Footprints

74 footprints matching “Pak”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

74 footprints · page 3 of 4

Matched by name and keywords. Search by meaning instead

IRF TO-263-7

FP—

celestial-altium-Leaded_Misc

D2-PAK, 7-Pads, Body 7.82x8.52mm (max), IPC Medium Density

Pads
7
SMD
17.1×11.3
Boards
—

NXP LFPAK56 SOT669

FP—

celestial-altium-Leaded_Misc

Pads
5
SMD
7.4×5.2
Boards
—

ST TO-263-7

FP—

celestial-altium-Leaded_Misc

D2-PAK, 7-Pads, Body 7.82x8.52mm (max), IPC Medium Density

Pads
7
SMD
18.0×13.0
Boards
—

TI TO-263-3 KTT

FP—

celestial-altium-Leaded_Misc

D2-PAK, 4-Pads, Body 7.93x8.70mm (max), IPC Medium Density

Pads
4
SMD
17.8×10.6
Boards
—

NEXPERIA LFPAK33 SOT1210

FP—

celestial-altium-Leadless_LFPAK

Pads
3
SMD
3.8×4.4
Boards
—

NEXPERIA MLPAK33 SOT8002-1

FP—

celestial-altium-Leadless_MLPAK

Pads
3
SMD
3.8×4.4
Boards
—

Heatsink_AAVID_573100_TO-252

FP—

gekkio-Gekkio_Heatsink

Surface mount heat sink for D-PAK (TO-252) package semiconductors

Pads
1
SMD
23.7×9.7
Boards
—

Heatsink_Fischer_FK24413DPAK_23x13mm

FP—

Heatsink

23x13 mm SMD heatsink for TO-252 TO-263 TO-268, https://www.fischerelektronik.de/pim/upload/fischerData/cadpdf/base/fk_244_13_d_pak.pdf

Pads
1
SMD
24.0×14.0
Boards
—

Vishay_PowerPAK_MLP44-24L

FP3D

Package_DFN_QFN

PowerPAK PowerPAK MLP44-24L (https://www.vishay.com/docs/78231/mlp44-24l.pdf)

Pads
28
SMD
5.1×5.1
Boards
—

Vishay_PowerPAK_MLP44-24L_ThermalVias

FP3D

Package_DFN_QFN

PowerPAK PowerPAK MLP44-24L (https://www.vishay.com/docs/78231/mlp44-24l.pdf)

Pads
28
SMD
5.1×5.1
Boards
—

Vishay_PowerPAK_MLP55-27L

FP—

Package_DFN_QFN

MLP55-27L (https://www.vishay.com/docs/75269/ppak_mlp55-27l.pdf)

Pads
22
SMD
6.5×6.5
Boards
—

Vishay_PowerPAK_MLP55-27L_R

FP—

Package_DFN_QFN

MLP55-27L_R (https://www.vishay.com/docs/75269/ppak_mlp55-27l.pdf)

Pads
22
SMD
6.5×6.5
Boards
—

Vishay_PowerPAK_MLP55-27L_R_ThermalVias

FP—

Package_DFN_QFN

MLP55-27L_R (https://www.vishay.com/docs/75269/ppak_mlp55-27l.pdf)

Pads
23
SMD
6.5×6.5
Boards
—

Vishay_PowerPAK_MLP55-27L_ThermalVias

FP—

Package_DFN_QFN

MLP55-27L (https://www.vishay.com/docs/75269/ppak_mlp55-27l.pdf)

Pads
23
SMD
6.5×6.5
Boards
—

IXYS_Flatpak-8_6.3x9.7mm_P2.54mm

FP3D

Package_DIP

IXYS Flatpak, 8 Pin (https://www.littelfuse.com/media?resourcetype=datasheets&itemid=996c6e8f-cc1b-44f6-811e-251c6e004c56&filename=littelfuse-integrated-circuits-loc112-datasheet)

Pads
8
SMD
10.8×10.2
Boards
—

IXYS_SMD-8_6.3x9.7mm_P2.54mm

FP3D

Package_DIP

IXYS Flatpak, 8 Pin (https://www.littelfuse.com/media?resourcetype=datasheets&itemid=996c6e8f-cc1b-44f6-811e-251c6e004c56&filename=littelfuse-integrated-circuits-loc112-datasheet)

Pads
8
SMD
11.1×10.2
Boards
—

Infineon_PG-HDSOP-10-1

FP—

Package_TO_SOT_SMD

Infineon PG-HDSOP-10-1 (DDPAK), 20.96x6.5x2.3mm, slug up (https://www.infineon.com/cms/en/product/packages/PG-HDSOP/PG-HDSOP-10-1/)

Pads
10
SMD
22.4×7.0
Boards
—

TO-263-4

FP3D

Package_TO_SOT_SMD

TO-263/D2PAK/DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-5-1/

Pads
5
SMD
16.6×11.3
Boards
—

TO-263-6

FP3D

Package_TO_SOT_SMD

TO-263/D2PAK/DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-7-1/

Pads
7
SMD
16.6×11.3
Boards
—

TO-263-9_TabPin10

FP3D

Package_TO_SOT_SMD

TO-263 / D2PAK / DDPAK SMD package, http://www.ti.com/lit/ds/symlink/lm4755.pdf

Pads
10
SMD
16.6×11.3
Boards
—

TO-263-9_TabPin5

FP3D

Package_TO_SOT_SMD

TO-263 / D2PAK / DDPAK SMD package, http://www.ti.com/lit/ds/symlink/lm4755.pdf

Pads
9
SMD
16.6×11.3
Boards
—

TO-251-2_Vertical

FP3D

Package_TO_SOT_THT

TO-251-2, Vertical, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf

Pads
2
THT
7.1×2.8
Boards
—

TO-251-2-1EP_Horizontal_TabDown

FP3D

Package_TO_SOT_THT

TO-251-2, Horizontal, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf

Pads
3
THT
7.1×11.9
Boards
—

TO-262-3-1EP_Horizontal_TabDown

FP3D

Package_TO_SOT_THT

TO-262-3, Horizontal, RM 2.54mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF

Pads
4
THT
10.5×16.5
Boards
—