Footprints

476 footprints matching “0.4mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

476 footprints · page 4 of 20

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DFN-6-1EP_1.2x1.2mm_P0.4mm_EP0.3x0.94mm_PullBack

FP—

Package_DFN_QFN

DFN, 6 Pin (http://www.onsemi.com/pub/Collateral/NCP133-D.PDF)

Pads: 7
SMD: 1.7×1.7
Boards: 2

QFN-28-1EP_4x4mm_P0.4mm_EP2.3x2.3mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 28 Pin (http://www.issi.com/WW/pdf/31FL3731.pdf#page=21)

Pads: 29
SMD: 5.2×5.2
Boards: 2

QFN-48-1EP_6x6mm_P0.4mm_EP4.66x4.66mm

FP—

Package_DFN_QFN

QFN, 48 Pin (https://www.onsemi.com/pub/Collateral/485BA.PDF)

Pads: 49
SMD: 7.2×7.2
Boards: 2

QFN-48-1EP_6x6mm_P0.4mm_EP4.6x4.6mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 48 Pin (http://infocenter.nordicsemi.com/pdf/nRF51822_PS_v3.3.pdf#page=67)

Pads: 49
SMD: 7.2×7.2
Boards: 2

QFN-64-1EP_8x8mm_P0.4mm_EP6.5x6.5mm

FP3D

Package_DFN_QFN

QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_8x8_with%206_5x6_5%20EP_JXX_C04-0437A.pdf)

Pads: 65
SMD: 9.2×9.2
Boards: 2

QFN-76-1EP_9x9mm_P0.4mm_EP5.81x6.31mm

FP3D

Package_DFN_QFN

QFN, 76 Pin (https://ftdichip.com/wp-content/uploads/2020/07/DS_FT600Q-FT601Q-IC-Datasheet.pdf#page=27)

Pads: 77
SMD: 10.3×10.3
Boards: 2

QFN-80-1EP_10x10mm_P0.4mm_EP3.4x3.4mm

FP—

Package_DFN_QFN

QFN, 80 Pin (https://datasheets.raspberrypi.com/rp2350/rp2350-datasheet.pdf)

Pads: 81
SMD: 11.2×11.2
Boards: 2

TDFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm_ThermalVias

FP—

Package_DFN_QFN

TDFN, 14 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0137.PDF (T1433-2C))

Pads: 15
SMD: 4.3×3.5
Boards: 2

UQFN-16_1.8x2.6mm_P0.4mm

FP—

Package_DFN_QFN

UQFN, 16 Pin (https://www.ti.com/lit/ml/qfnd836/qfnd836.pdf)

Pads: 16
SMD: 3.0×3.8
Boards: 2

UQFN-40-1EP_5x5mm_P0.4mm_EP3.8x3.8mm

FP3D

Package_DFN_QFN

UQFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=345)

Pads: 41
SMD: 6.2×6.2
Boards: 2

UQFN-48-1EP_6x6mm_P0.4mm_EP4.62x4.62mm

FP—

Package_DFN_QFN

UQFN, 48 Pin (https://gitlab.com/kicad/libraries/kicad-symbols/-/merge_requests/1189#note_423250741)

Pads: 49
SMD: 7.3×7.3
Boards: 2

VQFN-46-1EP_5x6mm_P0.4mm_EP2.8x3.8mm

FP—

Package_DFN_QFN

VQFN, 46 Pin (http://www.ti.com/lit/ds/symlink/lp5036.pdf#page=59)

Pads: 47
SMD: 6.3×7.3
Boards: 2

WQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm

FP—

Package_DFN_QFN

WQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/ts3ds10224.pdf#page=29)

Pads: 21
SMD: 4.3×4.3
Boards: 2

WQFN-28-1EP_4x4mm_P0.4mm_EP2.7x2.7mm

FP—

Package_DFN_QFN

WQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation WGGE and exposed pad from Maxim / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf)

Pads: 29
SMD: 5.3×5.3
Boards: 2

TSSOP-24_4.4x5mm_P0.4mm

FP3D

Package_SO

TSSOP, 24 Pin (JEDEC MO-153 Var CA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 24
SMD: 7.7×5.5
Boards: 2

SolderWire-0.1sqmm_1x01_D0.4mm_OD1mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for a single 0.1 mm² wire, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.10 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 1
THT: 2.6×8.6
Boards: 1

SolderWire-0.1sqmm_1x01_D0.4mm_OD1mm_Relief2x

FP—

Connector_Wire

Soldered wire connection with double feed through strain relief, for a single 0.1 mm² wire, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.10 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 1
THT: 2.6×14.6
Boards: 1

SolderWire-0.1sqmm_1x02_P3.6mm_D0.4mm_OD1mm_Relief2x

FP—

Connector_Wire

Soldered wire connection with double feed through strain relief, for 2 times 0.1 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.10 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 2
THT: 6.2×14.6
Boards: 1

SolderWire-0.1sqmm_1x05_P3.6mm_D0.4mm_OD1mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for 5 times 0.1 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.10 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 5
THT: 17.0×8.6
Boards: 1

SolderWire-0.1sqmm_1x06_P3.6mm_D0.4mm_OD1mm

FP—

Connector_Wire

Soldered wire connection, for 6 times 0.1 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.10 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 6
THT: 20.6×2.6
Boards: 1

BGA-100_11.0x11.0mm_Layout10x10_P1.0mm_Ball0.5mm_Pad0.4mm_NSMD

FP3D

Package_BGA

BGA-100, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00223-02.pdf

Pads: 100
SMD: 13.0×13.0
Boards: 1

Texas_DSBGA-5_0.822x1.116mm_Layout2x1x2_P0.4mm

FP—

Package_BGA

Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)

Pads: 5
SMD: 2.8×3.1
Boards: 1