Footprints

1,408 footprints matching “T-1”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,408 footprints · page 5 of 59

Matched by name and keywords. Search by meaning instead

TerminalBlock_Phoenix_PT-1,5-4-3.5-H_1x04_P3.50mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix PT-1,5-4-3.5-H, 4 pins, pitch 3.5mm, size 14x7.6mm, drill diameter 1.2mm, pad diameter 2.4mm,

Pads: 4
THT: 15.0×8.6
Boards: 20

DFN-8-1EP_3x2mm_P0.5mm_EP1.7x1.4mm

FP—

Package_DFN_QFN

DFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_DFN_2x3x0_9_MC_C04-123C.pdf)

Pads: 9
SMD: 4.2×2.5
Boards: 19

QFN-20-1EP_4x4mm_P0.5mm_EP2.6x2.6mm

FP—

Package_DFN_QFN

QFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=164)

Pads: 21
SMD: 5.2×5.2
Boards: 19

QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm

FP3D

Package_DFN_QFN

QFN, 48 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_48_05-08-1704.pdf)

Pads: 49
SMD: 8.3×8.3
Boards: 19

DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 4.2×2.6
Boards: 18

Nordic_AQFN-73-1EP_7x7mm_P0.5mm

FP3D

Package_DFN_QFN

http://infocenter.nordicsemi.com/index.jsp?topic=%2Fcom.nordic.infocenter.nrf52%2Fdita%2Fnrf52%2Fchips%2Fnrf52840.html

Pads: 74
SMD: 9.0×9.0
Boards: 18

QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm

FP3D

Package_DFN_QFN

QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)

Pads: 41
SMD: 6.2×6.2
Boards: 18

QFN-64-1EP_9x9mm_P0.5mm_EP4.35x4.35mm

FP—

Package_DFN_QFN

QFN, 64 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT2232H.pdf#page=57)

Pads: 65
SMD: 10.2×10.2
Boards: 18

SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm

FP—

Package_DFN_QFN

20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf

Pads: 21
SMD: 4.5×4.5
Boards: 18

VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm

FP—

Package_DFN_QFN

VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 18

WSON-10-1EP_2.5x2.5mm_P0.5mm_EP1.2x2mm

FP3D

Package_SON

WSON, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24)

Pads: 11
SMD: 3.8×3.0
Boards: 18

WSON-12-1EP_3x2mm_P0.5mm_EP1x2.65_ThermalVias

FP—

Package_SON

WSON-12 http://www.ti.com/lit/ds/symlink/lm27762.pdf

Pads: 13
SMD: 2.9×3.5
Boards: 18

DFN-10-1EP_3x3mm_P0.5mm_EP1.65x2.38mm

FP3D

Package_DFN_QFN

DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3471.pdf#page=15)

Pads: 11
SMD: 4.3×3.5
Boards: 17

QFN-48-1EP_6x6mm_P0.4mm_EP4.6x4.6mm

FP—

Package_DFN_QFN

QFN, 48 Pin (http://infocenter.nordicsemi.com/pdf/nRF51822_PS_v3.3.pdf#page=67)

Pads: 49
SMD: 7.2×7.2
Boards: 17

QFN-48-1EP_8x8mm_P0.5mm_EP6.2x6.2mm

FP—

Package_DFN_QFN

QFN, 48 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT232H.pdf#page=49)

Pads: 49
SMD: 9.2×9.2
Boards: 17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.514x3.2mm

FP—

Package_SO

SOIC, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13)

Pads: 9
SMD: 7.4×5.4
Boards: 17

VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm_ThermalVias

FP3D

Package_SON

VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument

Pads: 11
SMD: 4.3×4.3
Boards: 17

TerminalBlock_Phoenix_MKDS-1,5-6_1x06_P5.00mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix MKDS-1,5-6, 6 pins, pitch 5mm, size 30x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf

Pads: 6
THT: 31.0×10.8
Boards: 17

QFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm

FP—

Package_DFN_QFN

QFN, 20 Pin (https://www.silabs.com/documents/public/data-sheets/Si5351-B.pdf)

Pads: 21
SMD: 5.2×5.2
Boards: 16

VQFN-24-1EP_4x4mm_P0.5mm_EP2.45x2.45mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430f1101a.pdf)

Pads: 25
SMD: 5.3×5.3
Boards: 16

HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm

FP3D

Package_SO

HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf

Pads: 57
SMD: 9.6×14.6
Boards: 16

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Pads: 9
SMD: 7.4×5.4
Boards: 16

SOT-143_Handsoldering

FP3D

Package_TO_SOT_SMD

SOT-143 Handsoldering https://www.nxp.com/docs/en/package-information/SOT143B.pdf

Pads: 4
SMD: 5.2×3.4
Boards: 16