Footprints

5,977 footprints matching “8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

5,977 footprints · page 34 of 250

Matched by name and keywords. Search by meaning instead

MountingHole_3.2mm_M3_ISO14580_Pad_TopOnly

FP—

MountingHole

Mounting Hole 3.2mm, M3, generated by kicad-footprint-generator mountinghole.py

Pads: 1
THT: 6.0×6.0
Boards: 5

MountingHole_4.3mm_M4_ISO7380

FP—

MountingHole

Mounting Hole 4.3mm, M4, no annular, generated by kicad-footprint-generator mountinghole.py

Pads: —
Mount: 8.1×8.1
Boards: 5

ADNS-9800

FP—

OptoDevice

Laser Gaming Sensor ADNS-9800

Pads: 16
THT: 15.2×16.4
Boards: 5

Oscillator_SMD_SeikoEpson_SG8002CA-4Pin_7.0x5.0mm_HandSoldering

FP—

Oscillator

Seiko Epson SG-8002CA, Crystal Oscillator, 7.0x5.0mm package, SMD, hand-soldering, https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC

Pads: 4
SMD: 8.0×8.7
Boards: 5

DFN-10-1EP_3x3mm_P0.5mm_EP1.58x2.35mm

FP—

Package_DFN_QFN

DFN, 10 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/22005b.pdf#page=24)

Pads: 11
SMD: 4.2×3.5
Boards: 5

QFN-28-1EP_5x5mm_P0.5mm_EP3.25x3.25mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 28 Pin (https://www.silabs.com/documents/public/data-sheets/C8051F32x.pdf#page=39)

Pads: 29
SMD: 6.2×6.2
Boards: 5

QFN-28-1EP_5x5mm_P0.5mm_EP3.75x3.75mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 28 Pin (https://www.cmlmicro.com/wp-content/uploads/2017/10/CMX901_ds.pdf)

Pads: 29
SMD: 6.2×6.2
Boards: 5

QFN-28-1EP_6x6mm_P0.65mm_EP4.25x4.25mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=289)

Pads: 29
SMD: 7.2×7.2
Boards: 5

QFN-68-1EP_8x8mm_P0.4mm_EP5.2x5.2mm

FP3D

Package_DFN_QFN

QFN, 68 Pin (https://cdn.microsemi.com/documents/1bf6886f-5919-4508-a50b-b1dbf3fdf0f4/download/#page=98)

Pads: 69
SMD: 9.2×9.2
Boards: 5

TDFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm

FP—

Package_DFN_QFN

TDFN, 14 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0137.PDF (T1433-2C))

Pads: 15
SMD: 4.3×3.5
Boards: 5

TDFN-8-1EP_3x2mm_P0.5mm_EP1.80x1.65mm

FP—

Package_DFN_QFN

8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: 5

UDFN-9_1.0x3.8mm_P0.5mm

FP3D

Package_DFN_QFN

9-pin UDFN package, 1.0x3.8mm, (Ref: https://katalog.we-online.de/pbs/datasheet/824014881.pdf)

Pads: 9
SMD: 2.1×4.3
Boards: 5

UQFN-20-1EP_3x3mm_P0.4mm_EP1.85x1.85mm

FP3D

Package_DFN_QFN

UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=332)

Pads: 21
SMD: 4.2×4.2
Boards: 5

VQFN-48-1EP_7x7mm_P0.5mm_EP4.1x4.1mm_ThermalVias

FP3D

Package_DFN_QFN

VQFN, 48 Pin (http://www.ti.com/lit/ds/symlink/cc430f5137.pdf#page=128)

Pads: 49
SMD: 8.3×8.3
Boards: 5

DIP-16_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 16
SMD: 12.5×20.9
Boards: 5

DIP-64_W22.86mm

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils)

Pads: 64
THT: 25.0×81.8
Boards: 5

PLCC-28_SMD-Socket

FP—

Package_LCC

PLCC, 28 pins, surface mount

Pads: 28
SMD: 19.1×19.1
Boards: 5

Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm_ThermalVias

FP3D

Package_LGA

Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf)

Pads: 11
SMD: 4.4×3.5
Boards: 5

PQFP-132_24x24mm_P0.635mm_i386

FP3D

Package_QFP

PQFP, 132 pins, 24mm sq body, 0.635mm pitch, Intel 386EX (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf)

Pads: 132
SMD: 28.9×28.9
Boards: 5