Footprints

1,117 footprints matching “40”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,117 footprints · page 44 of 47

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VQFN-40-1EP_5x5mm_P0.4mm_EP3.7x3.7mm

FP3D

Package_DFN_QFN

VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://www.silabs.com/documents/public/data-sheets/efm32pg23-datasheet.pdf#page=89, https://www.jedec.org/system/files/docs/MO-220K01.pdf)

Pads: 41
SMD: 6.3×6.3
Boards: —

VQFN-40-1EP_5x5mm_P0.4mm_EP3.7x3.7mm_ThermalVias

FP3D

Package_DFN_QFN

VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://www.silabs.com/documents/public/data-sheets/efm32pg23-datasheet.pdf#page=89, https://www.jedec.org/system/files/docs/MO-220K01.pdf)

Pads: 41
SMD: 6.3×6.3
Boards: —

VQFN-40-1EP_6x6mm_P0.5mm_EP3.5x3.5mm

FP—

Package_DFN_QFN

VQFN, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-40/cp-40-29.pdf)

Pads: 41
SMD: 7.3×7.3
Boards: —

DIP-10_W10.16mm

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 10
THT: 12.3×13.2
Boards: —

DIP-22_W10.16mm_LongPads

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 22
THT: 13.1×28.4
Boards: —

DIP-22_W10.16mm_SMDSocket_SmallPads

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), SMDSocket, SmallPads

Pads: 22
SMD: 13.2×28.6
Boards: —

DIP-22_W10.16mm_Socket_LongPads

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), Socket, LongPads

Pads: 22
THT: 13.2×28.6
Boards: —

DIP-24_W10.16mm_SMDSocket_SmallPads

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), SMDSocket, SmallPads

Pads: 24
SMD: 13.2×31.1
Boards: —

DIP-24_W10.16mm_Socket

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), Socket

Pads: 24
THT: 13.2×31.1
Boards: —

DIP-24_W10.16mm_Socket_LongPads

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), Socket, LongPads

Pads: 24
THT: 13.2×31.1
Boards: —

DIP-40_W15.24mm_SMDSocket_SmallPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), SMDSocket, SmallPads

Pads: 40
SMD: 18.3×51.4
Boards: —

DIP-40_W16.51mm_SMDSocket_LongPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads

Pads: 40
SMD: 20.1×51.4
Boards: —

DIP-40_W25.4mm

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils)

Pads: 40
THT: 27.5×51.3
Boards: —

DIP-40_W25.4mm_SMDSocket_SmallPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), SMDSocket, SmallPads

Pads: 40
SMD: 28.4×51.4
Boards: —

DIP-40_W25.4mm_Socket

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), Socket

Pads: 40
THT: 28.4×51.4
Boards: —

DIP-40_W26.67mm_SMDSocket_LongPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 26.67mm (1050 mils), SMDSocket, LongPads

Pads: 40
SMD: 30.3×51.4
Boards: —

DIP-5-6_W10.16mm

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils)

Pads: 5
THT: 12.3×8.2
Boards: —

DIP-5-6_W10.16mm_LongPads

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads

Pads: 5
THT: 13.2×8.2
Boards: —

DIP-6_W10.16mm_LongPads

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 6
THT: 13.1×8.1
Boards: —

SMDIP-40_W15.24mm

FP3D

Package_DIP

40-lead surface-mounted (SMD) DIP package, row spacing 15.24mm (600 mils)

Pads: 40
SMD: 17.8×51.3
Boards: —

SMDIP-40_W25.24mm

FP3D

Package_DIP

40-lead surface-mounted (SMD) DIP package, row spacing 25.24mm (993 mils)

Pads: 40
SMD: 27.7×51.3
Boards: —

STK672-040-E

FP3D

Package_SIP

SIP-22 (http://www.onsemi.com/pub_link/Collateral/EN5227-D.PDF)

Pads: 22
THT: 53.5×9.5
Boards: —

SSOP-40_8.8x17.5mm_P0.8mm

FP—

Package_SO

SSOP, 40 Pin (JEITA/EIAJ ED-7311-20 variation 40-001-GABB, 2.40mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311-20/#target/page_no=114)

Pads: 40
SMD: 13.3×18.0
Boards: —

TSOP-I-40_12.4x10mm_P0.5mm

FP3D

Package_SO

TSOP-I, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CA)

Pads: 40
SMD: 15.5×10.5
Boards: —