Footprints

158 footprints matching “3x1”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

158 footprints · page 4 of 7

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BGA-144_7.0x7.0mm_Layout13x13_P0.5mm_Ball0.3mm_Pad0.25mm_NSMD

FP3D

Package_BGA

Altera MBGA-144, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00346-00.pdf

Pads: 144
SMD: 9.0×9.0
Boards: —

BGA-152_14x18mm_Layout13x17_P0.5mm

FP—

Package_BGA

BGA-152_14x18mm_Layout13x17_P0.5mm

Pads: 152
SMD: 16.0×20.0
Boards: —

BGA-152_14x18mm_Layout13x17_P1mm

FP—

Package_BGA

BGA-152, 14x18mm, 152 Ball, 13x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf

Pads: 152
SMD: 16.0×20.0
Boards: —

BGA-90_8.0x13.0mm_Layout2x3x15_P0.8mm

FP3D

Package_BGA

BGA-90, http://www.issi.com/WW/pdf/42-45S32800J.pdf

Pads: 90
SMD: 10.0×15.0
Boards: —

FBGA-78_7.5x11mm_Layout2x3x13_P0.8mm

FP3D

Package_BGA

FBGA-78, https://www.skhynix.com/product/filedata/fileDownload.do?seq=7687

Pads: 78
SMD: 9.5×13.0
Boards: —

NXP_SOT1982-1_VFBGA-98_7x7mm_Layout13x13_P0.5mm

FP3D

Package_BGA

NXP VFBGA-98 (Case SOT1982-1), 0.28mm pad, 7x7mm, 98 Ball, 13x13 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1982-1.pdf

Pads: 98
SMD: 9.0×9.0
Boards: —

ST_TFBGA-169_7x7mm_Layout13x13_P0.5mm

FP—

Package_BGA

ST TFBGA-169, 7.0x7.0mm, 169 Ball, 13x13 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32u595aj.pdf

Pads: 169
SMD: 9.0×9.0
Boards: —

ST_TFBGA-225_13x13mm_Layout15x15_P0.8mm

FP—

Package_BGA

ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf

Pads: 225
SMD: 15.0×15.0
Boards: —

ST_UFBGA-129_7x7mm_Layout13x13_P0.5mm

FP—

Package_BGA

ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf

Pads: 129
SMD: 9.0×9.0
Boards: —

TFBGA-169_9x9mm_Layout13x13_P0.65mm

FP—

Package_BGA

TFBGA-169, NSMD, 9.0x9.0mm, 169 Ball, 13x13 Layout, 0.65mm Pitch, https://www.efinixinc.com/docs/trion-packaging-ug-v4.9.pdf

Pads: 169
SMD: 11.0×11.0
Boards: —

TFBGA-256_13x13mm_Layout16x16_P0.8mm

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Package_BGA

TFBGA-256, NSMD, 13.0x13.0mm, 256 Ball, 16x16 Layout, 0.8mm Pitch, https://www.efinixinc.com/docs/trion-packaging-ug-v4.9.pdf

Pads: 256
SMD: 15.0×15.0
Boards: —

TFBGA-361_13x13mm_Layout19x19_P0.65mm

FP—

Package_BGA

TFBGA-361, NSMD, 13.0x13.0mm, 361 Ball, 19x19 Layout, 0.65mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf

Pads: 361
SMD: 15.0×15.0
Boards: —

UFBGA-169_7x7mm_Layout13x13_P0.5mm

FP—

Package_BGA

UFBGA-169, 7.0x7.0mm, 169 Ball, 13x13 Layout, 0.5mm Pitch, http://www.st.com/resource/en/datasheet/stm32f429ng.pdf#page=218

Pads: 169
SMD: 9.0×9.0
Boards: —

Analog_LFCSP-8-1EP_3x3mm_P0.5mm_EP1.53x1.85mm

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Package_CSP

LFCSP, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf)

Pads: 5
SMD: 4.0×3.5
Boards: —

Analog_LFCSP-UQ-10_1.3x1.6mm_P0.4mm

FP3D

Package_CSP

Analog LFCSP-UQ, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_10_10.pdf)

Pads: 10
SMD: 2.5×2.8
Boards: —

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: —

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm_ThermalVias

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: —

ST_WLCSP-156_4.96x4.64mm_Layout13x12_P0.35mm

FP—

Package_CSP

ST WLCSP-156, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf

Pads: 156
SMD: 7.0×6.6
Boards: —

WLCSP-12_1.403x1.555mm_Layout6x4_P0.4mm_Stagger

FP—

Package_CSP

WLCSP-12, staggered array, 1.403x1.555mm, 12 Ball, X-staggered 6x4 Layout, 0.4mm Pitch, http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208

Pads: 12
SMD: 3.4×3.6
Boards: —