Footprints

1,356 footprints matching “+-1”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

1,356 footprints · page 5 of 57

Matched by name and keywords. Search by meaning instead

Nordic_AQFN-73-1EP_7x7mm_P0.5mm

FP3D

Package_DFN_QFN

http://infocenter.nordicsemi.com/index.jsp?topic=%2Fcom.nordic.infocenter.nrf52%2Fdita%2Fnrf52%2Fchips%2Fnrf52840.html

Pads
74
SMD
9.0×9.0
Boards
18

QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm

FP3D

Package_DFN_QFN

QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)

Pads
41
SMD
6.2×6.2
Boards
18

QFN-64-1EP_9x9mm_P0.5mm_EP4.35x4.35mm

FP—

Package_DFN_QFN

QFN, 64 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT2232H.pdf#page=57)

Pads
65
SMD
10.2×10.2
Boards
18

SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm

FP—

Package_DFN_QFN

20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf

Pads
21
SMD
4.5×4.5
Boards
18

VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm

FP—

Package_DFN_QFN

VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)

Pads
25
SMD
5.3×5.3
Boards
18

WSON-10-1EP_2.5x2.5mm_P0.5mm_EP1.2x2mm

FP3D

Package_SON

WSON, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24)

Pads
11
SMD
3.8×3.0
Boards
18

WSON-12-1EP_3x2mm_P0.5mm_EP1x2.65_ThermalVias

FP—

Package_SON

WSON-12 http://www.ti.com/lit/ds/symlink/lm27762.pdf

Pads
13
SMD
2.9×3.5
Boards
18

DFN-10-1EP_3x3mm_P0.5mm_EP1.65x2.38mm

FP3D

Package_DFN_QFN

DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3471.pdf#page=15)

Pads
11
SMD
4.3×3.5
Boards
17

QFN-48-1EP_6x6mm_P0.4mm_EP4.6x4.6mm

FP—

Package_DFN_QFN

QFN, 48 Pin (http://infocenter.nordicsemi.com/pdf/nRF51822_PS_v3.3.pdf#page=67)

Pads
49
SMD
7.2×7.2
Boards
17

QFN-48-1EP_8x8mm_P0.5mm_EP6.2x6.2mm

FP—

Package_DFN_QFN

QFN, 48 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT232H.pdf#page=49)

Pads
49
SMD
9.2×9.2
Boards
17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads
9
SMD
7.4×5.4
Boards
17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.514x3.2mm

FP—

Package_SO

SOIC, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13)

Pads
9
SMD
7.4×5.4
Boards
17

VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm_ThermalVias

FP3D

Package_SON

VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument

Pads
11
SMD
4.3×4.3
Boards
17

TerminalBlock_Phoenix_MKDS-1,5-6_1x06_P5.00mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix MKDS-1,5-6, 6 pins, pitch 5mm, size 30x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf

Pads
6
THT
31.0×10.8
Boards
17

QFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm

FP—

Package_DFN_QFN

QFN, 20 Pin (https://www.silabs.com/documents/public/data-sheets/Si5351-B.pdf)

Pads
21
SMD
5.2×5.2
Boards
16

VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)

Pads
25
SMD
5.3×5.3
Boards
16

HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm

FP3D

Package_SO

HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf

Pads
57
SMD
9.6×14.6
Boards
16

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Pads
9
SMD
7.4×5.4
Boards
16

Relay_SPDT_Omron_G5V-1

FP3D

Relay_THT

Relay Omron G5V-1, see http://omronfs.omron.com/en_US/ecb/products/pdf/en-g5v_1.pdf

Pads
6
THT
7.9×12.8
Boards
16

DFN-10-1EP_3x3mm_P0.5mm_EP1.7x2.5mm

FP—

Package_DFN_QFN

DFN, 10 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MPQ2483/document_id/2064/)

Pads
11
SMD
4.3×3.5
Boards
15

DFN-8-1EP_3x2mm_P0.5mm_EP1.36x1.46mm

FP—

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf)

Pads
9
SMD
4.3×2.5
Boards
15

QFN-16-1EP_4x4mm_P0.65mm_EP2.5x2.5mm

FP3D

Package_DFN_QFN

QFN, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266)

Pads
17
SMD
5.2×5.2
Boards
15

QFN-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=164)

Pads
21
SMD
5.2×5.2
Boards
15

QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68)

Pads
33
SMD
6.3×6.3
Boards
15