Footprints

848 footprints matching “Power”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

848 footprints · page 33 of 36

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PowerIntegrations_eSIP-7C

FP3D

Package_SIP

eSIP-7C Vertical Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf

Pads: 6
THT: 10.5×5.8
Boards: —

PowerIntegrations_eSIP-7F

FP3D

Package_SIP

eSIP-7F Flat Package with Heatsink Tab https://ac-dc.power.com/sites/default/files/product-docs/linkswitch-ph_family_datasheet.pdf

Pads: 6
THT: 14.0×10.7
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm

FP—

Package_SO

HTSSOP, 24 Pin (Texas Instruments PWP0024U, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd402/pptd402.pdf, https://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=50, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm_ThermalVias

FP—

Package_SO

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x2.98mm

FP—

Package_SO

HTSSOP, 24 Pin (Texas Instruments PWP0024P, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd064i/pptd064i.pdf, https://web.archive.org/web/20170223145154/http://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=49, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x2.98mm_ThermalVias

FP—

Package_SO

Pads: 25
SMD: 7.8×8.3
Boards: —

PowerIntegrations_eSOP-12B

FP3D

Package_SO

eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf

Pads: 12
SMD: 13.6×11.2
Boards: —

PowerIntegrations_SO-8B

FP3D

Package_SO

Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf

Pads: 7
SMD: 7.4×5.4
Boards: —

PowerSSO-16-1EP_3.9x4.9mm_P0.5mm_EP2.5x3.61mm

FP3D

Package_SO

PowerSSO, 16 Pin (https://www.st.com/resource/en/datasheet/vnd7020aj.pdf)

Pads: 17
SMD: 7.3×5.4
Boards: —

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.34x2.34mm

FP—

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008A, https://www.ti.com/lit/ml/pptd272a/pptd272a.pdf, https://www.ti.com/lit/ds/symlink/tps92511.pdf#page=29, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Pads: 9
SMD: 7.4×5.4
Boards: —

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.34x2.34mm_ThermalVias

FP—

Package_SO

Pads: 9
SMD: 7.4×5.4
Boards: —

ST_PowerSSO-24_SlugDown

FP3D

Package_SO

ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 25
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-24_SlugDown_ThermalVias

FP3D

Package_SO

ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 25
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-24_SlugUp

FP3D

Package_SO

ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 24
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-36_SlugDown

FP3D

Package_SO

ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 37
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-36_SlugDown_ThermalVias

FP3D

Package_SO

ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 37
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-36_SlugUp

FP3D

Package_SO

ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 36
SMD: 12.1×10.8
Boards: —

Texas_DAD0032A_HTSSOP-32_6.1x11mm_P0.65mm_TopEP3.71x3.81mm

FP—

Package_SO

Texas DAD0032A HTSSOP, 32 Pin (https://www.ti.com/lit/ds/symlink/tpa3116d2.pdf)

Pads: 32
SMD: 9.5×11.5
Boards: —

Texas_DKD0036A_HSSOP-36_11x15.9mm_P0.65mm_TopEP5.85x12.65mm

FP—

Package_SO

Texas DKD0036A HSSOP, 36 Pin (https://www.ti.com/lit/ml/pptd185d/pptd185d.pdf)

Pads: 36
SMD: 15.7×16.4
Boards: —

Texas_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.155x3.255mm

FP3D

Package_SO

Texas HTSSOP, 14 Pin (Texas Instruments PWP0014A, based on JEDEC MO-153 variation ABT-1, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd287a/pptd287a.pdf, https://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 15
SMD: 7.8×5.5
Boards: —