Footprints
1,408 footprints matching “T-1”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TerminalBlock_Phoenix_PT-1,5-3-5.0-H_1x03_P5.00mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix PT-1,5-3-5.0-H, 3 pins, pitch 5mm, size 15x9mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.mouser.com/ds/2/324/ItemDetail_1935161-922578.pdf
- Pads
- 3
- THT
- 16.0×10.0
- Boards
- 43
QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
Package_DFN_QFN
QFN, 24 Pin (https://www.alldatasheet.com/datasheet-pdf/pdf/1159021/ALFA/AS3330.html)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 41
QFN-36-1EP_6x6mm_P0.5mm_EP3.7x3.7mm
Package_DFN_QFN
QFN, 36 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/36L_QFN_6x6_with_3_7x3_7_EP_Punch_Dimpled_4E_C04-0241A.pdf)
- Pads
- 37
- SMD
- 7.2×7.2
- Boards
- 40
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm_ThermalVias
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 40
QFN-32-1EP_5x5mm_P0.5mm_EP3.6x3.6mm
Package_DFN_QFN
QFN, 32 Pin (http://infocenter.nordicsemi.com/pdf/nRF52810_PS_v1.1.pdf#page=468)
- Pads
- 33
- SMD
- 6.2×6.2
- Boards
- 39
WQFN-14-1EP_2.5x2.5mm_P0.5mm_EP1.45x1.45mm
Package_DFN_QFN
WQFN, 14 Pin (https://www.onsemi.com/pub/Collateral/FUSB302B-D.PDF#page=32)
- Pads
- 15
- SMD
- 3.7×3.7
- Boards
- 39
SSOP-20_4.4x6.5mm_P0.65mm
Package_SO
SSOP, 20 Pin (https://www.jedec.org/system/files/docs/Mo-152c.pdf)
- Pads
- 20
- SMD
- 7.8×7.0
- Boards
- 39
Winbond_USON-8-1EP_3x2mm_P0.5mm_EP0.2x1.6mm
Package_SON
Winbond USON, 8 Pin (https://www.lcsc.com/datasheet/lcsc_datasheet_2205122030_Winbond-Elec-W25Q16JVUXIQ_C2843335.pdf#page=66f)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 39
L_Axial_L5.3mm_D2.2mm_P7.62mm_Horizontal_Vishay_IM-1
Inductor_THT
Inductor, Axial series, Axial, Horizontal, pin pitch=7.62mm, length*diameter=5.3*2.2mm^2, Vishay, IM-1, http://www.vishay.com/docs/34030/im.pdf
- Pads
- 2
- THT
- 9.7×2.7
- Boards
- 38
TQFN-16-1EP_3x3mm_P0.5mm_EP1.23x1.23mm
Package_DFN_QFN
TQFN, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0136.PDF (T1633-5), https://pdfserv.maximintegrated.com/land_patterns/90-0032.PDF)
- Pads
- 17
- SMD
- 4.2×4.2
- Boards
- 38
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm_ThermalVias
Package_SO
SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 38
WSON-8-1EP_6x5mm_P1.27mm_EP3.4x4mm
Package_SON
WSON, 8 Pin (http://ww1.microchip.com/downloads/en/AppNotes/S72030.pdf)
- Pads
- 9
- SMD
- 6.6×5.5
- Boards
- 38
TerminalBlock_Phoenix_PT-1,5-3-3.5-H_1x03_P3.50mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix PT-1,5-3-3.5-H, 3 pins, pitch 3.5mm, size 10.5x7.6mm, drill diameter 1.2mm, pad diameter 2.4mm,
- Pads
- 3
- THT
- 11.5×8.6
- Boards
- 38
QFN-56-1EP_7x7mm_P0.4mm_EP5.6x5.6mm
Package_DFN_QFN
QFN, 56 Pin (http://www.cypress.com/file/416486/download#page=40)
- Pads
- 57
- SMD
- 8.3×8.3
- Boards
- 34
Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias
Package_SO
Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)
- Pads
- 9
- SMD
- 7.5×5.5
- Boards
- 34
VQFN-16-1EP_3x3mm_P0.5mm_EP1.68x1.68mm_ThermalVias
Package_DFN_QFN
VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/tlv62095.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 33
SSOP-10-1EP_3.9x4.9mm_P1mm_EP2.1x3.3mm
Package_SO
SSOP, 10 Pin (http://download.py32.org/%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C/zh-CN/PY32F002A%20%E7%B3%BB%E5%88%97%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C_Rev1.0.pdf#page=44)
- Pads
- 11
- SMD
- 7.5×5.4
- Boards
- 33
DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
Package_DFN_QFN
6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 7
- SMD
- 3.3×2.5
- Boards
- 32
DFN-6-1EP_3x3mm_P1mm_EP1.5x2.4mm
Package_DFN_QFN
DFN, 6 Pin (https://www.silabs.com/documents/public/data-sheets/Si7020-A20.pdf)
- Pads
- 7
- SMD
- 4.2×3.5
- Boards
- 31
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm_ThermalVias
Package_SO
HTSSOP, 16 Pin (Texas Instruments PWP0016C, based on JEDEC MO-153 variation ABT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd023ac/pptd023ac.pdf, https://www.ti.com/lit/ds/symlink/drv8833.pdf#page=27, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- 31
QFN-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm
Package_DFN_QFN
QFN, 16 Pin (http://www.thatcorp.com/datashts/THAT_1580_Datasheet.pdf)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 30
QFN-28-1EP_6x6mm_P0.65mm_EP4.25x4.25mm
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=289)
- Pads
- 29
- SMD
- 7.2×7.2
- Boards
- 30
TO-220-5_P3.4x3.7mm_StaggerOdd_Lead3.8mm_Vertical
Package_TO_SOT_THT
TO-220-5, Vertical, RM 1.7mm, Pentawatt, staggered type-1, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421.pdf?domain=www.linear.com, https://www.diodes.com/assets/Package-Files/TO220-5.pdf
- Pads
- 5
- THT
- 10.5×9.6
- Boards
- 29
Potentiometer_Piher_PT-10-V10_Vertical
Potentiometer_THT
Potentiometer, vertical, Piher PT-10-V10, http://www.piher-nacesa.com/pdf/12-PT10v03.pdf
- Pads
- 3
- THT
- 12.8×10.8
- Boards
- 29