Footprints

3,181 footprints matching “package”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints on their own, whether or not a symbol uses them.

3,181 footprints · page 4 of 133

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QFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_32_05-08-1693.pdf)

Pads: 33
SMD: 6.3×6.3
Boards: 176

QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)

Pads: 29
SMD: 6.2×6.2
Boards: 175

DIP-28_W15.24mm

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads: 28
THT: 17.3×36.1
Boards: 172

TO-263-2

FP3D

Package_TO_SOT_SMD

TO-263/D2PAK/DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-3-1/

Pads: 3
SMD: 16.6×11.3
Boards: 168

TSSOP-28_4.4x9.7mm_P0.65mm

FP3D

Package_SO

TSSOP, 28 Pin (JEDEC MO-153 Var AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 28
SMD: 7.7×10.2
Boards: 164

SOIC-18W_7.5x11.6mm_P1.27mm

FP3D

Package_SO

SOIC, 18 Pin (JEDEC MS-013AB, https://www.analog.com/media/en/package-pcb-resources/package/33254132129439rw_18.pdf)

Pads: 18
SMD: 11.9×12.1
Boards: 163

TO-252-3_TabPin2

FP3D

Package_TO_SOT_SMD

TO-252/DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/

Pads: 3
SMD: 11.1×7.0
Boards: 161

SOT-563

FP3D

Package_TO_SOT_SMD

SOT, 6 Pin (https://www.jedec.org/system/files/docs/MO-293B.pdf)

Pads: 6
SMD: 2.4×1.9
Boards: 160

VSSOP-8_2.3x2mm_P0.5mm

FP3D

Package_SO

VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)

Pads: 8
SMD: 4.6×2.5
Boards: 156

TSSOP-10_3x3mm_P0.5mm

FP3D

Package_SO

TSSOP, 10 Pin (https://www.ti.com/lit/ml/mpds035c/mpds035c.pdf, https://www.ti.com/lit/ds/symlink/ads1115.pdf#page=50, https://www.nxp.com/docs/en/package-information/SOT552-1.pdf)

Pads: 10
SMD: 6.3×3.5
Boards: 153

SO-14_3.9x8.65mm_P1.27mm

FP3D

Package_SO

SO, 14 Pin (https://www.st.com/resource/en/datasheet/l6491.pdf)

Pads: 14
SMD: 7.4×9.2
Boards: 147

SO-16_3.9x9.9mm_P1.27mm

FP3D

Package_SO

SO, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT109-1.pdf)

Pads: 16
SMD: 7.4×10.4
Boards: 141

SOIC-24W_7.5x15.4mm_P1.27mm

FP3D

Package_SO

SOIC, 24 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RW_24.pdf)

Pads: 24
SMD: 11.9×15.9
Boards: 141

SOIC-8_5.3x5.3mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)

Pads: 8
SMD: 9.3×5.8
Boards: 139

Oscillator_SMD_Abracon_ASE-4Pin_3.2x2.5mm

FP—

Oscillator

Abracon ASE, Miniature Crystal Clock Oscillator, 3.2x2.5mm package, SMD, http://www.abracon.com/Oscillators/ASEseries.pdf

Pads: 4
SMD: 4.2×3.5
Boards: 136

InvenSense_QFN-24_4x4mm_P0.5mm

FP—

Sensor_Motion

24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 5.3×5.3
Boards: 136