Footprints
848 footprints matching “Power”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
BL-R8812AF1
muratovas-MAS_Package_nostd
5G high-power dual frequency module. 802.11a/b/g/n/ac
- Pads
- 12
- SMD
- 18.3×29.5
- Boards
- —
SMDL_7.1x6.6x5mm
muratovas-MAS_Package_nostd
Power inductor SMD 0530 (5.4x5.2x3mm)
- Pads
- 2
- SMD
- 8.9×7.0
- Boards
- —
10-PowerVFQFN
muratovas-MAS_Package_std
- Pads
- 17
- SMD
- 11.0×14.0
- Boards
- —
Molex_Mini-Fit_Jr_15-24-7043_2x02_P4.20mm_Vertical
muratovas-MAS_Package_std
Molex Mini-Fit Jr. Power Connectors
- Pads
- 4
- THT
- 16.8×10.6
- Boards
- —
Molex_Mini-Fit_Jr_5566-04A_2x02_P4.20mm_Vertical
muratovas-MAS_Package_std
Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-04A, example for new mpn: 39-28-x04x, 2 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator
- Pads
- 4
- THT
- 10.6×12.0
- Boards
- —
Molex_Mini-Fit_Jr_5569-04A2_2x02_P4.20mm_Horizontal
muratovas-MAS_Package_std
Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5569-04A2, example for new mpn: 39-30-0040, 2 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039300020_sd.pdf), generated with kicad-footprint-generator
- Pads
- 4
- THT
- 10.6×22.3
- Boards
- —
Power_inductor_SMD_0530
muratovas-MAS_Package_std
Power inductor SMD 0530 (5.4x5.2x3mm)
- Pads
- 2
- SMD
- 6.6×5.6
- Boards
- —
EPC_QFN-13-3EP_3.5x5mm_P0.5mm
Package_DFN_QFN
EPC QFN-13, 5.0x3.5mm, Pitch 0.5mm, https://epc-co.com/epc/Portals/0/epc/documents/datasheets/EPC23102_datasheet.pdf
- Pads
- 13
- SMD
- 6.1×4.6
- Boards
- —
Texas_RDX0007A_QFN-FCMOD-7-3.3x4mm-P0.5mm_4EP
Package_DFN_QFN
surface-mount, Texas Instruments, power, DC/DC, https://www.ti.com/lit/ml/mpqf721/mpqf721.pdf
- Pads
- 7
- SMD
- 4.6×4.8
- Boards
- —
Vishay_PowerPAK_MLP44-24L
Package_DFN_QFN
PowerPAK PowerPAK MLP44-24L (https://www.vishay.com/docs/78231/mlp44-24l.pdf)
- Pads
- 28
- SMD
- 5.1×5.1
- Boards
- —
Vishay_PowerPAK_MLP44-24L_ThermalVias
Package_DFN_QFN
PowerPAK PowerPAK MLP44-24L (https://www.vishay.com/docs/78231/mlp44-24l.pdf)
- Pads
- 28
- SMD
- 5.1×5.1
- Boards
- —
Vishay_PowerPAK_MLP55-27L
Package_DFN_QFN
MLP55-27L (https://www.vishay.com/docs/75269/ppak_mlp55-27l.pdf)
- Pads
- 22
- SMD
- 6.5×6.5
- Boards
- —
Vishay_PowerPAK_MLP55-27L_R
Package_DFN_QFN
MLP55-27L_R (https://www.vishay.com/docs/75269/ppak_mlp55-27l.pdf)
- Pads
- 22
- SMD
- 6.5×6.5
- Boards
- —
Vishay_PowerPAK_MLP55-27L_R_ThermalVias
Package_DFN_QFN
MLP55-27L_R (https://www.vishay.com/docs/75269/ppak_mlp55-27l.pdf)
- Pads
- 23
- SMD
- 6.5×6.5
- Boards
- —
Vishay_PowerPAK_MLP55-27L_ThermalVias
Package_DFN_QFN
MLP55-27L (https://www.vishay.com/docs/75269/ppak_mlp55-27l.pdf)
- Pads
- 23
- SMD
- 6.5×6.5
- Boards
- —
PowerIntegrations_eDIP-12B
Package_DIP
Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf
- Pads
- 11
- THT
- 12.1×10.8
- Boards
- —
PowerIntegrations_PDIP-8B
Package_DIP
Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 7
- THT
- 10.6×10.7
- Boards
- —
PowerIntegrations_PDIP-8C
Package_DIP
Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf
- Pads
- 7
- THT
- 10.6×10.7
- Boards
- —
PowerIntegrations_SDIP-10C
Package_DIP
PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf
- Pads
- 9
- THT
- 10.6×13.3
- Boards
- —
PowerIntegrations_SMD-8C
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf
- Pads
- 7
- SMD
- 11.1×10.7
- Boards
- —
Texas_TQFP-64-1EP_10x10mm_P0.5mm_EP8x8mm_Mask4.44x4.44mm
Package_QFP
Texas TQFP, 64 Pin (Texas PAP0064M, based on JEDEC MS-026 variation ACD, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd078j/pptd078j.pdf, https://www.ti.com/lit/ds/symlink/tusb4041i.pdf#page=40)
- Pads
- 65
- SMD
- 13.4×13.4
- Boards
- —
Texas_TQFP-64-1EP_10x10mm_P0.5mm_EP8x8mm_Mask4.44x4.44mm_ThermalVias
Package_QFP
Texas TQFP, 64 Pin (Texas PAP0064M, based on JEDEC MS-026 variation ACD, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd078j/pptd078j.pdf, https://www.ti.com/lit/ds/symlink/tusb4041i.pdf#page=40)
- Pads
- 65
- SMD
- 13.4×13.4
- Boards
- —
Texas_TQFP-64-1EP_10x10mm_P0.5mm_EP8x8mm_Mask5x5mm
Package_QFP
Texas TQFP, 64 Pin (Texas PAP (S-PQFP-G64), based on JEDEC MS-026 variation ACD, 1.00mm body thickness, https://www.ti.com/lit/ds/symlink/tfp410.pdf#page=41)
- Pads
- 65
- SMD
- 13.4×13.4
- Boards
- —
Texas_TQFP-64-1EP_10x10mm_P0.5mm_EP8x8mm_Mask5x5mm_ThermalVias
Package_QFP
Texas TQFP, 64 Pin (Texas PAP (S-PQFP-G64), based on JEDEC MS-026 variation ACD, 1.00mm body thickness, https://www.ti.com/lit/ds/symlink/tfp410.pdf#page=41)
- Pads
- 65
- SMD
- 13.4×13.4
- Boards
- —