Footprints

2,819 footprints matching “LEAD”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

2,819 footprints · page 5 of 118

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Diodes_PowerDI3333-8

FP3D

Package_SON

Diodes Incorporated PowerDI3333-8, Plastic Dual Flat No Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf

Pads: 5
SMD: 4.2×3.8
Boards: 33

DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm

FP3D

Package_DFN_QFN

6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 7
SMD: 3.3×2.5
Boards: 32

DIP-18_W7.62mm_Socket_LongPads

FP3D

Package_DIP

18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 18
THT: 10.7×23.5
Boards: 32

DFN-6-1EP_3x3mm_P1mm_EP1.5x2.4mm

FP—

Package_DFN_QFN

DFN, 6 Pin (https://www.silabs.com/documents/public/data-sheets/Si7020-A20.pdf)

Pads: 7
SMD: 4.2×3.5
Boards: 31

DIP-28_W7.62mm_LongPads

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 28
THT: 10.5×36.1
Boards: 31

QFN-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm

FP3D

Package_DFN_QFN

QFN, 16 Pin (http://www.thatcorp.com/datashts/THAT_1580_Datasheet.pdf)

Pads: 17
SMD: 5.3×5.3
Boards: 30

QFN-28_4x4mm_P0.5mm

FP—

Package_DFN_QFN

QFN, 28 Pin (http://www.st.com/resource/en/datasheet/stm32f031k6.pdf#page=90)

Pads: 28
SMD: 5.3×5.3
Boards: 30

QFN-28-1EP_6x6mm_P0.65mm_EP4.25x4.25mm

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=289)

Pads: 29
SMD: 7.2×7.2
Boards: 30

SSOP-24_3.9x8.7mm_P0.635mm

FP3D

Package_SO

SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)

Pads: 24
SMD: 6.9×9.3
Boards: 30

Diode_Bridge_Round_D9.8mm

FP3D

Diode_THT

4-lead round diode bridge package, diameter 9.8mm, pin pitch 5.08mm, see http://www.vishay.com/docs/88769/woo5g.pdf

Pads: 4
THT: 9.3×10.3
Boards: 29

SMDIP-6_W9.53mm

FP3D

Package_DIP

6-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads: 6
SMD: 12.0×8.1
Boards: 29

TO-220-5_P3.4x3.7mm_StaggerOdd_Lead3.8mm_Vertical

FP3D

Package_TO_SOT_THT

TO-220-5, Vertical, RM 1.7mm, Pentawatt, staggered type-1, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421.pdf?domain=www.linear.com, https://www.diodes.com/assets/Package-Files/TO220-5.pdf

Pads: 5
THT: 10.5×9.6
Boards: 29

DIP-24_W7.62mm_Socket_LongPads

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 24
THT: 10.7×31.1
Boards: 28

PLCC-68_THT-Socket

FP—

Package_LCC

PLCC, 68 pins, through hole

Pads: 68
THT: 32.0×32.0
Boards: 28

DIP-6_W7.62mm_LongPads

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 6
THT: 10.5×8.1
Boards: 27

SSOP-10_3.9x4.9mm_P1.00mm

FP3D

Package_SO

10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf)

Pads: 10
SMD: 6.7×5.4
Boards: 25

TSSOP-16-1EP_4.4x5mm_P0.65mm

FP3D

Package_SO

FE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation BB; (see Linear Technology 1956f.pdf)

Pads: 17
SMD: 7.0×5.7
Boards: 25

QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)

Pads: 25
SMD: 5.2×5.2
Boards: 24

QFN-56-1EP_7x7mm_P0.4mm_EP4x4mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://www.espressif.com/sites/default/files/documentation/esp32-s2_datasheet_en.pdf#page=41)

Pads: 57
SMD: 8.2×8.2
Boards: 24

DIP-32_W15.24mm_LongPads

FP3D

Package_DIP

32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads

Pads: 32
THT: 18.1×41.2
Boards: 24

SO-4_4.4x4.3mm_P2.54mm

FP3D

Package_SO

4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN

Pads: 4
SMD: 7.7×4.8
Boards: 24

Texas_PWSON-N6

FP—

Package_SON

Plastic Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf

Pads: 7
SMD: 4.0×3.7
Boards: 24

Sensirion_DFN-4-1EP_2x2mm_P1mm_EP0.7x1.6mm

FP—

Sensor_Humidity

DFN, 4 Pin (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/0_Datasheets/Humidity/Sensirion_Humidity_Sensors_SHTC3_Datasheet.pdf)

Pads: 5
SMD: 2.9×2.5
Boards: 24

DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm

FP3D

Package_DFN_QFN

DD Package; 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1698.pdf)

Pads: 9
SMD: 4.0×3.6
Boards: 23