Footprints

3,181 footprints matching “Package”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints on their own, whether or not a symbol uses them.

3,181 footprints · page 3 of 133

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QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm

Package_DFN_QFN

QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)

Pads: 25
SMD: 5.2×5.2
Boards: 256

TSOT-23-5

Package_TO_SOT_SMD

TSOT, 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AB)

Pads: 5
SMD: 4.1×3.4
Boards: 256

DIP-4_W7.62mm

Package_DIP

4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 4
THT: 9.7×5.6
Boards: 252

QFN-48-1EP_7x7mm_P0.5mm_EP5.6x5.6mm

Package_DFN_QFN

QFN, 48 Pin (http://www.st.com/resource/en/datasheet/stm32f042k6.pdf#page=94)

Pads: 49
SMD: 8.3×8.3
Boards: 245

SSOP-28_5.3x10.2mm_P0.65mm

Package_SO

SSOP, 28 Pin (JEDEC MO-150 variation AH, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=400)

Pads: 28
SMD: 9.4×10.7
Boards: 244

DIP-8_W7.62mm_LongPads

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 8
THT: 10.5×10.7
Boards: 242

TSSOP-24_4.4x7.8mm_P0.65mm

Package_SO

TSSOP, 24 Pin (JEDEC MO-153 variation AD, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 24
SMD: 7.7×8.3
Boards: 242

DIP-20_W7.62mm_Socket

Package_DIP

20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 20
THT: 10.7×26.0
Boards: 227

Crystal_SMD_HC49-SD

Crystal

HC-49-SD, Crystal, 11.4x4.7mm package, SMD, http://cdn-reichelt.de/documents/datenblatt/B400/xxx-HC49-SMD.pdf

Pads: 2
SMD: 13.5×5.7
Boards: 225

DIP-14_W7.62mm_Socket_LongPads

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 14
THT: 10.7×18.4
Boards: 225

TO-263-5_TabPin3

Package_TO_SOT_SMD

TO-263/D2PAK/DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-5-1/

Pads: 5
SMD: 16.6×11.3
Boards: 217

DIP-14_W7.62mm_LongPads

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 14
THT: 10.5×18.3
Boards: 205

DIP-16_W7.62mm_LongPads

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 16
THT: 10.5×20.8
Boards: 199

SOT-666

Package_TO_SOT_SMD

SOT666

Pads: 6
SMD: 3.0×2.2
Boards: 194

Crystal_SMD_5032-2Pin_5.0x3.2mm

Crystal

SMD2520/2, Crystal, 5.0x3.2mm package, SMD, http://www.icbase.com/File/PDF/HKC/HKC00061008.pdf

Pads: 2
SMD: 6.2×4.2
Boards: 192

DIP-16_W7.62mm_Socket_LongPads

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 16
THT: 10.7×20.9
Boards: 189

Crystal_SMD_3225-4Pin_3.2x2.5mm_HandSoldering

Crystal

SMD3225/4, Crystal, 3.2x2.5mm package, SMD, hand-soldering, http://www.txccrystal.com/images/pdf/7m-accuracy.pdf

Pads: 4
SMD: 5.5×4.6
Boards: 187

SOIC-28W_7.5x17.9mm_P1.27mm

Package_SO

SOIC, 28 Pin (JEDEC MS-013AE, https://www.analog.com/media/en/package-pcb-resources/package/35833120341221rw_28.pdf)

Pads: 28
SMD: 11.9×18.4
Boards: 186

Crystal_SMD_2520-4Pin_2.5x2.0mm

Crystal

SMD2520/4, Crystal, 2.5x2.0mm package, SMD, http://www.newxtal.com/UploadFiles/Images/2012-11-12-09-29-09-776.pdf

Pads: 4
SMD: 3.5×3.0
Boards: 185

LQFP-32_7x7mm_P0.8mm

Package_QFP

LQFP, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT358-1.pdf)

Pads: 32
SMD: 10.4×10.4
Boards: 185

TO-92

Package_TO_SOT_THT

TO-92 leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.5×4.7
Boards: 181

DIP-40_W15.24mm_Socket

Package_DIP

40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket

Pads: 40
THT: 18.3×51.4
Boards: 179

TSSOP-8_4.4x3mm_P0.65mm

Package_SO

TSSOP, 8 Pin (JEDEC MO-153 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 8
SMD: 7.7×3.5
Boards: 179

DIP-8_W7.62mm_Socket_LongPads

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 8
THT: 10.7×10.8
Boards: 178