Footprints
857 footprints matching “x4”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
QFN-64-1EP_9x9mm_P0.5mm_EP4.35x4.35mm
Package_DFN_QFN
QFN, 64 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT2232H.pdf#page=57)
- Pads
- 65
- SMD
- 10.2×10.2
- Boards
- 18
VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm
Package_DFN_QFN
VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 18
QFN-48-1EP_6x6mm_P0.4mm_EP4.6x4.6mm
Package_DFN_QFN
QFN, 48 Pin (http://infocenter.nordicsemi.com/pdf/nRF51822_PS_v3.3.pdf#page=67)
- Pads
- 49
- SMD
- 7.2×7.2
- Boards
- 17
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 17
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.514x3.2mm
Package_SO
SOIC, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 17
TestPoint_THTPad_4.0x4.0mm_Drill2.0mm
TestPoint
THT rectangular pad as test Point, square 4.0mm side length, hole diameter 2.0mm
- Pads
- 1
- THT
- 5.0×5.0
- Boards
- 17
QFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
Package_DFN_QFN
QFN, 20 Pin (https://www.silabs.com/documents/public/data-sheets/Si5351-B.pdf)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 16
VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm_ThermalVias
Package_DFN_QFN
VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 16
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias
Package_SO
SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 16
SW_DIP_SPSTx01_Slide_6.7x4.1mm_W8.61mm_P2.54mm_LowProfile
Button_Switch_SMD
SMD 1x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 6.7x4.1mm (see e.g. https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile
- Pads
- 2
- SMD
- 11.6×4.7
- Boards
- 15
CP_Elec_6.3x4.5
Capacitor_SMD
SMD capacitor, aluminum electrolytic, Nichicon, 6.3x4.5mm
- Pads
- 2
- SMD
- 9.4×7.1
- Boards
- 15
QFN-16-1EP_4x4mm_P0.65mm_EP2.5x2.5mm
Package_DFN_QFN
QFN, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266)
- Pads
- 17
- SMD
- 5.2×5.2
- Boards
- 15
QFN-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=164)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 15
QFN-28-1EP_6x6mm_P0.65mm_EP4.8x4.8mm
Package_DFN_QFN
QFN, 28 Pin (https://semtech.my.salesforce.com/sfc/p/#E0000000JelG/a/440000001NCE/v_VBhk1IolDgxwwnOpcS_vTFxPfSEPQbuneK3mWsXlU page=125)
- Pads
- 29
- SMD
- 7.3×7.3
- Boards
- 14
HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm_ThermalVias
Package_SO
HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 14
SW_Push_1P1T_NO_CK_PTS125Sx43PSMTR
Button_Switch_SMD
Tactile switch, 12x12 mm, H4.3 mm, round actuator, with pegs, gullwing terminals, https://www.ckswitches.com/media/1462/pts125.pdf
- Pads
- 2
- SMD
- 16.8×12.5
- Boards
- 13
QFN-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm
Package_DFN_QFN
QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=295)
- Pads
- 41
- SMD
- 7.2×7.2
- Boards
- 13
HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.3x2.3mm
Package_SO
HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l7980.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 13
Crystal_SMD_ECS_CSM3X-2Pin_7.6x4.1mm
Crystal
http://www.ecsxtal.com/store/pdf/CSM-3X.pdf
- Pads
- 2
- SMD
- 9.5×4.6
- Boards
- 12
QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 12
QFN-36-1EP_6x6mm_P0.5mm_EP4.1x4.1mm
Package_DFN_QFN
QFN, 36 Pin (www.st.com/resource/en/datasheet/stm32f101t6.pdf#page=72)
- Pads
- 37
- SMD
- 7.3×7.3
- Boards
- 12
USON-20_2x4mm_P0.4mm
Package_SON
USON-20 2x4mm Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf
- Pads
- 20
- SMD
- 3.3×4.5
- Boards
- 12
R_2816_7142Metric_Pad3.20x4.45mm_HandSolder
Resistor_SMD
Resistor SMD 2816 (7142 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size from: https://www.vishay.com/docs/30100/wsl.pdf)
- Pads
- 2
- SMD
- 8.9×5.0
- Boards
- 12
CP_Elec_6.3x4.9
Capacitor_SMD
SMD capacitor, aluminum electrolytic, Panasonic C5, 6.3x4.9mm
- Pads
- 2
- SMD
- 9.6×7.1
- Boards
- 11