Footprints

1,536 footprints matching “3mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,536 footprints · page 4 of 64

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SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm_ThermalVias

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 40

L_Axial_L5.3mm_D2.2mm_P7.62mm_Horizontal_Vishay_IM-1

FP3D

Inductor_THT

Inductor, Axial series, Axial, Horizontal, pin pitch=7.62mm, length*diameter=5.3*2.2mm^2, Vishay, IM-1, http://www.vishay.com/docs/34030/im.pdf

Pads: 2
THT: 9.7×2.7
Boards: 38

TQFN-16-1EP_3x3mm_P0.5mm_EP1.23x1.23mm

FP—

Package_DFN_QFN

TQFN, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0136.PDF (T1633-5), https://pdfserv.maximintegrated.com/land_patterns/90-0032.PDF)

Pads: 17
SMD: 4.2×4.2
Boards: 38

Bosch_LGA-8_3x3mm_P0.8mm_ClockwisePinNumbering

FP3D

Package_LGA

Bosch LGA, 8 Pin (https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BME680-DS001-00.pdf#page=44)

Pads: 8
SMD: 3.5×3.5
Boards: 38

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)

Pads: 9
SMD: 7.4×5.4
Boards: 38

Pin_D1.3mm_L11.0mm

FP3D

Connector_Pin

solder Pin_ diameter 1.3mm, hole diameter 1.3mm, length 11.0mm

Pads: 1
THT: 3.6×3.6
Boards: 37

SolderJumper-3_P1.3mm_Bridged12_Pad1.0x1.5mm_NumberLabels

FP—

Jumper

SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip, labeled with numbers

Pads: 3
SMD: 4.6×2.5
Boards: 35

TestPoint_2Pads_Pitch5.08mm_Drill1.3mm

FP—

TestPoint

Test point with 2 pads, pitch 5.08mm, hole diameter 1.3mm, wire diameter 1.0mm

Pads: 2
THT: 8.7×3.6
Boards: 35

R_LDR_5.0x4.1mm_P3mm_Vertical

FP3D

OptoDevice

Resistor, LDR 5x4.1mm, see http://cdn-reichelt.de/documents/datenblatt/A500/A90xxxx%23PE.pdf

Pads: 2
THT: 5.4×4.6
Boards: 34

Fiducial_1.5mm_Mask3mm

FP—

Fiducial

Fiducial, circular marking, 1.5mm bare copper, 3mm soldermask opening

Pads: —
SMD: 3.5×3.5
Boards: 33

VQFN-16-1EP_3x3mm_P0.5mm_EP1.68x1.68mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/tlv62095.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 33

SSOP-10-1EP_3.9x4.9mm_P1mm_EP2.1x3.3mm

FP3D

Package_SO

SSOP, 10 Pin (http://download.py32.org/%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C/zh-CN/PY32F002A%20%E7%B3%BB%E5%88%97%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C_Rev1.0.pdf#page=44)

Pads: 11
SMD: 7.5×5.4
Boards: 33

C_Radial_D6.3mm_H5.0mm_P2.50mm

FP3D

Capacitor_THT

C, Radial series, Radial, pin pitch=2.50mm, diameter=6.3mm, height=5mm, Non-Polar Electrolytic Capacitor

Pads: 2
THT: 6.8×6.8
Boards: 32

SolderJumper-3_P1.3mm_Bridged2Bar12_RoundedPad1.0x1.5mm_NumberLabels

FP—

Jumper

SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 2 copper strip, labeled with numbers

Pads: 3
SMD: 4.6×2.5
Boards: 32

SOP-16_4.55x10.3mm_P1.27mm

FP—

Package_SO

SOP, 16 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=12855&prodName=TLP290-4)

Pads: 16
SMD: 8.6×10.8
Boards: 32

DFN-6-1EP_3x3mm_P1mm_EP1.5x2.4mm

FP—

Package_DFN_QFN

DFN, 6 Pin (https://www.silabs.com/documents/public/data-sheets/Si7020-A20.pdf)

Pads: 7
SMD: 4.2×3.5
Boards: 31

SMDIP-6_W9.53mm

FP3D

Package_DIP

6-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads: 6
SMD: 12.0×8.1
Boards: 29

VSSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)

Pads: 8
SMD: 6.4×3.5
Boards: 29

TerminalBlock_4Ucon_1x02_P3.50mm_Vertical

FP—

TerminalBlock_4Ucon

Terminal Block 4Ucon ItemNo. 10693, vertical (cable from top), 2 pins, pitch 3.5mm, size 8x8.3mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.4uconnector.com/online/object/4udrawing/10693.pdf

Pads: 2
THT: 9.0×9.3
Boards: 29

MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm

FP3D

Package_SO

MSOP, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3805fg.pdf#page=18)

Pads: 11
SMD: 6.3×3.5
Boards: 28

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm

FP—

Package_SO

SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)

Pads: 9
SMD: 7.4×5.4
Boards: 28

SW_DIP_SPSTx01_Slide_6.7x4.1mm_W6.73mm_P2.54mm_LowProfile_JPin

FP3D

Button_Switch_SMD

SMD 1x-dip-switch SPST , Slide, row spacing 6.73 mm (264 mils), body size 6.7x4.1mm (see e.g. https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin

Pads: 2
SMD: 9.4×4.7
Boards: 27