Footprints

192 footprints matching “VQFN”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

192 footprints · page 4 of 8

Matched by name and keywords. Search by meaning instead

HVQFN24-NXP

FP—

agg-agg

Pads
25
SMD
5.5×5.5
Boards
—

Atmel VQFN-20 3x3mm 20M2

FP—

celestial-altium-Leadless_QFN

VQFN, 20-Leads, Body 3.00x3.00mm, Pitch 0.45mm, Thermal Pad 1.55x1.55mm, IPC Medium Density

Pads
21
SMD
4.2×4.2
Boards
—

MICROCHIP VQFN-20 3X3 REB

FP—

celestial-altium-Leadless_QFN

QFN, 20-Leads, Body 3.00x3.00mm, Pitch 0.40mm, Thermal Pad 1.70x1.70mm, IPC Medium Density

Pads
21
SMD
4.2×4.2
Boards
—

NXP HVQFN-33 5x5mm

FP—

celestial-altium-Leadless_QFN

QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.75x3.75mm, IPC Medium Density

Pads
33
SMD
6.2×6.2
Boards
—

NXP HVQFN-33 7x7mm

FP—

celestial-altium-Leadless_QFN

HVQFN, 32-Leads, Body 7.00x7.00mm, Pitch 0.65mm, Thermal Pad 4.85x4.85mm, IPC Medium Density

Pads
33
SMD
8.2×8.2
Boards
—

NXP HVQFN32 5x5mm SOT617-3

FP—

celestial-altium-Leadless_QFN

HVQFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.60x3.60mm, IPC Medium Density

Pads
33
SMD
6.2×6.2
Boards
—

NXP HVQFN32 7x7mm SOT865-3

FP—

celestial-altium-Leadless_QFN

QFN, 32-Leads, Body 7.1x7.1mm (max), Pitch 0.65mm, IPC Medium Density

Pads
33
SMD
8.2×8.2
Boards
—

NXP HVQFN56 SOT684-1

FP—

celestial-altium-Leadless_QFN

HVQFN, 56-Leads, Body 8.00x8.00mm, Pitch 0.50mm, Thermal Pad 4.30x4.30mm

Pads
57
SMD
9.7×9.7
Boards
—

TI PVQFN-16 4x4mm RSA

FP—

celestial-altium-Leadless_QFN

QFN, 16-Leads, Body 4.1x4.1mm (max), Pitch 0.65mm, IPC Medium Density

Pads
17
SMD
5.2×5.2
Boards
—

TI PVQFN-32 5X5MM RHB

FP—

celestial-altium-Leadless_QFN

PVQFN, 32-Leads, Body 5.1x5.1mm (max), Pitch 0.50mm, IPC Medium Density

Pads
33
SMD
6.2×6.2
Boards
—

TI VQFN-11 2.5x2.1 RNR

FP—

celestial-altium-Leadless_QFN

VQFN, 11-Leads, Body 2.50x2.0mm, Pitch 0.50mm/0.47mm, IPC Medium Density

Pads
11
SMD
3.4×3.0
Boards
—

TI VQFN-14 RHL0014A

FP—

celestial-altium-Leadless_QFN

QFN, 14-Leads, Body 3.50x3.50mm, Pitch 0.50mm, Thermal Pad 2.05x2.05mm, IPC Medium Density

Pads
15
SMD
4.7×4.7
Boards
—

TI VQFN-16 4x4mm RGV

FP—

celestial-altium-Leadless_QFN

QFN, 16-Leads, Body 4.1x4.1mm (max), Pitch 0.65mm, IPC Medium Density

Pads
17
SMD
5.2×5.2
Boards
—

TI VQFN-16 4x4mm RSA

FP—

celestial-altium-Leadless_QFN

QFN, 16-Leads, Body 4.1x4.1mm (max), Pitch 0.65mm, IPC Medium Density

Pads
17
SMD
5.2×5.2
Boards
—

TI VQFN-16 RGT

FP—

celestial-altium-Leadless_QFN

QFN, 16-Leads, Body 3.1x3.1mm (max), Pitch 0.5mm, IPC Medium Density

Pads
17
SMD
3.8×3.8
Boards
—

TI VQFN-16 RVA

FP—

celestial-altium-Leadless_QFN

QFN, 16-Leads, Body 3.50x3.50mm, Pitch 0.50mm, Thermal Pad 2.14x2.14mm, IPC Medium Density

Pads
17
SMD
4.7×4.7
Boards
—

TI VQFN-18 RNN0018A

FP—

celestial-altium-Leadless_QFN

VQFN, 18-Leads, Body 3.5x3.5mm, Pitch 0.55mm

Pads
18
SMD
4.3×4.3
Boards
—

TI VQFN-18 RNV0018B

FP—

celestial-altium-Leadless_QFN

VQFN, 18-Leads, Body 3.5x3.5mm, Pitch 0.55mm

Pads
18
SMD
4.3×4.3
Boards
—

TI VQFN-20 RGY0020B

FP—

celestial-altium-Leadless_QFN

VQFN-20 RGY, 20-Leads, Body 3.50x4.50mm, Pitch 1.50mm/0.50mm, Thermal Pad 1.70x2.70mm

Pads
21
SMD
4.4×5.4
Boards
—

Ti VQFN-20 RHL0020A

FP—

celestial-altium-Leadless_QFN

QFN, 20-Leads, Body 3.50x4.50mm, Pitch 1.50mm/0.50mm, Thermal Pad 2.05x3.05mm, IPC Medium Density

Pads
21
SMD
4.7×5.7
Boards
—

TI VQFN-20 RJE0020B

FP—

celestial-altium-Leadless_QFN

QFN, 20-Leads, Body 3.00x3.00mm, Pitch 0.45mm, Thermal Pad 0.93x0.98mm, IPC Medium Density

Pads
21
SMD
3.8×3.8
Boards
—

TI VQFN-20 RNJ0020A

FP—

celestial-altium-Leadless_QFN

VQFN, 20-Leads, Body 3.5x4.00mm, Pitch 0.50mm

Pads
20
SMD
4.3×4.8
Boards
—

TI VQFN-24 RGE

FP—

celestial-altium-Leadless_QFN

QFN, 24-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.45x2.45mm, IPC Medium Density

Pads
25
SMD
4.8×4.8
Boards
—

TI VQFN-24 RGE0024B

FP—

celestial-altium-Leadless_QFN

VQFN, 24-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.70x2.70mm

Pads
25
SMD
5.0×5.0
Boards
—