Footprints

154 footprints matching “12mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

154 footprints · page 4 of 7

Matched by name and keywords. Search by meaning instead

SolderWire-4sqmm_1x03_P12mm_D3mm_OD6mm

FP—

Connector_Wire

Soldered wire connection, for 3 times 4 mm² wires, reinforced insulation, conductor diameter 3mm, outer diameter 6mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
3
THT
31.5×7.0
Boards
—

SolderWire-4sqmm_1x03_P12mm_D3mm_OD6mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for 3 times 4 mm² wires, reinforced insulation, conductor diameter 3mm, outer diameter 6mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
3
THT
31.5×43.3
Boards
—

SolderWire-4sqmm_1x03_P12mm_D3mm_OD6mm_Relief2x

FP—

Connector_Wire

Soldered wire connection with double feed through strain relief, for 3 times 4 mm² wires, reinforced insulation, conductor diameter 3mm, outer diameter 6mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
3
THT
31.5×79.3
Boards
—

SolderWire-4sqmm_1x04_P12mm_D3mm_OD6mm

FP—

Connector_Wire

Soldered wire connection, for 4 times 4 mm² wires, reinforced insulation, conductor diameter 3mm, outer diameter 6mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
4
THT
43.5×7.0
Boards
—

SolderWire-4sqmm_1x04_P12mm_D3mm_OD6mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for 4 times 4 mm² wires, reinforced insulation, conductor diameter 3mm, outer diameter 6mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
4
THT
43.5×43.3
Boards
—

SolderWire-4sqmm_1x04_P12mm_D3mm_OD6mm_Relief2x

FP—

Connector_Wire

Soldered wire connection with double feed through strain relief, for 4 times 4 mm² wires, reinforced insulation, conductor diameter 3mm, outer diameter 6mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
4
THT
43.5×79.3
Boards
—

SolderWire-4sqmm_1x05_P12mm_D3mm_OD6mm

FP—

Connector_Wire

Soldered wire connection, for 5 times 4 mm² wires, reinforced insulation, conductor diameter 3mm, outer diameter 6mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
5
THT
55.5×7.0
Boards
—

SolderWire-4sqmm_1x05_P12mm_D3mm_OD6mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for 5 times 4 mm² wires, reinforced insulation, conductor diameter 3mm, outer diameter 6mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
5
THT
55.5×43.3
Boards
—

SolderWire-4sqmm_1x05_P12mm_D3mm_OD6mm_Relief2x

FP—

Connector_Wire

Soldered wire connection with double feed through strain relief, for 5 times 4 mm² wires, reinforced insulation, conductor diameter 3mm, outer diameter 6mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
5
THT
55.5×79.3
Boards
—

SolderWire-4sqmm_1x06_P12mm_D3mm_OD6mm

FP—

Connector_Wire

Soldered wire connection, for 6 times 4 mm² wires, reinforced insulation, conductor diameter 3mm, outer diameter 6mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
6
THT
67.5×7.0
Boards
—

SolderWire-4sqmm_1x06_P12mm_D3mm_OD6mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for 6 times 4 mm² wires, reinforced insulation, conductor diameter 3mm, outer diameter 6mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
6
THT
67.5×43.3
Boards
—

SolderWire-4sqmm_1x06_P12mm_D3mm_OD6mm_Relief2x

FP—

Connector_Wire

Soldered wire connection with double feed through strain relief, for 6 times 4 mm² wires, reinforced insulation, conductor diameter 3mm, outer diameter 6mm, size source Multi-Contact FLEXI-xV 2.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads
6
THT
67.5×79.3
Boards
—

PushButton_12x12mm_THT_GPTS203211B

FP—

digikey-digikey-footprints

Pads
2
THT
13.5×14.6
Boards
—

PushButton_Round_D12mm_THT_KS-01Q-01

FP—

digikey-digikey-footprints

http://spec_sheets.e-switch.com/specs/29-KS01Q01.pdf

Pads
4
THT
12.5×12.5
Boards
—

TQFP-100_12x12mm

FP—

digikey-digikey-footprints

http://ww1.microchip.com/downloads/en/DeviceDoc/100L_TQFP_12x12_PT_C04-0100B.pdf

Pads
100
SMD
15.4×15.4
Boards
—

PushButton_12x12mm_THT_GPTS203211B

FP—

digikey-Source_Footprints

Pads
2
THT
13.5×14.6
Boards
—

PushButton_Round_D12mm_THT_KS-01Q-01

FP—

digikey-Source_Footprints

http://spec_sheets.e-switch.com/specs/29-KS01Q01.pdf

Pads
4
THT
12.5×12.5
Boards
—

TQFP-100_12x12mm

FP—

digikey-Source_Footprints

http://ww1.microchip.com/downloads/en/DeviceDoc/100L_TQFP_12x12_PT_C04-0100B.pdf

Pads
100
SMD
15.4×15.4
Boards
—

TFBGA-48_6x12mm_Layout6x8_P0.8mm_Ball0.3mm_Pad0.25mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 48 balls (JEDEC MO-210Q), 12.0x6.0mm, 48 Ball, 6x8 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads
48
SMD
8.0×14.0
Boards
—

TFBGA-48_7x12mm_Layout6x8_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 48 balls (JEDEC MO-210Q), 12.0x7.0mm, 48 Ball, 6x8 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads
48
SMD
9.0×14.0
Boards
—

TFBGA-60_8x12mm_Layout9x11_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 60 balls (JEDEC MO-210Q), 12.0x8.0mm, 60 Ball, 9x11 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads
60
SMD
10.0×14.0
Boards
—

TFBGA-63_11x12mm_Layout8x12_P0.8mm_Ball0.3mm_Pad0.25mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 63 balls (JEDEC MO-210Q), 12.0x11.0mm, 63 Ball, 8x12 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads
63
SMD
13.0×14.0
Boards
—

TFBGA-84_9x12mm_Layout9x10_P0.8mm_Ball0.3mm_Pad0.25mm_NSMD

FP—

gekkio-Gekkio_Package_BGA

TFBGA, 84 balls (JEDEC MO-210Q), 12.0x9.0mm, 84 Ball, 9x10 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n

Pads
84
SMD
11.0×14.0
Boards
—

JEITA_QFP-64_12x12mm_P0.65mm

FP—

gekkio-Gekkio_Package_QFP

JEITA QFP, 64 Pin (https://home.jeita.or.jp/tsc/std-pdf/ED-7311A.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py

Pads
64
SMD
16.5×16.5
Boards
—