Footprints
79 footprints matching “225”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Xilinx_CLG225
Package_BGA
Zynq-7000 BGA, NSMD pad definition Appendix A, 13x13mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77
- Pads
- 225
- SMD
- 15.0×15.0
- Boards
- —
Xilinx_CSGA225
Package_BGA
Spartan-7 BGA, NSMD pad definition Appendix A, 13x13mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262
- Pads
- 225
- SMD
- 15.0×15.0
- Boards
- —
WLCSP-16_2.225x2.17mm_Layout4x4_P0.5mm
Package_CSP
WLCSP-16 2.225x2.17mm, 2.225x2.17mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf
- Pads
- 16
- SMD
- 4.2×4.2
- Boards
- —
CDFN-4_2.5x3.2mm_P2.1mm
Package_DFN_QFN
CDFN, 4 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/TCG/ProductDocuments/DataSheets/DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf#page=16)
- Pads
- 4
- SMD
- 3.7×3.7
- Boards
- —
JEITA_SOIC-16_3.9x9.9mm_P1.27mm
Package_SO
JEITA SOIC, 16 Pin (JEITA/EIAJ ED-7311-19, variation 16-001-ABA, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=30)
- Pads
- 16
- SMD
- 7.7×10.4
- Boards
- —
R_1225_3264Metric
Resistor_SMD
Resistor SMD 1225 (3264 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: https://www.koaspeer.com/pdfs/WK73S.pdf)
- Pads
- 2
- SMD
- 4.5×7.0
- Boards
- —
Mini-Circuits_MMM168_LandPatternPL-225
RF_Mini-Circuits
Footprint for Mini-Circuits case MMM168, Land pattern PL-225, vias included, (case drawing: https://ww2.minicircuits.com/case_style/MMM168.pdf, land pattern drawing: https://ww2.minicircuits.com/pcb/98-pl225.pdf)
- Pads
- 4
- SMD
- 7.2×4.5
- Boards
- —