Footprints

1,939 footprints matching “leaded”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,939 footprints · page 4 of 81

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PLCC-68_THT-Socket

FP—

Package_LCC

PLCC, 68 pins, through hole

Pads: 68
THT: 32.0×32.0
Boards: 28

DIP-6_W7.62mm_LongPads

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 6
THT: 10.5×8.1
Boards: 27

SSOP-10_3.9x4.9mm_P1.00mm

FP3D

Package_SO

10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf)

Pads: 10
SMD: 6.7×5.4
Boards: 25

TSSOP-16-1EP_4.4x5mm_P0.65mm

FP3D

Package_SO

FE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation BB; (see Linear Technology 1956f.pdf)

Pads: 17
SMD: 7.0×5.7
Boards: 25

DIP-32_W15.24mm_LongPads

FP3D

Package_DIP

32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads

Pads: 32
THT: 18.1×41.2
Boards: 24

SO-4_4.4x4.3mm_P2.54mm

FP3D

Package_SO

4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN

Pads: 4
SMD: 7.7×4.8
Boards: 24

Texas_PWSON-N6

FP—

Package_SON

Plastic Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf

Pads: 7
SMD: 4.0×3.7
Boards: 24

DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm

FP3D

Package_DFN_QFN

DD Package; 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1698.pdf)

Pads: 9
SMD: 4.0×3.6
Boards: 23

DIP-24_W15.24mm_Socket_LongPads

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads: 24
THT: 18.3×31.1
Boards: 22

Diodes_SO-8EP

FP—

Package_SO

8-Lead Plastic SO, Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf)

Pads: 9
SMD: 7.0×5.1
Boards: 22

SSOP-16_4.4x5.2mm_P0.65mm

FP3D

Package_SO

SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf)

Pads: 16
SMD: 7.3×5.8
Boards: 22

DIP-6_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 6
SMD: 12.5×8.2
Boards: 21

Fuse_BelFuse_0ZRE0005FF_L8.3mm_W3.8mm

FP3D

Fuse

Fuse 0ZRE0005FF, BelFuse, Radial Leaded PTC, https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf

Pads: 2
THT: 8.8×4.3
Boards: 20

SMDIP-8_W9.53mm

FP3D

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads: 8
SMD: 12.0×10.7
Boards: 20

Diode_Bridge_DIP-4_W7.62mm_P5.08mm

FP3D

Diode_THT

4-lead dip package for diode bridges, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf

Pads: 4
THT: 9.7×8.9
Boards: 19

Diode_Bridge_Round_D9.0mm

FP3D

Diode_THT

4-lead round diode bridge package, diameter 9.0mm, pin pitch 5.0mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/b40r.pdf

Pads: 4
THT: 10.6×10.6
Boards: 19

DIP-4_W7.62mm_LongPads

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 4
THT: 10.5×5.6
Boards: 19

DIP-48_W15.24mm_Socket

FP3D

Package_DIP

48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket

Pads: 48
THT: 18.3×61.6
Boards: 19

DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 4.2×2.6
Boards: 18

SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm

FP—

Package_DFN_QFN

20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf

Pads: 21
SMD: 4.5×4.5
Boards: 18