Footprints

857 footprints matching “x4”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

857 footprints · page 34 of 36

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WQFN-28-1EP_4x4mm_P0.4mm_EP2.7x2.7mm_ThermalVias

FP—

Package_DFN_QFN

WQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation WGGE and exposed pad from Maxim / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf)

Pads: 29
SMD: 5.3×5.3
Boards: —

WQFN-38-1EP_5x7mm_P0.5mm_EP2.7x4.7mm

FP—

Package_DFN_QFN

WQFN, 38 Pin (JEDEC MO-220 variation WHKD, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220)

Pads: 39
SMD: 6.2×8.2
Boards: —

WQFN-38-1EP_5x7mm_P0.5mm_EP2.7x4.7mm_ThermalVias

FP—

Package_DFN_QFN

WQFN, 38 Pin (JEDEC MO-220 variation WHKD, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220)

Pads: 39
SMD: 6.2×8.2
Boards: —

AMS_LGA-20_4.7x4.5mm_P0.65mm

FP3D

Package_LGA

http://ams.com/eng/content/download/1008631/2361759/498838

Pads: 20
SMD: 6.0×6.2
Boards: —

LGA-16_4x4mm_P0.65mm_LayoutBorder4x4y

FP3D

Package_LGA

LGA, 16 Pin (http://www.st.com/resource/en/datasheet/l3gd20.pdf)

Pads: 16
SMD: 4.5×4.5
Boards: —

ublox_LGA-53_4.5x4.5mm_Layout9x9_P0.5mm

FP—

Package_LGA

ublox MIA SoC Module, 4.5x4.5mm, 53 Ball, 9x9 Layout, 0.5mm Pitch, https://content.u-blox.com/sites/default/files/documents/MIA-M10Q_IntegrationManual_UBX-21028173.pdf#page=82

Pads: 53
SMD: 6.5×6.5
Boards: —

EQFP-144-1EP_20x20mm_P0.5mm_EP4x4mm

FP—

Package_QFP

EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00482-02.pdf)

Pads: 145
SMD: 23.3×23.3
Boards: —

EQFP-144-1EP_20x20mm_P0.5mm_EP4x4mm_ThermalVias

FP—

Package_QFP

EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00482-02.pdf)

Pads: 145
SMD: 23.3×23.3
Boards: —

LQFP-52-1EP_10x10mm_P0.65mm_EP4.8x4.8mm

FP3D

Package_QFP

LQFP, 52 Pin (https://www.onsemi.com/pub/Collateral/848H-01.PDF)

Pads: 53
SMD: 13.3×13.3
Boards: —

LQFP-52-1EP_10x10mm_P0.65mm_EP4.8x4.8mm_ThermalVias

FP3D

Package_QFP

LQFP, 52 Pin (https://www.onsemi.com/pub/Collateral/848H-01.PDF)

Pads: 53
SMD: 13.3×13.3
Boards: —

Texas_TQFP-64-1EP_10x10mm_P0.5mm_EP8x8mm_Mask4.44x4.44mm

FP—

Package_QFP

Texas TQFP, 64 Pin (Texas PAP0064M, based on JEDEC MS-026 variation ACD, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd078j/pptd078j.pdf, https://www.ti.com/lit/ds/symlink/tusb4041i.pdf#page=40)

Pads: 65
SMD: 13.4×13.4
Boards: —

Texas_TQFP-64-1EP_10x10mm_P0.5mm_EP8x8mm_Mask4.44x4.44mm_ThermalVias

FP—

Package_QFP

Pads: 65
SMD: 13.4×13.4
Boards: —

TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm_ThermalVias

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads: 45
SMD: 13.3×13.3
Boards: —

TQFP-48-1EP_7x7mm_P0.5mm_EP4.11x4.11mm

FP—

Package_QFP

TQFP, 48 Pin (https://www.lumissil.com/assets/pdf/core/IS31FL3236_DS.pdf)

Pads: 49
SMD: 10.3×10.3
Boards: —

Analog_MSOP-12-16_3x4.039mm_P0.5mm

FP3D

Package_SO

Analog MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081847_b_ms16(12).pdf)

Pads: 12
SMD: 5.6×4.5
Boards: —

HSOP-32-1EP_7.5x11mm_P0.65mm_EP4.7x4.7mm

FP—

Package_SO

HSOP, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT1746-3.pdf)

Pads: 33
SMD: 11.6×11.5
Boards: —

HSOP-54-1EP_7.5x17.9mm_P0.65mm_EP4.6x4.6mm

FP—

Package_SO

HSOP, 54 Pin (https://www.nxp.com/docs/en/package-information/98ASA10506D.pdf)

Pads: 55
SMD: 11.6×18.4
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm

FP3D

Package_SO

HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP2.74x4.75mm

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 Var BDT-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153 https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-tssop/tssop_38_05-08-1865.pdf)

Pads: 39
SMD: 7.7×10.2
Boards: —