Footprints

2,819 footprints matching “lead”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

2,819 footprints · page 4 of 118

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DFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.5mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/AT24C64D-I%C2%B2C-Compatible-(2-Wire)-Serial-EEPROM-64-Kbit-(8,192x8)-20005937C.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: 47

VQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm

FP—

Package_DFN_QFN

VQFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20%20Lead%20VQFN%203x3x0_9mm_1_7EP%20U2B%20C04-21496a.pdf)

Pads: 21
SMD: 4.2×4.2
Boards: 47

WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.2×2.5
Boards: 47

Sensirion_DFN-8-1EP_2.5x2.5mm_P0.5mm_EP1.1x1.7mm

FP—

Sensor_Humidity

Sensirion DFN-8 SHT3x-DIS (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/2_Humidity_Sensors/Datasheets/Sensirion_Humidity_Sensors_SHT3x_Datasheet_digital.pdf)

Pads: 9
SMD: 3.4×3.0
Boards: 46

DIP-40_W15.24mm_LongPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads

Pads: 40
THT: 18.1×51.3
Boards: 45

QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm

FP3D

Package_DFN_QFN

QFN, 16 Pin (https://www.st.com/resource/en/datasheet/tsv521.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 44

QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm

FP3D

Package_DFN_QFN

QFN, 24 Pin (https://www.alldatasheet.com/datasheet-pdf/pdf/1159021/ALFA/AS3330.html)

Pads: 25
SMD: 5.3×5.3
Boards: 41

QFN-36-1EP_6x6mm_P0.5mm_EP3.7x3.7mm

FP3D

Package_DFN_QFN

QFN, 36 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/36L_QFN_6x6_with_3_7x3_7_EP_Punch_Dimpled_4E_C04-0241A.pdf)

Pads: 37
SMD: 7.2×7.2
Boards: 40

QFN-32-1EP_5x5mm_P0.5mm_EP3.6x3.6mm

FP—

Package_DFN_QFN

QFN, 32 Pin (http://infocenter.nordicsemi.com/pdf/nRF52810_PS_v1.1.pdf#page=468)

Pads: 33
SMD: 6.2×6.2
Boards: 39

WQFN-14-1EP_2.5x2.5mm_P0.5mm_EP1.45x1.45mm

FP—

Package_DFN_QFN

WQFN, 14 Pin (https://www.onsemi.com/pub/Collateral/FUSB302B-D.PDF#page=32)

Pads: 15
SMD: 3.7×3.7
Boards: 39

DIP-18_W7.62mm_Socket

FP3D

Package_DIP

18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 18
THT: 10.7×23.5
Boards: 39

PLCC-84_THT-Socket

FP—

Package_LCC

PLCC, 84 pins, through hole

Pads: 84
THT: 37.0×37.0
Boards: 39

Winbond_USON-8-1EP_3x2mm_P0.5mm_EP0.2x1.6mm

FP3D

Package_SON

Winbond USON, 8 Pin (https://www.lcsc.com/datasheet/lcsc_datasheet_2205122030_Winbond-Elec-W25Q16JVUXIQ_C2843335.pdf#page=66f)

Pads: 9
SMD: 4.3×2.5
Boards: 39

TQFN-16-1EP_3x3mm_P0.5mm_EP1.23x1.23mm

FP—

Package_DFN_QFN

TQFN, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0136.PDF (T1633-5), https://pdfserv.maximintegrated.com/land_patterns/90-0032.PDF)

Pads: 17
SMD: 4.2×4.2
Boards: 38

Bosch_LGA-8_3x3mm_P0.8mm_ClockwisePinNumbering

FP3D

Package_LGA

Bosch LGA, 8 Pin (https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BME680-DS001-00.pdf#page=44)

Pads: 8
SMD: 3.5×3.5
Boards: 38

WSON-8-1EP_6x5mm_P1.27mm_EP3.4x4mm

FP—

Package_SON

WSON, 8 Pin (http://ww1.microchip.com/downloads/en/AppNotes/S72030.pdf)

Pads: 9
SMD: 6.6×5.5
Boards: 38

DIP-28_W15.24mm_LongPads

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads

Pads: 28
THT: 18.1×36.1
Boards: 37

DIP-24_W7.62mm_Socket

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 24
THT: 10.7×31.1
Boards: 36

QFN-56-1EP_7x7mm_P0.4mm_EP5.6x5.6mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (http://www.cypress.com/file/416486/download#page=40)

Pads: 57
SMD: 8.3×8.3
Boards: 34

PLCC-32_THT-Socket

FP—

Package_LCC

PLCC, 32 pins, through hole, http://www.assmann-wsw.com/fileadmin/datasheets/ASS_0981_CO.pdf

Pads: 32
THT: 19.1×21.6
Boards: 34

Sensirion_DFN-4_1.5x1.5mm_P0.8mm_SHT4x_NoCentralPad

FP—

Sensor_Humidity

Sensirion, SHT40, SHT41, SHT45, DFN, 4 Pin (https://sensirion.com/media/documents/33FD6951/624C4357/Datasheet_SHT4x.pdf)

Pads: 4
SMD: 2.4×2.0
Boards: 34

VQFN-16-1EP_3x3mm_P0.5mm_EP1.68x1.68mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/tlv62095.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 33

SSOP-28_3.9x9.9mm_P0.635mm

FP3D

Package_SO

SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)

Pads: 28
SMD: 6.9×10.4
Boards: 33

TI_SO-PowerPAD-8

FP3D

Package_SO

8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf)

Pads: 9
SMD: 8.0×5.4
Boards: 33