFBGA-144_10x14mm_Layout11x17_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 144 balls (JEDEC MO-210Q), 14.0x10.0mm, 144 Ball, 11x17 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads
144
SMD
12.0×16.0
Boards
—