Footprints

1,686 footprints matching “Q”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,686 footprints · page 3 of 71

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TQFN-16-1EP_3x3mm_P0.5mm_EP1.23x1.23mm

FP—

Package_DFN_QFN

TQFN, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0136.PDF (T1633-5), https://pdfserv.maximintegrated.com/land_patterns/90-0032.PDF)

Pads: 17
SMD: 4.2×4.2
Boards: 38

QFN-56-1EP_7x7mm_P0.4mm_EP5.6x5.6mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (http://www.cypress.com/file/416486/download#page=40)

Pads: 57
SMD: 8.3×8.3
Boards: 34

Oscillator_SMD_EuroQuartz_XO32-4Pin_3.2x2.5mm

FP—

Oscillator

Miniature Crystal Clock Oscillator EuroQuartz XO32 series, http://cdn-reichelt.de/documents/datenblatt/B400/XO32.pdf, 3.2x2.5mm^2 package

Pads: 4
SMD: 3.0×3.8
Boards: 33

VQFN-16-1EP_3x3mm_P0.5mm_EP1.68x1.68mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/tlv62095.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 33

TestPoint_THTPad_2.5x2.5mm_Drill1.2mm

FP—

TestPoint

THT rectangular pad as test Point, square 2.5mm side length, hole diameter 1.2mm

Pads: 1
THT: 3.5×3.5
Boards: 32

QFN-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm

FP3D

Package_DFN_QFN

QFN, 16 Pin (http://www.thatcorp.com/datashts/THAT_1580_Datasheet.pdf)

Pads: 17
SMD: 5.3×5.3
Boards: 30

QFN-28_4x4mm_P0.5mm

FP—

Package_DFN_QFN

QFN, 28 Pin (http://www.st.com/resource/en/datasheet/stm32f031k6.pdf#page=90)

Pads: 28
SMD: 5.3×5.3
Boards: 30

QFN-28-1EP_6x6mm_P0.65mm_EP4.25x4.25mm

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=289)

Pads: 29
SMD: 7.2×7.2
Boards: 30

Panasonic_EVQPUL_EVQPUC

FP3D

Button_Switch_SMD

http://industrial.panasonic.com/cdbs/www-data/pdf/ATV0000/ATV0000CE5.pdf

Pads: 2
SMD: 7.8×5.5
Boards: 29

SolderWire-0.5sqmm_1x01_D0.9mm_OD2.1mm

FP—

Connector_Wire

Soldered wire connection, for a single 0.5 mm² wire, basic insulation, conductor diameter 0.9mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 1
THT: 3.6×3.2
Boards: 29

SolderWire-2sqmm_1x01_D2mm_OD3.9mm

FP—

Connector_Wire

Soldered wire connection, for a single 2 mm² wire, reinforced insulation, conductor diameter 2mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.0 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads: 1
THT: 5.4×4.9
Boards: 29

SolderWire-0.1sqmm_1x01_D0.4mm_OD1mm

FP—

Connector_Wire

Soldered wire connection, for a single 0.1 mm² wire, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.10 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 1
THT: 2.6×2.6
Boards: 28

SolderWire-0.1sqmm_1x02_P3.6mm_D0.4mm_OD1mm

FP—

Connector_Wire

Soldered wire connection, for 2 times 0.1 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.10 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 2
THT: 6.2×2.6
Boards: 28

LQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

LQFP, 44 Pin (JEDEC MS-026 variation BCB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.nxp.com.cn/docs/en/package-information/98ASS23225W.pdf)

Pads: 44
SMD: 13.3×13.3
Boards: 27