Footprints

5,977 footprints matching “8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

5,977 footprints · page 44 of 250

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Xilinx_CSG324

FP—

Package_BGA

Artix-7 BGA, NSMD pad definition Appendix A, 15x15mm, 324 Ball, 18x18 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268

Pads: 324
SMD: 17.0×17.0
Boards: 3

Xilinx_FGG484

FP—

Package_BGA

Artix-7 BGA, NSMD pad definition Appendix A, 23x23mm, 484 Ball, 22x22 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275

Pads: 484
SMD: 25.0×25.0
Boards: 3

LFCSP-28-1EP_5x5mm_P0.5mm_EP3.14x3.14mm

FP—

Package_CSP

LFCSP, 28 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-28/CP_28_10.pdf)

Pads: 29
SMD: 6.2×6.2
Boards: 3

DFN-12-1EP_3x3mm_P0.5mm_EP2.05x2.86mm

FP—

Package_DFN_QFN

10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 13
SMD: 4.3×3.6
Boards: 3

DFN-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm

FP—

Package_DFN_QFN

DFN, 8 Pin (https://www.st.com/resource/en/datasheet/lm2903.pdf#page=16)

Pads: 9
SMD: 3.3×2.5
Boards: 3

DFN-S-8-1EP_6x5mm_P1.27mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 7.2×5.7
Boards: 3

Micrel_MLF-8-1EP_2x2mm_P0.5mm_EP0.8x1.3mm_ThermalVias

FP—

Package_DFN_QFN

http://ww1.microchip.com/downloads/en/DeviceDoc/mic2290.pdf

Pads: 9
SMD: 2.7×2.5
Boards: 3

MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm

FP—

Package_DFN_QFN

8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf)

Pads: 9
SMD: 3.7×3.5
Boards: 3

QFN-16-1EP_5x5mm_P0.8mm_EP2.7x2.7mm

FP3D

Package_DFN_QFN

QFN, 16 Pin (http://www.intersil.com/content/dam/Intersil/documents/l16_/l16.5x5.pdf)

Pads: 17
SMD: 6.2×6.2
Boards: 3

QFN-28-1EP_4x4mm_P0.45mm_EP2.4x2.4mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=16)

Pads: 29
SMD: 5.2×5.2
Boards: 3

QFN-28-1EP_4x5mm_P0.5mm_EP2.65x3.65mm

FP—

Package_DFN_QFN

QFN, 28 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/3555fe.pdf#page=32)

Pads: 29
SMD: 5.3×6.3
Boards: 3

QFN-28-1EP_5x5mm_P0.5mm_EP3.75x3.75mm

FP—

Package_DFN_QFN

QFN, 28 Pin (https://www.cmlmicro.com/wp-content/uploads/2017/10/CMX901_ds.pdf)

Pads: 29
SMD: 6.2×6.2
Boards: 3

QFN-68-1EP_8x8mm_P0.4mm_EP5.2x5.2mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 68 Pin (https://cdn.microsemi.com/documents/1bf6886f-5919-4508-a50b-b1dbf3fdf0f4/download/#page=98)

Pads: 69
SMD: 9.2×9.2
Boards: 3

QFN-68-1EP_8x8mm_P0.4mm_EP6.4x6.4mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 68 Pin (https://www.st.com/resource/en/datasheet/stm32h725ze.pdf)

Pads: 69
SMD: 9.2×9.2
Boards: 3

QFN-76-1EP_9x9mm_P0.4mm_EP3.8x3.8mm

FP3D

Package_DFN_QFN

QFN, 76 Pin (https://www.marvell.com/documents/bqcwxsoiqfjkcjdjhkvc/#page=19)

Pads: 77
SMD: 10.2×10.2
Boards: 3

QFN-80-1EP_10x10mm_P0.4mm_EP3.4x3.4mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 80 Pin (https://datasheets.raspberrypi.com/rp2350/rp2350-datasheet.pdf)

Pads: 81
SMD: 11.2×11.2
Boards: 3

TQFN-28-1EP_5x5mm_P0.5mm_EP3.25x3.25mm_ThermalVias

FP—

Package_DFN_QFN

TQFN, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2855-3))

Pads: 29
SMD: 6.2×6.2
Boards: 3

TQFN-48-1EP_7x7mm_P0.5mm_EP5.1x5.1mm

FP3D

Package_DFN_QFN

TQFN, 48 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0144.pdf)

Pads: 49
SMD: 8.3×8.3
Boards: 3

UQFN-10_1.3x1.8mm_P0.4mm

FP—

Package_DFN_QFN

UQFN, 10 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001725D.pdf (Page 9))

Pads: 10
SMD: 2.5×3.0
Boards: 3

WDFN-8-1EP_2x2mm_P0.5mm_EP0.8x1.2mm

FP—

Package_DFN_QFN

WDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20005474E.pdf#page=25)

Pads: 9
SMD: 3.2×2.5
Boards: 3

WQFN-16-1EP_3x3mm_P0.5mm_EP1.68x1.68mm

FP—

Package_DFN_QFN

WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tlv9064.pdf#page=44)

Pads: 17
SMD: 4.3×4.3
Boards: 3

CERDIP-28_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

28-lead through-hole mounted CERDIP, JEDEC MS-015-AH package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 28
THT: 10.7×36.2
Boards: 3

CERDIP-8_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 8
THT: 10.7×13.8
Boards: 3

DIP-8-N7_W7.62mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7

Pads: 7
THT: 9.8×10.7
Boards: 3