Footprints
3,991 footprints matching “5mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
C_Rect_L7.0mm_W2.5mm_P5.00mm
Capacitor_THT
C, Rect series, Radial, pin pitch=5.00mm, length*width=7*2.5mm^2, Capacitor
- Pads
- 2
- THT
- 7.5×3.0
- Boards
- 119
Bosch_LGA-8_2.5x2.5mm_P0.65mm_ClockwisePinNumbering
Package_LGA
LGA-8
- Pads
- 8
- SMD
- 2.8×3.1
- Boards
- 118
LGA-14_3x2.5mm_P0.5mm_LayoutBorder3x4y
Package_LGA
LGA, 14 Pin (https://www.st.com/resource/en/datasheet/lsm6ds3tr-c.pdf)
- Pads
- 14
- SMD
- 3.5×3.0
- Boards
- 118
Jack_3.5mm_QingPu_WQP-PJ398SM_Vertical_CircularHoles
Connector_Audio
TRS 3.5mm, vertical, Thonkiconn, PCB mount, (http://www.qingpu-electronics.com/en/products/WQP-PJ398SM-362.html)
- Pads
- 3
- THT
- 10.0×14.4
- Boards
- 117
TerminalBlock_Phoenix_PT-1,5-2-5.0-H_1x02_P5.00mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix PT-1,5-2-5.0-H, 2 pins, pitch 5mm, size 10x9mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.mouser.com/ds/2/324/ItemDetail_1935161-922578.pdf
- Pads
- 2
- THT
- 11.0×10.0
- Boards
- 116
Fiducial_0.75mm_Mask1.5mm
Fiducial
Fiducial, circular marking, 0.75mm bare copper, 1.5mm soldermask opening (Level B)
- Pads
- —
- SMD
- 2.0×2.0
- Boards
- 115
QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 115
LGA-12_2x2mm_P0.5mm
Package_LGA
LGA12
- Pads
- 12
- SMD
- 2.5×2.5
- Boards
- 115
SSOP-24_5.3x8.2mm_P0.65mm
Package_SO
SSOP, 24 Pin (JEDEC MO-150 variation AG, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=398, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-ssop/ssop_24_05-08-1640.pdf)
- Pads
- 24
- SMD
- 9.4×8.7
- Boards
- 111
TSSOP-8_3x3mm_P0.65mm
Package_SO
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)
- Pads
- 8
- SMD
- 5.9×3.6
- Boards
- 111
SolderJumper-2_P1.3mm_Bridged2Bar_RoundedPad1.0x1.5mm
Jumper
SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, bridged with 2 copper strips
- Pads
- 2
- SMD
- 3.3×2.5
- Boards
- 110
TestPoint_Pad_D2.5mm
TestPoint
SMD pad as test Point, diameter 2.5mm
- Pads
- 1
- SMD
- 3.5×3.5
- Boards
- 110
C_Rect_L7.2mm_W2.5mm_P5.00mm_FKS2_FKP2_MKS2_MKP2
Capacitor_THT
C, Rect series, Radial, pin pitch=5.00mm, length*width=7.2*2.5mm^2, Capacitor, http://www.wima.com/EN/WIMA_FKS_2.pdf
- Pads
- 2
- THT
- 7.7×3.0
- Boards
- 105
C_Disc_D7.0mm_W2.5mm_P5.00mm
Capacitor_THT
C, Disc series, Radial, pin pitch=5.00mm, diameter*width=7*2.5mm^2, Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/DS_KERKO_TC.pdf
- Pads
- 2
- THT
- 7.5×3.0
- Boards
- 104
LQFP-144_20x20mm_P0.5mm
Package_QFP
LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)
- Pads
- 144
- SMD
- 23.3×23.3
- Boards
- 104
Bosch_LGA-8_2x2.5mm_P0.65mm_ClockwisePinNumbering
Package_LGA
LGA-8, https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMP280-DS001-18.pdf
- Pads
- 8
- SMD
- 3.1×2.6
- Boards
- 101
CP_Radial_D7.5mm_P2.50mm
Capacitor_THT
CP, Radial series, Radial, pin pitch=2.50mm, diameter=7.5mm, height=8mm, Electrolytic Capacitor
- Pads
- 2
- THT
- 8.0×8.0
- Boards
- 100
SSOP-16_3.9x4.9mm_P0.635mm
Package_SO
SSOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT519-1.pdf#page=2)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 98
CP_Radial_D16.0mm_P7.50mm
Capacitor_THT
CP, Radial series, Radial, pin pitch=7.50mm, diameter=16mm, height=25mm, Electrolytic Capacitor
- Pads
- 2
- THT
- 16.5×16.5
- Boards
- 96
R_Axial_DIN0207_L6.3mm_D2.5mm_P5.08mm_Vertical
Resistor_THT
Resistor, Axial_DIN0207 series, Axial, Vertical, pin pitch=5.08mm, 0.25W = 1/4W, length*diameter=6.3*2.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf
- Pads
- 2
- THT
- 7.6×3.0
- Boards
- 95
WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
Package_SON
WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)
- Pads
- 7
- SMD
- 2.7×2.5
- Boards
- 94
SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm_NumberLabels
Jumper
SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open, labeled with numbers
- Pads
- 3
- SMD
- 4.6×2.5
- Boards
- 93
MountingHole_3.5mm_Pad
MountingHole
Mounting Hole 3.5mm, generated by kicad-footprint-generator mountinghole.py
- Pads
- 1
- THT
- 7.5×7.5
- Boards
- 93
TQFP-100_14x14mm_P0.5mm
Package_QFP
TQFP, 100 Pin (JEDEC MS-026 variation AED, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=683)
- Pads
- 100
- SMD
- 17.3×17.3
- Boards
- 93