Footprints
167 footprints matching “Plastic”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WSON-14-1EP_4.0x4.0mm_P0.5mm_EP2.6x2.6mm
Package_SON
14-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf
- Pads
- 15
- SMD
- 4.9×4.5
- Boards
- 2
Molex_Mini-Fit_Jr_5566-20A2_2x10_P4.20mm_Vertical
Connector_Molex
Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-20A2, example for new mpn: 39-28-920x, 10 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf)
- Pads
- 20
- THT
- 51.2×12.0
- Boards
- 1
Molex_Mini-Fit_Jr_5569-10A2_2x05_P4.20mm_Horizontal
Connector_Molex
Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5569-10A2, example for new mpn: 39-30-0100, 5 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039300020_sd.pdf)
- Pads
- 10
- THT
- 23.2×22.3
- Boards
- 1
DFN-10_2x2mm_P0.4mm
Package_DFN_QFN
10-Lead Plastic DFN (2mm x 2mm) 0.40mm pitch
- Pads
- 10
- SMD
- 2.8×2.5
- Boards
- 1
DFN-10-1EP_2x3mm_P0.5mm_EP0.64x2.4mm
Package_DFN_QFN
DDB Package; 10-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_10_05-08-1722.pdf)
- Pads
- 11
- SMD
- 3.1×3.6
- Boards
- 1
DFN-10-1EP_3x3mm_P0.5mm_EP1.75x2.7mm
Package_DFN_QFN
10-Lead Plastic Dual Flat No-Lead Package, 3x3mm Body (see Atmel Appnote 8826)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- 1
DFN-12-1EP_4x4mm_P0.5mm_EP2.66x3.38mm
Package_DFN_QFN
DF Package; 12-Lead Plastic DFN (4mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf)
- Pads
- 13
- SMD
- 5.0×4.6
- Boards
- 1
DFN-14-1EP_3x4mm_P0.5mm_EP1.7x3.3mm
Package_DFN_QFN
DE Package; 14-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_14_05-08-1708.pdf)
- Pads
- 15
- SMD
- 4.1×4.6
- Boards
- 1
DFN-8-1EP_4x4mm_P0.8mm_EP2.39x2.21mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF)
- Pads
- 9
- SMD
- 4.8×4.7
- Boards
- 1
DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 5.3×4.7
- Boards
- 1
SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm_ThermalVias
Package_DFN_QFN
20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf
- Pads
- 21
- SMD
- 4.5×4.5
- Boards
- 1
TQFP-144_16x16mm_P0.4mm
Package_QFP
144-Lead Plastic Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 144
- SMD
- 19.4×19.4
- Boards
- 1
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_ThermalVias
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- 1
SSO-4_6.7x5.1mm_P2.54mm_Clearance8mm
Package_SO
4-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf
- Pads
- 4
- SMD
- 11.9×5.6
- Boards
- 1
SSO-6_6.8x4.6mm_P1.27mm_Clearance8mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 6
- SMD
- 13.1×5.1
- Boards
- 1
SSO-8_6.8x5.9mm_P1.27mm_Clearance7mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 8
- SMD
- 11.2×6.4
- Boards
- 1
InvenSense_QFN-24_3x3mm_P0.4mm_NoMask
Sensor_Motion
24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)
- Pads
- 24
- SMD
- 4.1×4.1
- Boards
- 1
AMPHENOL 10018783-11200TLF
celestial-altium-Connector_Amphenol
PCI EXPRESS GEN3 SINGLE PLASTIC PEG
- Pads
- 36
- THT
- 25.6×9.6
- Boards
- —
AD MSOP-12 4x3MM MSE
celestial-altium-Leaded_MSOP
MSE Package 12-Lead Plastic MSOP, Exposed Die Pad
- Pads
- 13
- SMD
- 5.8×4.6
- Boards
- —
LTC MSOP-16 MSE16
celestial-altium-Leaded_SOP
16-Lead Plastic MSOP, Exposed Die Pad
- Pads
- 17
- SMD
- 6.0×4.4
- Boards
- —
AD DFN-12 3X3MM DD
celestial-altium-Leadless_DFN
DD Package 12-Lead Plastic DFN (3mm × 3mm)
- Pads
- 13
- SMD
- 4.0×3.6
- Boards
- —
LINEAR TECH QFN-16 UD
celestial-altium-Leadless_QFN
16-lead Plastic QFN 3x3mm 0.75mm high.
- Pads
- 17
- SMD
- 4.1×4.1
- Boards
- —
LTC QFN-16 UD
celestial-altium-Leadless_QFN
16-lead Plastic QFN 3x3mm 0.75mm high.
- Pads
- 17
- SMD
- 4.0×4.0
- Boards
- —
LTC QFN-20 UFD
celestial-altium-Leadless_QFN
20-lead Plastic QFN 4.0x5.0mm, thermal pad 2.65x3.65mm
- Pads
- 20
- SMD
- 5.0×6.0
- Boards
- —