Footprints

5,977 footprints matching “8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

5,977 footprints · page 31 of 250

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QFN-28-1EP_4x5mm_P0.5mm_EP2.65x3.65mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 28 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/3555fe.pdf#page=32)

Pads: 29
SMD: 5.3×6.3
Boards: 6

QFN-48-1EP_6x6mm_P0.4mm_EP4.2x4.2mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 48 Pin (https://static.dev.sifive.com/SiFive-FE310-G000-datasheet-v1p5.pdf#page=20)

Pads: 49
SMD: 7.3×7.3
Boards: 6

DIP-8_W10.16mm_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 8
THT: 13.1×10.7
Boards: 6

DIP-8_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 8
SMD: 12.5×10.8
Boards: 6

SMDIP-6_W9.53mm_Clearance8mm

FP3D

Package_DIP

6-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads: 6
SMD: 11.5×8.1
Boards: 6

SMDIP-8_W7.62mm

FP3D

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 8
SMD: 10.1×10.7
Boards: 6

LQFP-48-1EP_7x7mm_P0.5mm_EP3.6x3.6mm_ThermalVias

FP3D

Package_QFP

LQFP, 48 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/LTC7810.pdf)

Pads: 49
SMD: 10.3×10.3
Boards: 6

SIP3_11.6x8.5mm

FP—

Package_SIP

RECOM,R78EXX,https://www.recom-power.com/pdf/Innoline/R-78Exx-0.5.pdf

Pads: 3
THT: 12.2×9.1
Boards: 6

PowerPAK_SO-8_Dual

FP—

Package_SO

PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf)

Pads: 6
SMD: 7.1×5.5
Boards: 6

TSOP-I-28_11.8x8mm_P0.55mm

FP3D

Package_SO

TSOP I, 28 pins, 18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf)

Pads: 28
SMD: 14.9×8.7
Boards: 6

WSON-8-1EP_3x3mm_P0.5mm_EP1.2x2mm

FP—

Package_SON

WSON, 8 Pin (http://www.ti.com/lit/ds/symlink/lp2951.pdf#page=27)

Pads: 9
SMD: 4.3×3.5
Boards: 6

Infineon_PG-HSOF-8-1

FP3D

Package_TO_SOT_SMD

HSOF-8-1 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-1/)

Pads: 3
SMD: 13.8×10.6
Boards: 6

Infineon_PG-HSOF-8-1_ThermalVias

FP3D

Package_TO_SOT_SMD

HSOF-8-1 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-1/)

Pads: 3
SMD: 13.8×10.6
Boards: 6

Nexperia_CFP15_SOT-1289

FP—

Package_TO_SOT_SMD

Nexperia CFP15 (SOT-1289), https://assets.nexperia.com/documents/outline-drawing/SOT1289.pdf

Pads: 3
SMD: 7.5×4.8
Boards: 6

SOT-89-5

FP—

Package_TO_SOT_SMD

SOT-89-5, http://www.e-devices.ricoh.co.jp/en/products/product_power/pkg/sot-89-5.pdf

Pads: 5
SMD: 5.7×5.0
Boards: 6

TO-252-3_TabPin4

FP3D

Package_TO_SOT_SMD

TO-252/DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/

Pads: 4
SMD: 11.1×7.0
Boards: 6

R_Axial_Power_L25.0mm_W6.4mm_P30.48mm

FP3D

Resistor_THT

Resistor, Axial_Power series, Box, pin pitch=30.48mm, 5W, length*width*height=25*6.4*6.4mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf

Pads: 2
THT: 33.4×6.9
Boards: 6

KiCad-Logo2_8mm_Copper

FP—

Symbol

KiCad Logo

Pads: —
Mount: exclude_from_pos_files
Boards: 6

TerminalBlock_Phoenix_MKDS-1,5-5_1x05_P5.00mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix MKDS-1,5-5, 5 pins, pitch 5mm, size 25x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf

Pads: 5
THT: 26.0×10.8
Boards: 6

TerminalBlock_Xinya_XY308-2.54-8P_1x08_P2.54mm_Horizontal

FP—

TerminalBlock

Terminal Block Xinya XY308-2.54-8P, 8 pins, pitch 2.54mm, size 20.8x6.5mm, drill diameter 1.2mm, pad diameter 2mm, http://www.xinyaelectronic.com/product/xy308-254

Pads: 8
THT: 21.8×7.5
Boards: 6

Valve_ECC-83-2

FP—

Valve

Valve ECC-83-2 flat pins

Pads: 9
THT: 21.0×21.0
Boards: 6

SW_DIP_SPSTx01_Slide_Copal_CHS-01A_W5.08mm_P1.27mm_JPin

FP3D

Button_Switch_SMD

SMD 1x-dip-switch SPST Copal_CHS-01A, Slide, row spacing 5.08 mm (200 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin

Pads: 2
SMD: 7.2×3.2
Boards: 5