Footprints

63 footprints matching “75mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

63 footprints · page 3 of 3

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WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias

FP3D

Package_DFN_QFN

WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)

Pads: 21
SMD: 5.3×5.3
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153 https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-tssop/tssop_38_05-08-1865.pdf)

Pads: 39
SMD: 7.7×10.2
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm_ThermalVias

FP—

Package_SO

Pads: 39
SMD: 7.7×10.2
Boards: —

Linear_HTSSOP-31-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm

FP—

Package_SO

Linear HTSSOP, 31 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-tssop/tssop_38_05-08-1865.pdf)

Pads: 32
SMD: 7.1×10.2
Boards: —

Linear_HTSSOP-31-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm_ThermalVias

FP—

Package_SO

Linear HTSSOP, 31 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-tssop/tssop_38_05-08-1865.pdf)

Pads: 32
SMD: 7.1×10.2
Boards: —

Renesas_SOP-32_11.4x20.75mm_P1.27mm

FP—

Package_SO

Renesas SOP, 32 Pin (https://www.renesas.com/en/document/psc/package-drawing-sop-32pin-prsp0032df)

Pads: 32
SMD: 15.6×21.3
Boards: —

SOJ-24_7.62x15.875mm_P1.27mm

FP—

Package_SO

SOJ, 24 Pin (JEDEC MS-023-A, 300 mils width, variation AA, https://www.jedec.org/system/files/docs/Ms-023a.pdf)

Pads: 24
SMD: 9.8×16.4
Boards: —

SOJ-44_10.16x28.575mm_P1.27mm

FP—

Package_SO

SOJ, 44 Pin (JEDEC MS-027-A, 400 mils width, variation AH, https://www.jedec.org/system/files/docs/Ms-027a.pdf)

Pads: 44
SMD: 12.6×29.1
Boards: —

TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.74x4.75mm_ThermalVias

FP—

Package_SO

TSSOP, 28 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3762.pdf)

Pads: 29
SMD: 7.7×10.2
Boards: —

VSO-56_11.1x21.5mm_P0.75mm

FP3D

Package_SO

VSO56: plastic very small outline package; 56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf)

Pads: 56
SMD: 16.6×22.2
Boards: —

TO-218-3_Horizontal_TabUp

FP—

Package_TO_SOT_THT

TO-218-3, Horizontal, RM 5.475mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf

Pads: 3
THT: 15.4×24.6
Boards: —

R_1218_3246Metric_Pad1.22x4.75mm_HandSolder

FP3D

Resistor_SMD

Resistor SMD 1218 (3246 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20035/dcrcwe3.pdf)

Pads: 2
SMD: 4.9×5.3
Boards: —

R_Axial_Power_L75.0mm_W9.0mm_P81.28mm

FP3D

Resistor_THT

Resistor, Axial_Power series, Box, pin pitch=81.28mm, 17W, length*width*height=75*9*9mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf

Pads: 2
THT: 84.2×9.5
Boards: —

R_Axial_Power_L75.0mm_W9.0mm_P86.36mm

FP3D

Resistor_THT

Resistor, Axial_Power series, Box, pin pitch=86.36mm, 17W, length*width*height=75*9*9mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf

Pads: 2
THT: 89.3×9.5
Boards: —

TerminalBlock_MetzConnect_Type086_RT03405HBLC_1x05_P3.81mm_Horizontal

FP—

TerminalBlock_MetzConnect

terminal block Metz Connect Type086_RT03405HBLC, 5 pins, pitch 3.81mm, size 18.9x7.3mm, drill diameter 1.1mm, pad diameter 1.75mm, https://www.metz-connect.com/externalfiles/310861/863404.PDF

Pads: 5
THT: 19.9×8.3
Boards: —