Footprints

512 footprints matching “SO-8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

512 footprints · page 5 of 22

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TE_0-1734839-8_1x08-1MP_P0.5mm_Horizontal

FP—

Connector_FFC-FPC

TE FPC connector, 08 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0

Pads: 9
SMD: 10.4×6.7
Boards: 7

DFN-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://www.onsemi.com/pub/Collateral/506AQ.PDF)

Pads: 9
SMD: 3.2×2.5
Boards: 7

HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm

FP—

Package_SO

HVSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf)

Pads: 9
SMD: 6.3×3.5
Boards: 7

MSOP-8-1EP_3x3mm_P0.65mm_EP1.95x2.15mm

FP3D

Package_SO

MSOP, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf)

Pads: 9
SMD: 6.3×3.5
Boards: 7

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.62x3.51mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14)

Pads: 9
SMD: 7.4×5.4
Boards: 7

VSONP-8-1EP_5x6_P1.27mm

FP—

Package_SON

SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments CSD18531Q5A http://www.ti.com/lit/ds/symlink/csd18531q5a.pdf)

Pads: 3
SMD: 6.8×5.4
Boards: 7

X2SON-8_1.4x1mm_P0.35mm

FP3D

Package_SON

X2SON-8 1.4x1mm Pitch0.35mm http://www.ti.com/lit/ds/symlink/pca9306.pdf

Pads: 8
SMD: 1.7×1.9
Boards: 7

R_Cat16-8

FP3D

Resistor_SMD

SMT resistor net, Bourns CAT16 series, 8 way

Pads: 16
SMD: 2.8×6.9
Boards: 7

TerminalBlock_TE_282834-8_1x08_P2.54mm_Horizontal

FP—

TerminalBlock_TE-Connectivity

Terminal Block TE 282834-8, 8 pins, pitch 2.54mm, size 20.8x6.5mm, drill diameter 1.1mm, pad diameter 2.1mm, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F282834%7FC1%7Fpdf%7FEnglish%7FENG_CD_282834_C1.pdf

Pads: 8
THT: 21.8×7.5
Boards: 7

DIP-8_W10.16mm_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 8
THT: 13.1×10.7
Boards: 6

DIP-8_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 8
SMD: 12.5×10.8
Boards: 6

SMDIP-8_W7.62mm

FP3D

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 8
SMD: 10.1×10.7
Boards: 6

PowerPAK_SO-8_Dual

FP—

Package_SO

PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf)

Pads: 6
SMD: 7.1×5.5
Boards: 6

WSON-8-1EP_3x3mm_P0.5mm_EP1.2x2mm

FP—

Package_SON

WSON, 8 Pin (http://www.ti.com/lit/ds/symlink/lp2951.pdf#page=27)

Pads: 9
SMD: 4.3×3.5
Boards: 6

Infineon_PG-HSOF-8-1

FP3D

Package_TO_SOT_SMD

HSOF-8-1 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-1/)

Pads: 3
SMD: 13.8×10.6
Boards: 6

Infineon_PG-HSOF-8-1_ThermalVias

FP3D

Package_TO_SOT_SMD

HSOF-8-1 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-1/)

Pads: 3
SMD: 13.8×10.6
Boards: 6

TerminalBlock_Xinya_XY308-2.54-8P_1x08_P2.54mm_Horizontal

FP—

TerminalBlock

Terminal Block Xinya XY308-2.54-8P, 8 pins, pitch 2.54mm, size 20.8x6.5mm, drill diameter 1.2mm, pad diameter 2mm, http://www.xinyaelectronic.com/product/xy308-254

Pads: 8
THT: 21.8×7.5
Boards: 6