Footprints
1,509 footprints matching “2mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TDFN-8-1EP_3x2mm_P0.5mm_EP1.4x1.4mm
Package_DFN_QFN
TDFN, 8 Pin (http://ww1.microchip.com/downloads/en/devicedoc/20005514a.pdf#page=35)
- Pads
- 9
- SMD
- 4.2×2.5
- Boards
- —
TDFN-8-1EP_3x2mm_P0.5mm_EP1.80x1.65mm_ThermalVias
Package_DFN_QFN
8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- —
Texas_DLH0010A_WSON-10-1EP_2.2x2mm_P0.4mm_EP0.9x1.5mm
Package_DFN_QFN
Texas DLH0010A WSON, 10 Pin (https://www.ti.com/lit/gpn/BQ25185)
- Pads
- 11
- SMD
- 3.5×2.5
- Boards
- —
Texas_DLH0010A_WSON-10-1EP_2.2x2mm_P0.4mm_EP0.9x1.5mm_ThermalVias
Package_DFN_QFN
Texas DLH0010A WSON, 10 Pin (https://www.ti.com/lit/gpn/BQ25185)
- Pads
- 11
- SMD
- 3.5×2.5
- Boards
- —
Texas_DSQ0010A_WSON-10-1EP_2x2mm_P0.4mm_EP0.9x1.5mm
Package_DFN_QFN
Texas DSQ0010A WSON, 10 Pin (https://www.ti.com/lit/pdf/mpds335b)
- Pads
- 11
- SMD
- 3.3×2.5
- Boards
- —
Texas_DSQ0010A_WSON-10-1EP_2x2mm_P0.4mm_EP0.9x1.5mm_ThermalVias
Package_DFN_QFN
Texas DSQ0010A WSON, 10 Pin (https://www.ti.com/lit/pdf/mpds335b)
- Pads
- 11
- SMD
- 3.3×2.5
- Boards
- —
Texas_RHA0040E_VQFN-40-1EP_6x6mm_P0.5mm_EP3.52x2.62mm
Package_DFN_QFN
Texas RHA0040E VQFN, 40 Pin (http://www.ti.com/lit/ds/symlink/drv8308.pdf#page=57 JEDEC MO-220 variation VJJD-2)
- Pads
- 41
- SMD
- 7.3×7.3
- Boards
- —
Texas_RHA0040E_VQFN-40-1EP_6x6mm_P0.5mm_EP3.52x2.62mm_ThermalVias
Package_DFN_QFN
Texas RHA0040E VQFN, 40 Pin (http://www.ti.com/lit/ds/symlink/drv8308.pdf#page=57 JEDEC MO-220 variation VJJD-2)
- Pads
- 41
- SMD
- 7.3×7.3
- Boards
- —
Texas_RNH0030A_WQFN-30-1EP_2.5x4.5mm_P0.4mm_EP1.2x3.2mm
Package_DFN_QFN
Texas RNH0030A WQFN, 30 Pin (https://www.ti.com/lit/ds/symlink/hd3ss3220.pdf#page=44)
- Pads
- 31
- SMD
- 3.8×5.8
- Boards
- —
Texas_RNH0030A_WQFN-30-1EP_2.5x4.5mm_P0.4mm_EP1.2x3.2mm_ThermalVias
Package_DFN_QFN
Texas RNH0030A WQFN, 30 Pin (https://www.ti.com/lit/ds/symlink/hd3ss3220.pdf#page=44)
- Pads
- 31
- SMD
- 3.8×5.8
- Boards
- —
Texas_RPU0010A_VQFN-HR-10_2x2mm_P0.5mm
Package_DFN_QFN
VQFN-HR, 10 Pin (https://www.ti.com/lit/ds/symlink/tps62912.pdf#page=39)
- Pads
- 10
- SMD
- 2.9×2.7
- Boards
- —
Texas_RUN0010A_WQFN-10_2x2mm_P0.5mm
Package_DFN_QFN
Texas RUN0010A WQFN, 10 Pin (https://www.ti.com/lit/ds/symlink/tmp461.pdf#page=35)
- Pads
- 10
- SMD
- 3.3×3.3
- Boards
- —
Texas_S-PX2QFN-14
Package_DFN_QFN
Texas RUC0014A X2QFN, 14 Pin (https://www.ti.com/lit/ml/qfnd283a/qfnd283a.pdf)
- Pads
- 14
- SMD
- 3.3×3.3
- Boards
- —
Texas_X2QFN-RUE-12_1.4x2mm_P0.4mm
Package_DFN_QFN
Texas X2QFN-RUE, 12 Pin (https://www.ti.com/lit/ml/mpqf214b/mpqf214b.pdf)
- Pads
- 12
- SMD
- 2.6×3.2
- Boards
- —
UQFN-12-1EP_2x2mm_P0.4mm_EP1.1x1.1mm
Package_DFN_QFN
UQFN, 12 Pin (https://www.wch-ic.com/download/file?id=396, https://www.wch-ic.com/downloads/CH32V006DS0_PDF.html, https://www.wch-ic.com/downloads/PACKAGE_PDF.html)
- Pads
- 13
- SMD
- 3.3×3.3
- Boards
- —
UQFN-48-1EP_6x6mm_P0.4mm_EP4.62x4.62mm_ThermalVias
Package_DFN_QFN
UQFN, 48 Pin (https://gitlab.com/kicad/libraries/kicad-symbols/-/merge_requests/1189#note_423250741)
- Pads
- 49
- SMD
- 7.3×7.3
- Boards
- —
VQFN-100-1EP_12x12mm_P0.4mm_EP8x8mm_ThermalVias
Package_DFN_QFN
VQFN, 100 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/UNG/ProductDocuments/DataSheets/USB7206C-Data-Sheet-DS00003850.pdf)
- Pads
- 101
- SMD
- 13.2×13.2
- Boards
- —
VQFN-48-1EP_7x7mm_P0.5mm_EP4.2x4.2mm
Package_DFN_QFN
VQFN, 48 Pin (Based on JEDEC MO-220 variation VKKD-2 (using Figure 1), custom Exposed Pad from NXP, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, https://www.nxp.com/docs/en/package-information/SOT619-28.pdf)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- —
VQFN-48-1EP_7x7mm_P0.5mm_EP4.2x4.2mm_ThermalVias
Package_DFN_QFN
VQFN, 48 Pin (Based on JEDEC MO-220 variation VKKD-2 (using Figure 1), custom Exposed Pad from NXP, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, https://www.nxp.com/docs/en/package-information/SOT619-28.pdf)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- —
WDFN-8_2x2mm_P0.5mm
Package_DFN_QFN
DFN8 2x2, 0.5P; No exposed pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF)
- Pads
- 8
- SMD
- 2.8×2.5
- Boards
- —
WDFN-8-1EP_2x2.2mm_P0.5mm_EP0.80x0.54
Package_DFN_QFN
https://www.onsemi.com/pub/Collateral/511BN.PDF
- Pads
- 9
- SMD
- 2.5×2.7
- Boards
- —
WFDFPN-8-1EP_3x2mm_P0.5mm_EP1.25x1.35mm
Package_DFN_QFN
WFDFPN, 8 Pin (https://www.st.com/resource/en/datasheet/m95512-r.pdf#page=34)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- —
CERDIP-14_W7.62mm_SideBrazed_Socket
Package_DIP
14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 14
- THT
- 10.7×19.7
- Boards
- —
CERDIP-16_W7.62mm_SideBrazed_LongPads_Socket
Package_DIP
16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 16
- THT
- 10.7×20.9
- Boards
- —