Footprints
1,356 footprints matching “+-1”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Nordic_AQFN-73-1EP_7x7mm_P0.5mm
Package_DFN_QFN
http://infocenter.nordicsemi.com/index.jsp?topic=%2Fcom.nordic.infocenter.nrf52%2Fdita%2Fnrf52%2Fchips%2Fnrf52840.html
- Pads
- 74
- SMD
- 9.0×9.0
- Boards
- 18
QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm
Package_DFN_QFN
QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)
- Pads
- 41
- SMD
- 6.2×6.2
- Boards
- 18
QFN-64-1EP_9x9mm_P0.5mm_EP4.35x4.35mm
Package_DFN_QFN
QFN, 64 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT2232H.pdf#page=57)
- Pads
- 65
- SMD
- 10.2×10.2
- Boards
- 18
SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm
Package_DFN_QFN
20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf
- Pads
- 21
- SMD
- 4.5×4.5
- Boards
- 18
VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm
Package_DFN_QFN
VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 18
WSON-10-1EP_2.5x2.5mm_P0.5mm_EP1.2x2mm
Package_SON
WSON, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24)
- Pads
- 11
- SMD
- 3.8×3.0
- Boards
- 18
WSON-12-1EP_3x2mm_P0.5mm_EP1x2.65_ThermalVias
Package_SON
WSON-12 http://www.ti.com/lit/ds/symlink/lm27762.pdf
- Pads
- 13
- SMD
- 2.9×3.5
- Boards
- 18
DFN-10-1EP_3x3mm_P0.5mm_EP1.65x2.38mm
Package_DFN_QFN
DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3471.pdf#page=15)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- 17
QFN-48-1EP_6x6mm_P0.4mm_EP4.6x4.6mm
Package_DFN_QFN
QFN, 48 Pin (http://infocenter.nordicsemi.com/pdf/nRF51822_PS_v3.3.pdf#page=67)
- Pads
- 49
- SMD
- 7.2×7.2
- Boards
- 17
QFN-48-1EP_8x8mm_P0.5mm_EP6.2x6.2mm
Package_DFN_QFN
QFN, 48 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT232H.pdf#page=49)
- Pads
- 49
- SMD
- 9.2×9.2
- Boards
- 17
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 17
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.514x3.2mm
Package_SO
SOIC, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 17
VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm_ThermalVias
Package_SON
VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 17
TerminalBlock_Phoenix_MKDS-1,5-6_1x06_P5.00mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix MKDS-1,5-6, 6 pins, pitch 5mm, size 30x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf
- Pads
- 6
- THT
- 31.0×10.8
- Boards
- 17
QFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
Package_DFN_QFN
QFN, 20 Pin (https://www.silabs.com/documents/public/data-sheets/Si5351-B.pdf)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 16
VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm_ThermalVias
Package_DFN_QFN
VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 16
HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm
Package_SO
HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf
- Pads
- 57
- SMD
- 9.6×14.6
- Boards
- 16
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias
Package_SO
SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 16
Relay_SPDT_Omron_G5V-1
Relay_THT
Relay Omron G5V-1, see http://omronfs.omron.com/en_US/ecb/products/pdf/en-g5v_1.pdf
- Pads
- 6
- THT
- 7.9×12.8
- Boards
- 16
DFN-10-1EP_3x3mm_P0.5mm_EP1.7x2.5mm
Package_DFN_QFN
DFN, 10 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MPQ2483/document_id/2064/)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- 15
DFN-8-1EP_3x2mm_P0.5mm_EP1.36x1.46mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 15
QFN-16-1EP_4x4mm_P0.65mm_EP2.5x2.5mm
Package_DFN_QFN
QFN, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266)
- Pads
- 17
- SMD
- 5.2×5.2
- Boards
- 15
QFN-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=164)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 15
QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
Package_DFN_QFN
QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 15
